INDUSTRIAL Other Function Interface ICs 2,400+

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

ADN2531ACPZ-R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.9 mm

3 mm

Not Qualified

e3

3 mm

CCE4510_QFN24

Dialog Semiconductor

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

32 V

1

HVCMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

GTL2012DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

LTC4316IMS#TRPBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

10

SON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

2.25 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N10

1

1.1 mm

3 mm

e3

260

3 mm

LTM2887IY-3I#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

M74HC4543B1

Sgs-ates Componenti Electronici S P A

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

NO

CMOS

2/6

IN-LINE

DIP16,.3

7

0-BP

Other Interface ICs

2.54 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

PCA9515ADRG4

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

BICMOS

3 V

2.5/3.3

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.3 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9616PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.8 V

.65 mm

85 Cel

5 V

-40 Cel

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

30

260

5 mm

SN74AUP1T98DSFR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1

.0009 mA

2.5 V

2.5/3.3

SMALL OUTLINE, VERY THIN PROFILE

Other Interface ICs

2.3 V

.35 mm

85 Cel

PUSH-PULL

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

S-PDSO-N6

1

.4 mm

1 mm

Not Qualified

e4

NOT SPECIFIED

260

1 mm

ADUM1233BRWZ-RL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

CMOS

5 V

5,15

SMALL OUTLINE

SOP16,.4

MOSFET Drivers

4.5 V

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

ADUM2251ARIZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

5 V

SMALL OUTLINE

3 V

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

2.64 mm

7.5 mm

ALSO REQUIRED SUPPLY VOLTAGE OF 3V TO 5.5V FOR PORTB

e3

260

12.75 mm

ADUM4401BRWZ-RL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3 V

SMALL OUTLINE

2.7 V

1.27 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

e3

30

260

10.3 mm

ADUM7641CRQZ-RL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

SMALL OUTLINE, SHRINK PITCH

3 V

3 V

.64 mm

105 Cel

3.3 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.75 mm

3.91 mm

e3

30

260

8.66 mm

FPC402RHUT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N56

2

.8 mm

5 mm

e3

30

260

11 mm

GTL2003PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

2.64 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.36 V

3 V

.65 mm

85 Cel

2.5 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

GTL2003PW,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

2.64 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

2.36 V

Other Interface ICs

3 V

.65 mm

85 Cel

2.5 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

MAX13003EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

245

5 mm

MAX13003EEUE+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.2 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX13003EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX13003EEUE+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

1.2 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

1.5 V

Other Interface ICs

.9 V

.65 mm

85 Cel

1.65 V

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX13005EEBE+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

2.02 mm

MAX13005EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

245

2.02 mm

MAX13032EETE+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.2 V

Other Interface ICs

1.62 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX13032EETE+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.2 V

Other Interface ICs

1.62 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3373EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX3397EELA+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

SQUARE

UNSPECIFIED

YES

5.5 V

1

BICMOS

1.8 V

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

1.65 V

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

GOLD NICKEL

DUAL

S-XDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

MAX3668EHJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3668EHJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MC33797BPEW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

Other Interface ICs

.635 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

Not Qualified

e3

40

260

NVT4857UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

PCA9512ADP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.6 mA

3.3 V

5.5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

Other Interface ICs

2.7 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9574PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

2.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.1 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

TUSB321IRWBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, VERY THIN PROFILE

4.5 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TXB0101DBVT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1

.008 mA

1.5 V

5.5 V

1.2/3.6,1.8/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

1.65 V

Other Interface ICs

1.2 V

.95 mm

85 Cel

1.8 V

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

Not Qualified

e4

30

260

2.9 mm

TXB0101DBVTG4

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1

.008 mA

1.5 V

5.5 V

1.2/3.6,1.8/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

1.65 V

Other Interface ICs

1.2 V

.95 mm

85 Cel

1.8 V

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

Not Qualified

e4

30

260

2.9 mm

ADG3123BRUZ-REEL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.7 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Other Interface ICs

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.2 mm

4.4 mm

Not Qualified

e3

260

6.5 mm

ADN2531ACPZ-R2

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.9 mm

3 mm

Not Qualified

e3

3 mm

ADN2870ACPZ-RL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

3 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

260

4 mm

ADN8833ACBZ-R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.66 mm

2.54 mm

e1

30

260

2.54 mm

ADUM1201CR

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

CMOS

3 V

SMALL OUTLINE

SOP8,.25

2.7 V

1.27 mm

105 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

ALSO OPERATES AT 5V NOMINAL SUPPLY

e0

4.9 mm

ADUM2400ARIZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3 V

SMALL OUTLINE

SOP16,.4

2.7 V

1.27 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

2.64 mm

7.5 mm

e3

30

260

12.75 mm

ADUM2401CRIZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3 V

SMALL OUTLINE

SOP16,.4

2.7 V

1.27 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

2.64 mm

7.5 mm

e3

30

260

12.75 mm

ADUM3100ARZ-RL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

3 V

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

ADUM5202CRWZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE

3 V

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

ADUM5403WCRWZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

SOP16,.4

3 V

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

ADUM5403WCRWZRL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

3 V

1.27 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e3

260

10.3 mm

ADUM5412BRSZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

1

1.8 V

SMALL OUTLINE, SHRINK PITCH

1.7 V

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

3

2 mm

5.3 mm

ALSO OPERATE WITH 2.5V, 3.3V AND 5V SUPPLY VOLTAGE

e3

30

260

8.2 mm

ADUM5412BRSZ-RL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

1

1.8 V

SMALL OUTLINE, SHRINK PITCH

1.7 V

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

3

2 mm

5.3 mm

ALSO OPERATE WITH 2.5V, 3.3V AND 5V SUPPLY VOLTAGE

e3

30

260

8.2 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.