Part | RoHS | Manufacturer | Diode Type | Terminal Position | Terminal Form | No. of Terminals | Surface Mount | Package Shape | Package Body Material | Diode Resistive Test Current | Config | Frequency Band | Maximum Forward Voltage (VF) | Maximum Diode Capacitance | Technology | Maximum Reverse Current | No. of Elements | Reverse Test Voltage | Package Style (Meter) | Sub-Category | Maximum Repetitive Peak Reverse Voltage | Maximum Operating Temperature | Application | Minimum Operating Temperature | Terminal Finish | JESD-30 Code | Maximum Diode Forward Resistance | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Maximum Power Dissipation | Nominal Diode Capacitance | Additional Features | Nominal Minority Carrier Lifetime | JEDEC-95 Code | Minimum Breakdown Voltage | Maximum Non Repetitive Peak Forward Current | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Diode Element Material | Diode Resistive Test Frequency | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.87 V |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
125 Cel |
SWITCHING |
-55 Cel |
MATTE TIN |
R-XBCC-N4 |
2.3 ohm |
Not Qualified |
.25 W |
.75 us |
80 V |
e3 |
SILICON |
||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.3 ohm |
.15 W |
.75 us |
80 V |
SILICON |
||||||||||||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
.02 mA |
SINGLE |
.75 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
1.5 ohm |
Not Qualified |
.5 W |
.5 pF |
HIGH RELIABILITY |
.65 us |
150 V |
e3 |
SILICON |
100 MHz |
||||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
SINGLE |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
5 ohm |
Not Qualified |
.5 W |
.2 pF |
HIGH RELIABILITY |
.8 us |
200 V |
e3 |
SILICON |
ESA-SCC-5513/030 |
|||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
1 mA |
SINGLE |
L BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.5 ohm |
1 |
Not Qualified |
.25 W |
.25 pF |
LOW DISTORTION |
.5 us |
80 V |
SILICON |
100 MHz |
|||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
2 |
CHIP CARRIER |
SWITCHING |
R-XBCC-N4 |
2.5 ohm |
Not Qualified |
.25 W |
LOW DISTORTION |
.5 us |
80 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
||||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.87 V |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
125 Cel |
SWITCHING |
-55 Cel |
R-XBCC-N4 |
2.3 ohm |
Not Qualified |
.25 W |
.75 us |
80 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
2 |
CHIP CARRIER |
SWITCHING |
MATTE TIN |
R-XBCC-N4 |
2.5 ohm |
Not Qualified |
.25 W |
LOW DISTORTION |
.5 us |
80 V |
e3 |
SILICON |
||||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
125 Cel |
SWITCHING |
-55 Cel |
GOLD |
R-XBCC-N2 |
2.3 ohm |
1 |
.15 W |
.75 us |
80 V |
e4 |
SILICON |
|||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.87 V |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
Rectifier Diodes |
80 V |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.3 ohm |
Not Qualified |
.15 W |
.75 us |
80 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
|||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.9 V |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
125 Cel |
SWITCHING |
-55 Cel |
MATTE TIN |
R-XBCC-N4 |
2.5 ohm |
Not Qualified |
.25 W |
LOW DISTORTION |
.5 us |
80 V |
e3 |
SILICON |
|||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.9 V |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
125 Cel |
SWITCHING |
-55 Cel |
R-XBCC-N4 |
2.5 ohm |
Not Qualified |
.25 W |
LOW DISTORTION |
.5 us |
80 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
.02 mA |
SINGLE |
.75 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
1.5 ohm |
Not Qualified |
.5 W |
.5 pF |
HIGH RELIABILITY |
.65 us |
150 V |
e3 |
SILICON |
100 MHz |
ESA-SCC-5513/030 |
|||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.87 V |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
150 Cel |
SWITCHING |
-55 Cel |
R-XBCC-N4 |
2.3 ohm |
1 |
Not Qualified |
.25 W |
.75 us |
80 V |
SILICON |
||||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
1 mA |
SINGLE |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
5 ohm |
Not Qualified |
.5 W |
.2 pF |
HIGH RELIABILITY |
.8 us |
200 V |
e3 |
SILICON |
100 MHz |
ESA-SCC-5513/030 |
|||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
MATTE TIN |
R-XBCC-N2 |
2.3 ohm |
Not Qualified |
.25 W |
.75 us |
80 V |
e3 |
SILICON |
|||||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
125 Cel |
SWITCHING |
-55 Cel |
GOLD |
R-XBCC-N2 |
2.3 ohm |
1 |
.25 W |
.75 us |
80 V |
e4 |
SILICON |
|||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N2 |
1.5 ohm |
1 |
Not Qualified |
.25 W |
.25 pF |
LOW DISTORTION |
.8 us |
80 V |
SILICON |
100 MHz |
|||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
R-XBCC-N2 |
1.5 ohm |
Not Qualified |
.25 W |
.25 pF |
LOW DISTORTION |
.8 us |
80 V |
SILICON |
100 MHz |
|||||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
.02 mA |
SINGLE |
.75 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
1.5 ohm |
Not Qualified |
.5 W |
.5 pF |
HIGH RELIABILITY |
.65 us |
150 V |
e3 |
SILICON |
100 MHz |
||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
1 mA |
SINGLE |
L BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
5 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
MATTE TIN |
R-XBCC-N2 |
2.5 ohm |
Not Qualified |
.25 W |
.25 pF |
LOW DISTORTION |
.5 us |
80 V |
e3 |
SILICON |
100 MHz |
||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
.02 mA |
SINGLE |
.75 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
1.5 ohm |
Not Qualified |
.5 W |
.5 pF |
HIGH RELIABILITY |
.65 us |
150 V |
e3 |
SILICON |
100 MHz |
||||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
L BAND |
.87 V |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.05 uA |
2 |
60 V |
CHIP CARRIER |
Other Diodes |
80 V |
150 Cel |
SWITCHING |
-55 Cel |
R-XBCC-N4 |
2.3 ohm |
1 |
Not Qualified |
.25 W |
.75 us |
80 V |
SILICON |
||||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
125 Cel |
SWITCHING |
-55 Cel |
R-XBCC-N2 |
2.3 ohm |
.25 W |
.75 us |
80 V |
SILICON |
|||||||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
GOLD |
R-XBCC-N2 |
2.5 ohm |
1 |
.25 W |
LOW DISTORTION |
.5 us |
80 V |
e4 |
SILICON |
|||||||||||||||||
Infineon Technologies |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
CERAMIC, METAL-SEALED COFIRED |
1 mA |
SINGLE |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
MATTE TIN |
O-CEMW-N2 |
5 ohm |
Not Qualified |
.5 W |
.2 pF |
HIGH RELIABILITY |
.8 us |
200 V |
e3 |
SILICON |
100 MHz |
ESA-SCC-5513/030 |
|||||||||||||
Infineon Technologies |
PIN DIODE |
DUAL |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
ULTRA HIGH FREQUENCY |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
SMALL OUTLINE |
PIN Diodes |
125 Cel |
SWITCHING |
R-XDSO-N2 |
1.5 ohm |
Not Qualified |
.15 W |
250000 pF |
.5 us |
50 V |
SILICON |
100 MHz |
||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
L BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.3 ohm |
.25 W |
.75 us |
80 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
|||||||||||||||||||
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
1 mA |
SINGLE |
MEDIUM FREQUENCY TO C BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
20 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
ATTENUATOR; SWITCHING |
R-XBCC-N2 |
1.35 ohm |
Not Qualified |
.25 W |
.23 pF |
LOW DISTORTION |
1.55 us |
150 V |
SILICON |
100 MHz |
|||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
SEPARATE, 2 ELEMENTS |
S BAND |
1.2 V |
.3 pF |
POSITIVE-INTRINSIC-NEGATIVE |
.01 uA |
2 |
35 V |
CHIP CARRIER |
Other Diodes |
50 V |
150 Cel |
SWITCHING |
-55 Cel |
MATTE TIN |
R-XBCC-N4 |
2 ohm |
Not Qualified |
.25 W |
.075 us |
50 V |
e3 |
SILICON |
||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
5 mA |
SINGLE |
.9 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
MATTE TIN |
R-XBCC-N2 |
.9 ohm |
Not Qualified |
.25 W |
.5 pF |
.08 us |
30 V |
e3 |
SILICON |
100 MHz |
||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
S BAND |
.3 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
GOLD |
R-XBCC-N2 |
2 ohm |
1 |
Not Qualified |
.25 W |
.3 pF |
.075 us |
50 V |
e4 |
SILICON |
|||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
1 mA |
SINGLE |
MEDIUM FREQUENCY TO C BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
ATTENUATOR; SWITCHING |
-55 Cel |
R-XBCC-N2 |
1.35 ohm |
Not Qualified |
.25 W |
.13 pF |
LOW DISTORTION |
1.55 us |
150 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
100 MHz |
|||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
S BAND |
.3 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
GOLD |
R-XBCC-N2 |
2 ohm |
1 |
.25 W |
.075 us |
50 V |
e4 |
SILICON |
||||||||||||||||||
|
Infineon Technologies |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
MEDIUM FREQUENCY TO C BAND |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
125 Cel |
ATTENUATOR; SWITCHING |
-55 Cel |
GOLD |
R-XBCC-N2 |
1.35 ohm |
1 |
.25 W |
LOW DISTORTION |
1.55 us |
150 V |
e4 |
SILICON |
||||||||||||||||
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SEPARATE, 2 ELEMENTS |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
2 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N4 |
1.5 ohm |
Not Qualified |
.21 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||||
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.2 ohm |
20 V |
SILICON |
||||||||||||||||||||||||
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
4 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SEPARATE, 2 ELEMENTS |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
2 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N4 |
1.5 ohm |
Not Qualified |
.21 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||||
|
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N2 |
1.5 ohm |
Not Qualified |
.3 pF |
30 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
100 MHz |
|||||||||||||||
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
1 mA |
SINGLE |
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
.42 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N2 |
2.2 ohm |
Not Qualified |
.32 pF |
20 V |
SILICON |
100 MHz |
||||||||||||||||||
|
Toshiba |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
SWITCHING |
R-XBCC-N2 |
1.5 ohm |
Not Qualified |
.21 pF |
30 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
100 MHz |
|||||||||||||||
|
Renesas Electronics |
PIN DIODE |
BOTTOM |
NO LEAD |
12 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SEPARATE, 6 ELEMENTS |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
6 |
1 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
R-XBCC-N12 |
1.3 ohm |
Not Qualified |
.2 W |
.35 pF |
30 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
100 MHz |
|||||||||||||||
Renesas Electronics |
PIN DIODE |
DUAL |
NO LEAD |
2 |
YES |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
SMALL OUTLINE |
125 Cel |
SWITCHING |
R-PDSO-N2 |
2 ohm |
Not Qualified |
.1 W |
SILICON |
||||||||||||||||||||||||
Renesas Electronics |
PIN DIODE |
BOTTOM |
NO LEAD |
8 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
1SE4 |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
4 |
1 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
R-XBCC-N8 |
1.3 ohm |
Not Qualified |
.2 W |
.35 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||||
Renesas Electronics |
PIN DIODE |
BOTTOM |
NO LEAD |
8 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
1SE4 |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
4 |
1 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
R-XBCC-N8 |
1.3 ohm |
Not Qualified |
.2 W |
.35 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||||
|
Renesas Electronics |
PIN DIODE |
DUAL |
NO LEAD |
2 |
YES |
RECTANGULAR |
PLASTIC/EPOXY |
10 mA |
SINGLE |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
1 V |
SMALL OUTLINE |
PIN Diodes |
125 Cel |
SWITCHING |
R-PDSO-N2 |
1.3 ohm |
1 |
Not Qualified |
.1 W |
.35 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||
Renesas Electronics |
PIN DIODE |
BOTTOM |
NO LEAD |
8 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
1SE4 |
.35 pF |
POSITIVE-INTRINSIC-NEGATIVE |
4 |
1 V |
CHIP CARRIER |
PIN Diodes |
125 Cel |
SWITCHING |
R-XBCC-N8 |
1.3 ohm |
Not Qualified |
.2 W |
.35 pF |
30 V |
SILICON |
100 MHz |
||||||||||||||||||
Renesas Electronics |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE |
.31 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
125 Cel |
SWITCHING |
R-PBCC-N2 |
1.5 ohm |
Not Qualified |
.1 W |
SILICON |
PIN diodes are electronic components that are used in microwave and radio frequency applications as switches or attenuators. They are named after their structure, which consists of a P-type layer, an intrinsic layer, and an N-type layer.
PIN diodes operate based on the properties of their intrinsic layer, which has a low doping density, making it highly resistive. When a forward-bias voltage is applied to the diode, the intrinsic layer becomes less resistive, allowing current to flow through the diode. When a reverse-bias voltage is applied to the diode, the intrinsic layer becomes highly resistive, acting as an open switch or attenuator for microwave and radio frequency signals.
PIN diodes offer several advantages over other types of switches and attenuators, such as low insertion loss, high isolation, and fast switching speed. They can be used in various applications, such as radio frequency amplifiers, attenuators, switches, and phase shifters.
PIN diodes come in different package sizes and configurations, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.