SQUARE Other Function Interface ICs 1,418

Reset All

Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4301LIMS8#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304CDD#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13035EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2 mm	Not Qualified		e1	30	260	2 mm
MAX13000EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX3376EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX7300AG	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.4 mm	125 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N40		.8 mm	5 mm	Not Qualified		e0			5 mm
MAX3022EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX4895EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS	3.3 V	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V		2 V	.5 mm	85 Cel	5 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3735ETG-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3736ETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX14595ETA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		SMALL OUTLINE, VERY THIN PROFILE		1.65 V		.9 V	.5 mm	85 Cel	3 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	1	.8 mm	2 mm			e4	30	260	2 mm
MAX13014EBL+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.2 V		1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e1	30	260	1.52 mm
MAX13042EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13036ATI+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX3018EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3738ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX7370EWA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25	1	.69 mm	2.09 mm	Not Qualified					2.09 mm
MAX13001EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13033EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.2 V	Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX13034EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.2 V	Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX14591ETA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		SMALL OUTLINE, VERY THIN PROFILE	SOCC8,.2,20	1.65 V		.9 V	.5 mm	85 Cel	3 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	1	.8 mm	2 mm			e4	30	260	2 mm
MAX3390EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX6618AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13030EETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.2 V	Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX13030EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	2.2 V	Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3738ETG+GD0	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3003ETP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified					5 mm
MAX3643ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3375EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX253EUA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				4.5 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX7306AUB+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3373EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3014EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3016EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3643ETG+TG1N	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
MAX1841EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.4 V		1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3600BCTL+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3 V		3.3	CHIP CARRIER	LCC40,.2SQ,16		Display Drivers		.4 mm	70 Cel		0 Cel		QUAD	S-PQCC-N40				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX3392EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3002ETP+	Analog Devices		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS			1.8/5	CHIP CARRIER	LCC20,.20SQ,25		Other Interface ICs		.635 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N20	1			Not Qualified		e3	30	260
MAX7304ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.62 V	.4 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm
MAX3021EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3600GCTL+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3 V		3.3	CHIP CARRIER	LCC40,.2SQ,16		Display Drivers		.4 mm	70 Cel		0 Cel		QUAD	S-PQCC-N40				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX3001EETP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified					5 mm
MAX3378EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14839GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3600RCTL+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3 V		3.3	CHIP CARRIER	LCC40,.2SQ,16		Display Drivers		.4 mm	70 Cel		0 Cel		QUAD	S-PQCC-N40				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX7370ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.