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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

935260371551

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

Not Qualified

5 mm

PCF8534AHL/1,518

NXP Semiconductors

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.02 mA

2/5,3/6

FLATPACK

QFP80,.55SQ,20

60

4-BP

Other Interface ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

Not Qualified

PCZ33742EPR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

1

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

935263836118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

FLATPACK, LOW PROFILE, FINE PITCH

4.5 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

Not Qualified

5 mm

PR5331C3HN/C350,51

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

40

HQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

2.5 V

85 Cel

-30 Cel

QUAD

S-PQCC-N40

PTN5110NDHQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

935263842026

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

DIE

SQUARE

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

S-XUUC-N40

Not Qualified

PTN3300AHF2-T

NXP Semiconductors

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

CHIP CARRIER

LCC48,.27SQ,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N48

Not Qualified

PTN5110THQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

TZA3031BHL/C4

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

FLATPACK, LOW PROFILE, FINE PITCH

4.5 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

Not Qualified

5 mm

TZA3001U/C4

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

DIE

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

UNCASED CHIP

4.5 V

85 Cel

-40 Cel

UPPER

S-XUUC-N40

2 mm

Not Qualified

2 mm

TZA3011AVH

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

32

HVBCC

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

BICMOS

3.3 V

3.47 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3.14 V

Display Drivers

3.14 V

.5 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B32

.8 mm

5 mm

Not Qualified

e4

5 mm

TZA3011BVH

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

32

HVBCC

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

BICMOS

3.3 V

3.47 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3.14 V

Display Drivers

3.14 V

.5 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B32

.8 mm

5 mm

Not Qualified

e4

5 mm

IP4853CX24/LF/P,13

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

MC34827A1EP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

IP4853CX24,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

MC33SA0528AC

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

1

5 V

FLATPACK, LOW PROFILE

4.8 V

.8 mm

125 Cel

-40 Cel

TIN

QUAD

S-PQFP-G32

3

1.6 mm

7 mm

e3

30

250

7 mm

MC34825EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

2.7 V

.4 mm

85 Cel

3 V

-40 Cel

QUAD

S-XQCC-N20

3

.6 mm

3 mm

Not Qualified

40

260

3 mm

MC34827A1EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

3

.6 mm

3 mm

Not Qualified

40

260

3 mm

IP4855CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

935293912151

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

IP4853CX24/LF/T3

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

935293912115

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

935302531551

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

1 mm

6 mm

e4

30

260

6 mm

935302531518

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

IP4855CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4855CX25,14

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

MC33SB0400ESR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

MOS

5 V

CHIP CARRIER, HEAT SINK/SLUG

4.75 V

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

e3

40

260

MC33SA0528ACR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

1

5 V

FLATPACK, LOW PROFILE

4.8 V

.8 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G32

3

1.6 mm

7 mm

30

250

7 mm

MC33SB0401ES

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

20 V

1

SMARTMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48(UNSPEC)

6 V

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

e3

40

260

MC33789AE

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

7/18

FLATPACK

QFP64,.47SQ,20

Other Interface ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

MC33SB0400ES

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

MOS

5 V

CHIP CARRIER, HEAT SINK/SLUG

4.75 V

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

e3

40

260

MC33789AER2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

7/18

FLATPACK

QFP64,.47SQ,20

Other Interface ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

MC34825EP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

2.7 V

.4 mm

85 Cel

3 V

-40 Cel

QUAD

S-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

935318481557

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

20 V

1

SMARTMOS

14 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

6 V

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

40

260

7 mm

935302505118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

2.3 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V

e4

3 mm

IP4856CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

MC34978AESR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

ISP1105BS,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

4 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1 mm

3 mm

Not Qualified

ALSO REQUIRED NOM REGULATED SUPPLY VOLTAGE IS 3.3 V

3 mm

MC33978AES

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

IP4853CX24/P,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4855CX25/P

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

2.04 mm

IP4856CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

PCA9512BDP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

2.7 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

3 mm

GTL2002GM-G

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

QCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

MOS

CHIP CARRIER

LCC8,.06SQ,20

0 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N8

.5 mm

1.6 mm

1.6 mm

PCA9617ADPJ,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

.95 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.8 V

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

ALSO OPERATES WITH 2.2 V TO 5.5 V

e4

3 mm

PCA9306GM-G

NXP Semiconductors

INDUSTRIAL

NO LEAD

8

QCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER

LCC8,.06SQ,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N8

Not Qualified

PCA9519BS,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1/4,3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Line Driver or Receivers

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.