OTHER Other Function Interface ICs 272

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MFRC52202HN1,115	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20					2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
AY0438I/P	General Semiconductor		OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	NO			CMOS		5 V		5	IN-LINE	DIP40,.6	32		1-BP	Other Interface ICs		2.54 mm	85 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40				Not Qualified		e0
TFBS4711-TT1	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-25 Cel	Gold (Au) - with Nickel (Ni) barrier	SINGLE	R-XSMA-X6	4	2 mm	3 mm	Not Qualified		e4	NOT SPECIFIED	NOT SPECIFIED	6 mm
MFRC52201HN1,157	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
TFBS4711-TR1	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-25 Cel	Gold (Au) - with Nickel (Ni) barrier	SINGLE	R-XSMA-X6	4	2 mm	3 mm	Not Qualified		e4	10	260	6 mm
TFDU4101-TT3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	1 mm	85 Cel	5 V	-30 Cel	MATTE TIN	SINGLE	R-XSMA-X8	4	4.2 mm	4.7 mm	Not Qualified		e3	10	260	9.9 mm
MFRC52201HN1,151	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	85 Cel		-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
TFDU4101-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	1 mm	85 Cel	5 V	-30 Cel	MATTE TIN	SINGLE	R-XSMA-X8	4	4.2 mm	4.7 mm	Not Qualified		e3	10	260	9.9 mm
2744429	Phoenix Contact	INTERFACE CIRCUIT	OTHER	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED		NO	30 V	1	HYBRID		24 V			MICROELECTRONIC ASSEMBLY						18 V		70 Cel		-40 Cel		UNSPECIFIED	R-XXMA-X
CLT3-4BT6-TR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		4			24 V		24	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25				Bus Terminators		.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	3	1.2 mm	4.4 mm	Not Qualified		e4	40	260	6.5 mm
TFBS4711-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-25 Cel	Gold (Au) - with Nickel (Ni) barrier	SINGLE	R-XSMA-X6	4	2 mm	3 mm	Not Qualified		e4	20	260	6 mm
CLT3-4BT6	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		4			24 V		24	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25				Bus Terminators		.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	3	1.2 mm	4.4 mm	Not Qualified		e4	40	260	6.5 mm
LT4430ES6#TRMPBF	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	20 V	1			5 V			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH						3 V	.95 mm	125 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
ST8024LCTR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25					2.7 V	.65 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY	e3	30	260	9.7 mm
ASI4UE-G1-SR-7	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
AY0438I/L	General Semiconductor		OTHER	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		5 V		5	CHIP CARRIER	LDCC44,.7SQ	32		1-BP	Other Interface ICs		1.27 mm	85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				Not Qualified		e0
LT4430ES6#PBF	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	20 V	1			5 V			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH						3 V	.95 mm	125 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
ASI4UE-G1-SR	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
ST8024LCDR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1			3.3 V			SMALL OUTLINE	SOP28,.4					2.7 V	1.27 mm	85 Cel		-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY	e4	30	250	17.9 mm
LT4430ES6#TRPBF	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	20 V	1			5 V			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH						3 V	.95 mm	125 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
TOIM5232-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	CMOS		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-25 Cel		QUAD	S-XQCC-N20		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
TOIM4232-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS		3.3 V			SMALL OUTLINE						2.7 V	1.27 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	R-PDSO-G16	3	2.5 mm	7.4 mm	Not Qualified		e3			10.3 mm
TFDU4301-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-30 Cel		SINGLE	R-XSMA-X8		3.1 mm	2.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8.5 mm
NCN6001DTBR2G	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1			3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.7 V	.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
TFDU4301-TT3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-30 Cel	Matte Tin (Sn)	SINGLE	R-XSMA-X8	4	3.1 mm	2.5 mm	Not Qualified		e3	NOT SPECIFIED	NOT SPECIFIED	8.5 mm
HT1621D	Holtek Semiconductor		OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	NO			CMOS	.6 mA			3/5	IN-LINE	DIP28(UNSPEC)	32		4-BP	Other Interface ICs			70 Cel		-25 Cel		DUAL	R-PDIP-T28				Not Qualified
TOIM4232-TR1	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS		3.3 V			SMALL OUTLINE						2.7 V	1.27 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	R-PDSO-G16	3	2.7 mm	7.4 mm	Not Qualified		e3			10.3 mm
MAX3984UTE+	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
TFBS4711	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-25 Cel		SINGLE	R-XSMA-X6		2 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
TOIM4232	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS		3.3 V			SMALL OUTLINE						2.7 V	1.27 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	R-PDSO-G16	3	2.7 mm	7.4 mm	Not Qualified		e3		260	10.3 mm
ASI4UE-G1-ST	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
TFDU4301-TT1	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-30 Cel	MATTE TIN	SINGLE	R-XSMA-X8	4	3.1 mm	2.5 mm	Not Qualified		e3	10	260	8.5 mm
TFBS4650-TR4	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	NO LEAD	7	SMA	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1			3 V			MICROELECTRONIC ASSEMBLY						2.4 V	.95 mm	85 Cel		-30 Cel		SINGLE	R-XSMA-N7		1.8 mm	2.8 mm				NOT SPECIFIED	NOT SPECIFIED	6.8 mm
ST8024CTR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1			3.3 V	6.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			4 V			2.7 V	.65 mm	85 Cel	5 V	-25 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	ALSO REQUIRES A SUPPLY OF 3V TO 6.5V	e3	30	260	9.7 mm
MAX3984UTE+T	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
ST8024LTR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25					2.7 V	.65 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	3	1.2 mm	4.4 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY	e3	30	260	6.5 mm
AWM3303V	Honeywell Sensing And Control	INTERFACE CIRCUIT	OTHER		3			PLASTIC/EPOXY		NO					10 V		10		SIP3,.1TB				Other Interface ICs		2.54 mm	85 Cel		-25 Cel		SINGLE					Not Qualified
TFDU4301-TR1	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	5.5 V	1	CMOS		5 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	.95 mm	85 Cel	5 V	-30 Cel		SINGLE	R-XSMA-X8		3.1 mm	2.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8.5 mm
TFDU6103-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	1			3 V			MICROELECTRONIC ASSEMBLY						2.4 V	1 mm	85 Cel		-25 Cel	MATTE TIN	SINGLE	R-PSMA-X8	4	4.7 mm	4 mm			e3	10	260	9.9 mm
TFDU6103-TT3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	L BEND	8		RECTANGULAR	UNSPECIFIED		YES	5.5 V	1	CMOS		3.3 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	1 mm	85 Cel	3.3 V	-25 Cel	MATTE TIN	SINGLE	R-XSMA-L8	4	4.2 mm	4.7 mm	Not Qualified		e3	10	260	9.7 mm
ASI4UE-G1-MT	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
HSDL-3021-021	Broadcom	INTERFACE CIRCUIT	OTHER	NO LEAD	8		RECTANGULAR	UNSPECIFIED		NO	3.6 V	1	BICMOS		3 V			MICROELECTRONIC ASSEMBLY						2.4 V		85 Cel		-25 Cel		SINGLE	R-XSMA-N8	4			Not Qualified				255
RPM971-H14E3A	ROHM	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	3.6 V	1			3 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.7 V			2.4 V	.95 mm	85 Cel	3 V	-25 Cel		SINGLE	R-XSMA-X8		2.2 mm	2.9 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
ASI4UE-G1-MR	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
NCN6001DTBR2	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1			3 V			SMALL OUTLINE						2.7 V	.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified		e4		260	6.5 mm
PR5331C3HN/C360,518	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1			3.3 V			CHIP CARRIER, HEAT SINK/SLUG						2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40
TDA8024T	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1			3.3 V	6.5 V		SMALL OUTLINE			3 V			2.7 V	1.27 mm	85 Cel	5 V	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				260	17.9 mm
ADG3304BCBZ-REEL7	Analog Devices	INTERFACE CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	CMOS		1.8 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20		1.15 V		Other Interface ICs	1.65 V	.5 mm	85 Cel		-25 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.65 mm	1.61 mm	Not Qualified		e1		260	2.01 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.