OTHER Other Function Interface ICs 272

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

IP4853CX24,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

935293912151

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

IP4853CX24/LF/T3

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

935293912115

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

IP4853CX24/P,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

MFRC52202HN1/TRAYB

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC52201HN1/TRAYB

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

GTL2001DL

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE

3 V

.635 mm

85 Cel

0 Cel

DUAL

R-PDSO-G48

2.8 mm

7.5 mm

Not Qualified

15.875 mm

GTL2010PWDH

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

2.64 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.36 V

3 V

.65 mm

85 Cel

2.5 V

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G24

1

1.1 mm

4.4 mm

Not Qualified

e4

7.8 mm

GTL2000DB

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

2.64 V

SMALL OUTLINE, SHRINK PITCH

2.36 V

3 V

.635 mm

85 Cel

2.5 V

0 Cel

DUAL

R-PDSO-G48

2.8 mm

7.5 mm

Not Qualified

15.875 mm

MFRC52202HN1/TRAYBM

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC52201HN1/TRAYBM

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

IRM1030

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

7

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

BICMOS

MICROELECTRONIC ASSEMBLY

2.7 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-N7

Not Qualified

e0

IRMS6100

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.7 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

IRMT6100

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.7 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

IRM1010

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.7 V

85 Cel

-25 Cel

SINGLE

R-XSMA-N8

Not Qualified

IRMT6118

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5 V

1

BICMOS

2.7 V

9 V

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

SINGLE

R-XSMA-X8

Not Qualified

IRMT6115

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

BICMOS

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

IRMT6400

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

BICMOS

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.6 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

IRMS6118

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5 V

1

BICMOS

2.7 V

9 V

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

SINGLE

R-XSMA-X8

Not Qualified

IRM1020

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

SINGLE

R-XSMA-N8

Not Qualified

IRMS6400

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

BICMOS

5 V

9.5 V

MICROELECTRONIC ASSEMBLY

2.6 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

IRM5000

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

6

RECTANGULAR

UNSPECIFIED

NO

5 V

1

BICMOS

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

SINGLE

R-XSMA-N6

Not Qualified

IRMS6115

Infineon Technologies

INTERFACE CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

5.5 V

1

BICMOS

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

MEB0804

Infineon Technologies

OTHER

64

SEGMENT

YES

MOS

1 mA

3/15

TAB,64PINS,.02

35

10-BP

Other Interface ICs

.5 mm

85 Cel

-25 Cel

Not Qualified

IRM5000D

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

6

RECTANGULAR

UNSPECIFIED

NO

5 V

1

BICMOS

2.7 V

9 V

MICROELECTRONIC ASSEMBLY

2.4 V

85 Cel

-25 Cel

SINGLE

R-XSMA-N6

Not Qualified

TLE9278BQXV33

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

3 V

.5 mm

TIN

QUAD

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9278-3BQX

Infineon Technologies

OTHER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

3 V

.5 mm

TIN

QUAD

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9278-3BQXV33

Infineon Technologies

INTERFACE CIRCUIT

OTHER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

3 V

.5 mm

TIN

QUAD

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

MAX3975UBA-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,20

Display Drivers

2.97 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

1

.67 mm

2.54 mm

Not Qualified

e0

2.54 mm

MAX3803UBP-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

14

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

R-XBGA-B14

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3986UTU+

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

38

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

R-XQCC-N38

1

.8 mm

5 mm

e3

30

260

7 mm

MAX3786UTJ-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX6618AUB+TG11

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.5 mm

120 Cel

-20 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

e3

30

260

3 mm

MAX3783UCM-TD

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3781UCM

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

2

BIPOLAR

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3803UBP

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

14

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B14

1

.67 mm

2.03 mm

e0

2.54 mm

MAX3786UTJ+G069

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX3786UTJ+

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3982UTE

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3982UTE-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3786UTJ+T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3783UCM-D

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

1.2 mm

7 mm

Not Qualified

e0

20

240

7 mm

MAX3783UCM

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3786UTJ+TG069

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX3786UTJ

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3783UCM-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

T6K14

Toshiba

OTHER

252

PLASTIC/EPOXY

SEGMENT

YES

CMOS

3 V

3

TAB,252PINS

128

64-BP

Other Interface ICs

1.27 mm

70 Cel

-30 Cel

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.