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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3397EELA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			1.8 V	5.5 V	1.8/5	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.08,20		1.65 V		Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N8	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX31722MUA+	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.7 V	1				3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						1.7 V	.65 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3643ETG	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0		245	4 mm
MAX13015EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.2 V		Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3020EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3735ETG	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3002ETP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS				5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			1.65 V			1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm			e3	30	260	5 mm
MAX13004EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20				Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX20091ATM/V+	Analog Devices		AUTOMOTIVE	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY		YES			BICMOS	AEC-Q100		14 V		14	CHIP CARRIER	LCC48,.27SQ,20				Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N48	1			Not Qualified		e3	30	260
MAX6621AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX7233BFIQH-TR	Analog Devices		OTHER	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		4-CHARACTER	5 V		5	CHIP CARRIER	LDCC44,.7SQ	24		3-BP	Other Interface ICs		1.27 mm	85 Cel		-20 Cel	TIN LEAD	QUAD	S-PQCC-J44				Not Qualified		e0
MAX3740ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V			CHIP CARRIER, VERY THIN PROFILE						2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3			4 mm
MAX3391EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	4	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX7301AGL-T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	CMOS			3.3 V			CHIP CARRIER, VERY THIN PROFILE						2.5 V	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N40	3	.85 mm	6 mm	Not Qualified		e0			6 mm
MAX13002EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20				Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13017EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.2 V		Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX1740EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.25 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX1841EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.4 V			1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX7306ALB+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VSON	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,16				Display Drivers	1.62 V	.4 mm	125 Cel		-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N10	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX3783UCM+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX13016EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.2 V		Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3646ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX1741EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3643ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX13003EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20				Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX14834ETB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						4.75 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3286CHJ+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			FLATPACK, THIN PROFILE, FINE PITCH						3 V	.5 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e3			5 mm
MAX3019EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3393EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	4	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX6956AGL	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	VQCCN	SQUARE	UNSPECIFIED	SEGMENT	YES	5.5 V	1	CMOS		7-DIGIT	3.3 V		3/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.24SQ,20	7			Display Drivers	2.5 V	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N40		.85 mm	6 mm	Not Qualified	COMMON-ANODE	e0			6 mm
MAX14838GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						7 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3379EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	4	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13044EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		2.2 V		Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX7306ALB+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VSON	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,16				Display Drivers	1.62 V	.4 mm	125 Cel		-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N10	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX3015EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX1840EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		1.4 V		Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6621AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13036ATI+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
DS28E17Q+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	CMOS			3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.45 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm			e3	40	260	4 mm
MAX6618AUB+TG126	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX20091ATM/V+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1	BICMOS			14 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						7.5 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm			e3	30	260	7 mm
MAX4895EETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			3.3 V	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			4.5 V			2 V	.5 mm	85 Cel	5 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3967ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3			4 mm
MAX6956ATL+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	VQCCN	SQUARE	UNSPECIFIED	SEGMENT	YES	5.5 V	1	CMOS		7-DIGIT	3.3 V		3/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.24SQ,20	7			Display Drivers	2.5 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified	COMMON-ANODE	e3	30	260	6 mm
MAX3374EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14839GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX7306AUB+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13045EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		2.2 V		Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.