Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
SMALL OUTLINE |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
SMALL OUTLINE |
4.5 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
3 V |
.64 mm |
105 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.75 mm |
3.91 mm |
e3 |
30 |
260 |
8.66 mm |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
e3 |
2.9 mm |
|||||||||||||||||||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T20 |
4.19 mm |
7.62 mm |
Not Qualified |
e0 |
25.91 mm |
|||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
1 |
4.45 mm |
7.62 mm |
Not Qualified |
e3 |
260 |
26.162 mm |
||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP32,.4 |
Other Interface ICs |
4.5 V |
1.27 mm |
100 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
2.54 mm |
7.5184 mm |
Not Qualified |
260 |
20.7772 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1.8 V |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
1.65 V |
1.1 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
GOLD NICKEL |
DUAL |
R-PDSO-N6 |
1 |
.8 mm |
1 mm |
e4 |
30 |
260 |
1.5 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
7.3 mA |
5 V |
2.5/15 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.5 V |
1.27 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.625 mm |
1.37 mm |
IT ALSO HAS 1.1 TO 3.6V SUPPLY VOLTAGE |
NOT SPECIFIED |
NOT SPECIFIED |
1.87 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
.0009 mA |
2.5 V |
2.5/3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
Other Interface ICs |
2.3 V |
.35 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-N6 |
1 |
.4 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1 mm |
||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
36 V |
1 |
CMOS |
CHIP CARRIER |
LCC24,.16SQ,20 |
8 V |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N24 |
1 |
.9 mm |
4 mm |
e3 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
GENERAL PURPOSE |
3.3 V |
SMALL OUTLINE |
SOP8,.24 |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e3 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
1.5 V |
5.5 V |
2/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
1.8 V |
Other Interface ICs |
1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N8 |
1 |
.55 mm |
1.6 mm |
Not Qualified |
ALSO REQUIRED 1.8V TO 5.5V SUPPLY ON B SIDE |
e4 |
30 |
260 |
1.6 mm |
|||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
0 V |
0 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
Also required VDREF 0 to 5.5V |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
0 V |
0 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
Also required VDREF 0 to 5.5V |
e4 |
3 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
5 mm |
||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
0 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.1 mm |
4.4 mm |
Not Qualified |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Other Interface ICs |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
4.572 mm |
8.94 mm |
Not Qualified |
e3 |
260 |
8.94 mm |
||||||||||||||||||||||||||||
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e0 |
6 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 mA |
3.3 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
2.5 V |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.3 V |
Line Driver or Receivers |
2.3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
2 |
.04 mA |
1.2 V |
3.6 V |
1.2/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
1.1 V |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
1.2 V |
PUSH-PULL |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.5 mm |
1.17 mm |
Not Qualified |
e1 |
30 |
260 |
1.57 mm |
|||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
15 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
8 |
5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-N15 |
1 |
.8 mm |
2.5 mm |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
.008 mA |
1.5 V |
5.5 V |
1.2/3.6,1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
1.8 V |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G6 |
1 |
1.1 mm |
1.25 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.8 V |
5.5 V |
1.2/5,1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.65 V |
Other Interface ICs |
1.15 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
260 |
6.5 mm |
|||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
EIA-232; EIA-422; EIA-485 |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
240 |
10.3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
1 |
2 |
2.5 V |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
3 V |
2.375 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
3 |
.8 mm |
4 mm |
ALSO OPERATES WITH 3V TO 3.6V |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2.625 V |
1 |
8 |
BICMOS |
2.5 V |
2.5,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC54,.2X.4,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
.8 mm |
5.5 mm |
Not Qualified |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
1.5/3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
DUAL |
R-PDSO-N6 |
1 |
.55 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1.45 mm |
||||||||||||||||||||||||||||
|
Broadcom |
DIGITAL ISOLATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
GENERAL PURPOSE |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
3 V |
1.27 mm |
100 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.8 mm |
3.9 mm |
Not Qualified |
ALSO OPERATED AT 5V SUPPLY |
e3 |
260 |
9.9 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
34 V |
4 |
CMOS |
SPI |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC38,.2X.28,20 |
8 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N38 |
.8 mm |
5 mm |
SEATED HT-CALCULATED |
e3 |
7 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,18 |
3.15 V |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP32,.4 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
Not Qualified |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.1 V |
CHIP CARRIER, VERY THIN PROFILE |
.8 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
S-PBCC-B8 |
1 |
.5 mm |
1.6 mm |
e4 |
1.6 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.1 V |
CHIP CARRIER, VERY THIN PROFILE |
.8 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBCC-B8 |
1 |
.5 mm |
1.6 mm |
30 |
260 |
1.6 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
3/3.3 |
SMALL OUTLINE |
SOP8,.25 |
Line Driver or Receivers |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
3/3.3 |
SMALL OUTLINE |
SOP8,.25 |
Line Driver or Receivers |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
Line Driver or Receivers |
3 V |
.55 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N8 |
1 |
.5 mm |
1.6 mm |
Not Qualified |
e4 |
30 |
260 |
1.6 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.