OTHER Other Function Interface ICs 272

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Maximum Supply Current	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD260BND-4	Analog Devices	INTERFACE CIRCUIT	OTHER	THROUGH-HOLE	22	QIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.75 V	1				5 V	5.75 V		IN-LINE			4 V			4 V		85 Cel	5 V	-25 Cel		QUAD	R-PQIP-T22				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
AD260BND-0	Analog Devices	INTERFACE CIRCUIT	OTHER	THROUGH-HOLE	22	QIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.75 V	1				5 V	5.75 V		IN-LINE			4 V			4 V		85 Cel	5 V	-25 Cel		QUAD	R-PQIP-T22				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
AD260AND-2	Analog Devices	INTERFACE CIRCUIT	OTHER	THROUGH-HOLE	22	QIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.75 V	1				5 V	5.75 V		IN-LINE			4 V			4 V		85 Cel	5 V	-25 Cel		QUAD	R-PQIP-T22				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX6618AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6621AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX7233BFIQH-TR	Analog Devices		OTHER	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		4-CHARACTER	5 V		5	CHIP CARRIER	LDCC44,.7SQ	24		3-BP	Other Interface ICs		1.27 mm	85 Cel		-20 Cel	TIN LEAD	QUAD	S-PQCC-J44				Not Qualified		e0
MAX3783UCM+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX6621AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+TG126	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX3783UCM+D	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX3783UCM+TD	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e3	30	260	7 mm
A2SI-MT	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS						SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G28		1.99 mm	5.3 mm	Not Qualified					10.2 mm
LC7942KD	Onsemi		OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES			CMOS	.1 mA				3/5	FLATPACK	QFP80,.7X.9,32	0		64-BP	Other Interface ICs		.8 mm	85 Cel		-20 Cel		QUAD	R-PQFP-G80				Not Qualified
A2SI-SR	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS						SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G28		1.99 mm	5.3 mm	Not Qualified					10.2 mm
A2SI-ST	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS						SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G28		1.99 mm	5.3 mm	Not Qualified					10.2 mm
LC898122AXA-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	.45 mm	1.99 mm		IT ALSO OPERATES AT 3V	e1	30	260	2.59 mm
A2SI-MR	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1	CMOS						SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G28		1.99 mm	5.3 mm	Not Qualified					10.2 mm
LC898123AXC-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			2.8 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B35	1	.45 mm	2.3 mm		IT ALSO OPERATES AT 3V	e1	30	260	3.39 mm
NCN6001MUTWG	Onsemi	INTERFACE CIRCUIT	OTHER	BUTT	20	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH						2.7 V	.8 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B20		.6 mm	5 mm			e4			6 mm
NCN6001MUR2G	Onsemi	INTERFACE CIRCUIT	OTHER	BUTT	20	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3 V			CHIP CARRIER						2.7 V	.8 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B20		.6 mm	5 mm	Not Qualified		e4			6 mm
NCN6001DTB	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.7 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified					6.5 mm
LC75835W	Onsemi		OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS					3/3.3,3/5	FLATPACK	QFP48,.35SQ,20	34		3/4-BP	Other Interface ICs		.5 mm	70 Cel		-30 Cel		QUAD	S-PQFP-G48				Not Qualified
LC7941KDR	Onsemi		OTHER	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES			CMOS	1 mA				3/5	FLATPACK	QFP100,.7X.9	80			Other Interface ICs		.635 mm	85 Cel		-20 Cel		QUAD	R-PQFP-G100				Not Qualified
LC898123XC-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B35	1	.45 mm	2.3 mm		IT ALSO OPERATES AT 3V	e1	30	260	3.39 mm
LC898122XA-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm	85 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	.45 mm	1.99 mm			e1	30	260	2.59 mm
TDE1747FP	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	45 V	1				24 V		24	SMALL OUTLINE	SOP14,.25				Peripheral Drivers	8 V	1.27 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e4	40	260	8.65 mm
STCC08	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES			CMOS					3.3/5	SMALL OUTLINE	SOP8,.25				Other Interface ICs		1.27 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1			Not Qualified		e4	40	260
TDE1747FPT	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	45 V	1				24 V		24	SMALL OUTLINE	SOP14,.25				Peripheral Drivers	8 V	1.27 mm	85 Cel		-25 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e3			8.65 mm
STCC08RL	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES			CMOS					3.3/5	SMALL OUTLINE	SOP8,.25				Other Interface ICs		1.27 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1			Not Qualified		e4	40	260
ST8024LACDR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V			SMALL OUTLINE	SOP28,.4					2.7 V	1.27 mm	85 Cel		-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY	e4	30	250	17.9 mm
ST8024CDR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE			4 V			2.7 V	1.27 mm	85 Cel	5 V	-25 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	ALSO REQUIRES A SUPPLY OF 3V TO 6.5V	e3	30	260	17.9 mm
ST8034HNQR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-25 Cel		QUAD	S-XQCC-N24		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
ST8004CD	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE			4.5 V			2.7 V	1.27 mm	85 Cel	5 V	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e4	30	250	17.9 mm
ST8034HCQR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-25 Cel		QUAD	S-XQCC-N24		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
ST8024LACTR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25					2.7 V	.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm		ALSO OPERATES AT 5V SUPPLY		NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TEA1771T	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	40 V	1				25 V			SMALL OUTLINE						12 V	1.27 mm	85 Cel		-20 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified					15.4 mm
TDA8026ET/C3	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH						2.7 V	.8 mm	85 Cel		-25 Cel		BOTTOM	S-PBGA-B64		1.2 mm	7 mm						7 mm
TDA8024TT/C1,118	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			3 V			2.7 V	.65 mm	85 Cel	5 V	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e4		260	9.7 mm
TDA8026ET/C2	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			GRID ARRAY						2.7 V	.8 mm	85 Cel		-25 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B64	2	1.2 mm	7 mm	Not Qualified	ALSO OPERATE FROM 5.25 TO 5.5 V SUPPLY	e1	30	260	7 mm
PR5331C3HN/C360	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20					2.5 V	.5 mm	85 Cel		-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm						6 mm
TDA8024T/C1,118	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE			3 V			2.7 V	1.27 mm	85 Cel	5 V	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified		e4		260	17.9 mm
TDA8024AT	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE			3 V			2.7 V	1.27 mm	85 Cel	5 V	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified		e4			17.9 mm
TDA8024TT	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V	1				3.3 V	6.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			3 V			2.7 V	.65 mm	85 Cel	5 V	-25 Cel		DUAL	R-PDSO-G28		1.1 mm	4.4 mm	Not Qualified				260	9.7 mm
PR5331C3HN/C350,55	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG						2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40
PR5331C3HN/C350	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V			CHIP CARRIER						2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40				Not Qualified
PR5331C3HN/C350,51	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG						2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40
IP4853CX24/LF/P,13	NXP Semiconductors		OTHER	BALL	24	FBGA	SQUARE	PLASTIC/EPOXY		YES						1.8 V		1.8	GRID ARRAY, FINE PITCH	BGA24,5X5,16				Other Interface ICs		.4 mm	85 Cel		-30 Cel		BOTTOM	S-PBGA-B24				Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.