SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9513DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified				260	3 mm
PCA9511DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified				260	3 mm
MFRC52202HN1/TRAYB	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
MFRC52201HN1/TRAYB	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
PCA9513ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9846BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.8 V	.65 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		1 mm	4 mm						4 mm
PCA9701BS	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.4 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N24		1 mm	3 mm	Not Qualified					3 mm
PCA9514DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
TJA1086HN	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		AEC-Q100			4.85 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				4.45 V	.65 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N44		1 mm	9 mm		ALSO REQUIRED VBAT = 4.75V TO 60V				9 mm
PCA9614DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V		2.3 V	.5 mm	85 Cel	5 V	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm						3 mm
PCA9512DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9510DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified				260	3 mm
PCA9525DP	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
GTL2002DP/Q900	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		AEC-Q100				5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	Also required VDREF 0 to 5.5V	e4			3 mm
PCA9522DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR				3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
GTL2010BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	UNSPECIFIED	YES	2.64 V	10					2.5 V	3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		3 V		2.36 V	.5 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-XDSO-N24	1	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
PCA9510ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9306GM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES		2					1.8 V			CHIP CARRIER	LCC8,.06SQ,20		Other Interface ICs	1 V	.55 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified		e4	30	260	1.6 mm
PCA9514DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified				260	3 mm
PCA9522DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BIPOLAR				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm						3 mm
MFRC52202HN1/TRAYBM	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
PCA9574HR	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.1 V	.8 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		.5 mm	2 mm	Not Qualified					2 mm
PCA9510ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
PCA9519BS-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e4			4 mm
PCA9849BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC	YES	3.6 V	1			GENERAL PURPOSE		1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.16X16			.8 V	.65 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N12		1 mm	4 mm		ALSO OPERATES WITH 1.65 TO 3.6 VOLT				4 mm
PCA9615DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3 V		2.3 V	.5 mm	85 Cel	5 V	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm		ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V				3 mm
MFRC52201HN1/TRAYBM	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
PCA9614DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V		2.3 V	.5 mm	85 Cel	5 V	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm					260	3 mm
PCA9512ADP,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V		2.7 V	.65 mm	85 Cel	3.3 V	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm						3 mm
TJA1085HN	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		AEC-Q100			4.85 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				4.45 V	.65 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N44		1 mm	9 mm		ALSO REQUIRED VBAT = 4.75V TO 60V				9 mm
PCA9510DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
PCA9519BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e4			4 mm
PCA9521DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm						3 mm
PCA9511DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9846BSJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.8 V	.65 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		1 mm	4 mm						4 mm
PCA9509PDP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1.5 V	1	CMOS				1.1 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.3 V		.8 V	.65 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e4	30	260	3 mm
PCA9521DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR				5 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
GTL2012DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9570DPJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.2 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.1 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm					260	3 mm
PCA9513DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9570DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.2 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.1 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm						3 mm
PCA9605DP	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9574BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9512BDP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			30	260	3 mm
PCA9514ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9849BSJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC	YES	3.6 V	1			GENERAL PURPOSE		1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.16X16			.8 V	.65 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N12		1 mm	4 mm		ALSO OPERATES WITH 1.65 TO 3.6 VOLT				4 mm
PCA9701HF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N24	1	.8 mm	4 mm	Not Qualified		e4	30	260	4 mm
PCA9512DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified					3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.