Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1.5 V |
1 |
CMOS |
1.1 V |
5.5 V |
CHIP CARRIER, VERY THIN PROFILE |
2.3 V |
.8 V |
.55 mm |
85 Cel |
3.3 V |
-40 Cel |
BOTTOM |
S-PBCC-B8 |
1 |
.5 mm |
1.6 mm |
30 |
260 |
1.6 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G20 |
2 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
24 V |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
6.5 V |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G38 |
3 |
1.2 mm |
4.4 mm |
ALSO HAVE 24V MAX INPUT VOLTAGE |
e4 |
30 |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
2 |
2 |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
IT ALSO OPERATES AT 5 V |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
2 |
2 |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
IT ALSO REQUIRES 5 V FOR NORMAL OPERATION |
e4 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1 mm |
2 mm |
Not Qualified |
e4 |
30 |
260 |
2.3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
2.3 V |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1 mm |
2 mm |
Not Qualified |
e4 |
2.3 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.6 mA |
3.3 V |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
2.7 V |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
3.3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
10 |
.005 mA |
3.3 V |
2.64 V |
2.5,3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.36 V |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
2.5 V |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
|||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
.008 mA |
1.5 V |
5.5 V |
1.2/3.6,1.8/5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
1.65 V |
Other Interface ICs |
1.2 V |
.95 mm |
85 Cel |
1.8 V |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
Not Qualified |
e4 |
30 |
260 |
2.9 mm |
||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.2 V |
1 |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
1.2/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N12 |
1 |
.55 mm |
1.7 mm |
Not Qualified |
e4 |
30 |
260 |
2 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
EIA-644-A; TIA-644-A |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,18 |
3.15 V |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||
|
M/a-com Technology Solutions |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
3 mm |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 mA |
3.6 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 mA |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
EIA-644; TIA-644 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Line Driver or Receivers |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3.3 V |
2.64 V |
2.5,3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.36 V |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
2.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
5.5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
2.3 V |
1.65 V |
.65 mm |
85 Cel |
2.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1.3 mm |
2.8 mm |
Not Qualified |
e4 |
2.95 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
5 V |
SMALL OUTLINE |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
ALSO REQUIRED SUPPLY VOLTAGE OF 3V TO 5.5V FOR PORTB |
e3 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
2.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BICMOS |
3 V |
2.5/3.3 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.3 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.9 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC18,.08SQ,16 |
1.7 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N18 |
.4 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
EIA-232; EIA-422; EIA-485 |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
e0 |
30 |
240 |
10.3 mm |
||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
EIA-232; EIA-422; EIA-485 |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
e0 |
10.3 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e3 |
260 |
12.8 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
3 V |
.64 mm |
105 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.75 mm |
3.91 mm |
e3 |
30 |
260 |
8.66 mm |
|||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.7 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1 |
.55 mm |
2.05 mm |
VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6 |
30 |
260 |
2.05 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 mA |
3.3 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
.0009 mA |
3.3 V |
1.2/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Other Interface ICs |
2.3 V |
.65 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G6 |
1 |
1.1 mm |
1.25 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
2 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
SMALL OUTLINE |
SOP16,.4 |
4.5 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
32 V |
1 |
HVCMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
7 mm |
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|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
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|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
2 |
1.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
e4 |
30 |
260 |
3.5 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.64 V |
1 |
2.5 V |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC8,.06SQ,20 |
3 V |
2.36 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N8 |
1 |
.5 mm |
1.6 mm |
Not Qualified |
ALSO OPERARTES AT 3.3V SUPPLY |
e4 |
30 |
260 |
1.6 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
4 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
Level Translators |
2.5 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
.5 mm |
2.04 mm |
Not Qualified |
2.04 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
9.375 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e3 |
30 |
260 |
9.375 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.9 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B20 |
.53 mm |
1.7 mm |
e2 |
30 |
260 |
2.1 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.