Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Holtek Semiconductor |
OTHER |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
YES |
CMOS |
.42 mA |
3/5 |
FLATPACK |
QFP100,.75X.99 |
48 |
16-BP |
Other Interface ICs |
.635 mm |
70 Cel |
-25 Cel |
QUAD |
R-PQFP-G100 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
SMALL OUTLINE |
2.7 V |
1.27 mm |
85 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e4 |
30 |
250 |
17.9 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.27 V |
1 |
4 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1 V |
.4 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
2 |
.8 mm |
5 mm |
ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
49 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B49 |
1.14 mm |
4 mm |
Not Qualified |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
135 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
8 |
GRID ARRAY |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B135 |
3 |
e1 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
3.3 V |
1.8/3.3,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Line Driver or Receivers |
3 V |
.5 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.8 V |
1 |
3.3 V |
SMALL OUTLINE |
2.5 V |
1.27 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.8 V |
1 |
3.3 V |
SMALL OUTLINE |
2.5 V |
1.27 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
3.3 V |
1.8/3.3,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Line Driver or Receivers |
3 V |
.5 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-XQCC-N40 |
3 |
.4 mm |
6 mm |
Not Qualified |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
2.5 V |
5.25 V |
+-5,2.5 |
-5 V |
GRID ARRAY |
BGA144(UNSPEC) |
4.75 V |
Other Interface ICs |
2.38 V |
85 Cel |
5 V |
0 Cel |
BOTTOM |
S-PBGA-B144 |
3 |
13 mm |
Not Qualified |
30 |
260 |
13 mm |
||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.5 mm |
90 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B16 |
.675 mm |
1.96 mm |
1.96 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.5 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
.675 mm |
1.96 mm |
e1 |
30 |
260 |
1.96 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.27 V |
1 |
4 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1 V |
.4 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
2 |
.8 mm |
5 mm |
ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B16 |
.675 mm |
1.96 mm |
1.96 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.5 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
.675 mm |
1.96 mm |
e1 |
30 |
260 |
1.96 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
135 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
8 |
GRID ARRAY |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B135 |
3 |
e1 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
1 |
16 |
2.5 V |
GRID ARRAY |
2.375 V |
1 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B196 |
4 |
2.94 mm |
15.05 mm |
e1 |
30 |
245 |
15.05 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
1 |
16 |
2.5 V |
GRID ARRAY |
2.375 V |
1 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B196 |
4 |
2.94 mm |
15.05 mm |
e1 |
30 |
245 |
15.05 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-XQCC-N40 |
3 |
.4 mm |
6 mm |
Not Qualified |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
IT ALSO NEED 5V SUPPLY VOLTAGE |
e4 |
30 |
260 |
8 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
IT ALSO NEED 5V SUPPLY VOLTAGE |
e4 |
30 |
260 |
8 mm |
||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
49 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B49 |
1.14 mm |
4 mm |
Not Qualified |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
96 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.85 V |
.5 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B96 |
3 |
1 mm |
6 mm |
e1 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
96 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.85 V |
.5 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B96 |
3 |
1 mm |
6 mm |
e1 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
BALL |
96 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.85 V |
.5 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B96 |
3 |
1 mm |
6 mm |
e1 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BIPOLAR |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Display Drivers |
4.5 V |
.635 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
1 |
1.7526 mm |
3.9116 mm |
Not Qualified |
e3 |
40 |
260 |
4.9022 mm |
|||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
1 |
5 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
3 V |
.95 mm |
125 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.625 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
1.8 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.15 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.65 mm |
1.61 mm |
Not Qualified |
e1 |
260 |
2.01 mm |
||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BIPOLAR |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Display Drivers |
4.5 V |
.635 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
1 |
1.7526 mm |
3.9116 mm |
Not Qualified |
e3 |
40 |
260 |
4.9022 mm |
|||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
18 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
15.5 V |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
5 V |
15.75 V |
-10 V |
CHIP CARRIER |
14 V |
4.75 V |
1.27 mm |
70 Cel |
15 V |
25 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5 |
4.57 mm |
16.5862 mm |
Not Qualified |
e0 |
225 |
16.5862 mm |
|||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
SEGMENT |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3,15.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
12 |
0-BP |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
80 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SEGMENT |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3,15 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP80,.6SQ |
12 |
0-BP |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
Not Qualified |
e3 |
30 |
260 |
12 mm |
||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.8 V |
5.5 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
Other Interface ICs |
1.15 V |
.5 mm |
85 Cel |
-25 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B20 |
.65 mm |
2 mm |
Not Qualified |
e1 |
2.5 mm |
|||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
1 |
5 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
3 V |
.95 mm |
125 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.625 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
THROUGH-HOLE |
22 |
QIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.75 V |
1 |
5 V |
5.75 V |
IN-LINE |
4 V |
4 V |
85 Cel |
5 V |
-25 Cel |
QUAD |
R-PQIP-T22 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
1 |
5 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
3 V |
.95 mm |
125 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.625 mm |
Not Qualified |
e0 |
20 |
235 |
2.9 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
OTHER |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
SEGMENT |
YES |
BIPOLAR |
3.3,15.5 |
FLATPACK |
TQFP80,.6SQ |
12 |
0-BP |
Other Interface ICs |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQFP-G80 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BIPOLAR |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Display Drivers |
4.5 V |
.635 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
1 |
1.7526 mm |
3.9116 mm |
Not Qualified |
e3 |
40 |
260 |
4.9022 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.