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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
MM74HC541NX	Onsemi	BUFFER	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	1	CMOS		8		TR	4.5		150 pF	IN-LINE	DIP20,.3	208 ns	7.8 Amp		2.54 mm	85 Cel	3-STATE	-40 Cel		DUAL		R-PDIP-T20		6 V	5.08 mm	7.62 mm			2 V	.08 mA					26.075 mm	HC/UH
NLU1GT50CMUTCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5	1.8/5	15 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	25.5 ns	4 Amp	Gates	.35 mm	125 Cel		-55 Cel	NICKEL GOLD PALLADIUM	DUAL		S-PDSO-N6	1	5.5 V	.55 mm	1 mm	Not Qualified		1.65 V						1 mm	1G
NL27WZ17DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	UNSPECIFIED	YES	YES	2	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	15.6 ns	32 Amp		.95 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-XDSO-G6	1	5.5 V	1.1 mm	1.5 mm			1.65 V	100 mA		e3	30	260	3 mm	LVC/LCX/Z
MC100E122FN	Onsemi	BUFFER	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	9	ECL		1			5	-4.5		CHIP CARRIER	LDCC28,.5SQ	.5 ns		Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified		4.2 V	49 mA	NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V	e0		235	11.505 mm	100E
NL27WZ16DFT2	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10.2 ns	24 Amp	Gates	.65 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e0	30	235	2 mm	27WZ
NL27WZ07DET4	Onsemi	BUFFER	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	6.4 ns	24 Amp	Gates	.635 mm	85 Cel	OPEN-DRAIN	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G6		5.5 V			Not Qualified		2.3 V			e0
NL17SG07MU3TBG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	20 ns	8 Amp		.5 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		R-PDSO-N6		3.6 V	.55 mm	1 mm			.9 V	.01 mA			NOT SPECIFIED	NOT SPECIFIED	1.45 mm	LVP
NL17SG17DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1			3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		58.1 ns			.65 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm			.9 V			e3	30	260	2 mm	17SG
MC74VHC50DTR2G	Onsemi	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	14.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4	30	260	5 mm	AHC/VHC
MC74VHC50MELG	Onsemi	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	3	2/5.5	50 pF	SMALL OUTLINE	SOP14,.3	14.5 ns	8 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	5.5 V	2.05 mm	5.275 mm	Not Qualified		2 V			e4		260	10.2 mm	AHC/VHC
MC74VHC2G17MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	5		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.5 ns	8 Amp		.35 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		5.5 V	.55 mm	1 mm			2 V	.04 mA		e4			1 mm	AHC/VHC
NL17SG34DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	22.4 ns	8 Amp		.65 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm			.9 V	20 mA		e3	30	260	2 mm	17SG
MC74VHC2GT17DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	5		50 pF	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37	20.5 ns	8 Amp		.95 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.5 mm			2 V	.04 mA					3 mm	AHC/VHC
MC10188FN	Onsemi	BUFFER	OTHER	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY		YES	6	ECL		1	6		-5.2	-5.2		CHIP CARRIER	LDCC20,.4SQ	3.5 ns		Bus Driver/Transceivers	1.27 mm	85 Cel	OPEN-EMITTER	-30 Cel	TIN LEAD	QUAD	ENABLE LOW	S-PQCC-J20	1	-5.72 V	4.57 mm	8.965 mm	Not Qualified	TRUE	-4.68 V	46 mA		e0		235	8.965 mm	10K
NLV18HC1G07DFT2G	Onsemi	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	AEC-Q100	1		TR	3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	155 ns	2 Amp		.65 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		R-PDSO-G5	1	6 V	1.1 mm	1.25 mm			2 V						2 mm	HC/UH
MC74LCX07DTG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3.8 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4	30	260	5 mm	LVC/LCX/Z
NLV18HC1G34DFT2G	Onsemi	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	AEC-Q100	1		TR	3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	155 ns	2 Amp		.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G5	1	6 V	1.1 mm	1.25 mm			2 V						2 mm	HC/UH
NL37WZ17MQ1TCG	Onsemi	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	YES	3	CMOS		1		TR	1.85		50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	9.2 ns	32 Amp		.5 mm	125 Cel		-55 Cel		QUAD		S-XQCC-N8	1	5.5 V	.6 mm	1.6 mm			1.65 V	100 mA			10	260	1.6 mm	37WZ
NL17SZ17XV5T2	Onsemi	BUFFER	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20	15.6 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN	DUAL		R-PDSO-F5		5.5 V	.6 mm	1.2 mm	Not Qualified		1.65 V			e3		260	1.6 mm	17SZ
MC10H188P	Onsemi	BUFFER	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	ECL		1	6	RAIL	-5.2			IN-LINE	DIP16,.3	1.9 ns		Bus Driver/Transceivers	2.54 mm	75 Cel		0 Cel	TIN LEAD	DUAL	ENABLE HIGH	R-PDIP-T16		-5.46 V	4.44 mm	7.62 mm	Not Qualified	INVERTED	-4.94 V	46 mA		e0	30	235	19.175 mm	10H
NL37WZ16MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	8	USSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH	SOLCC8,.04,14	8.8 ns	24 Amp		.35 mm	125 Cel		-55 Cel		DUAL		R-PDSO-N8	1	5.5 V	.55 mm	1 mm			1.65 V	.01 mA			10	260	1.45 mm	LVC/LCX/Z
NC7SV34L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.2	1.2/3.3	15 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	16.9 ns	2 Amp	Gates	.5 mm	85 Cel		-40 Cel	GOLD NICKEL	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V			e4	30	260	1.45 mm	HC/UH
MC74VHC50M	Onsemi	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	3	2/5.5	50 pF	SMALL OUTLINE	SOP14,.3	14.5 ns	8 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	5.5 V	2.05 mm	5.275 mm	Not Qualified		2 V			e4		260	10.2 mm	AHC/VHC
MC74VHC1G50DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	14.5 ns	8 Amp		.95 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm			2 V	.04 mA		e3	30	260	3 mm	AHC/VHC
NL17SV125MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		2		TR	3.3		30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	14.9 ns	24 Amp		.35 mm	125 Cel		-55 Cel		DUAL		S-PDSO-N6	1	3.6 V	.65 mm	1 mm			.9 V	.005 mA					1 mm	AUP/ULP/V
MC74LCX07DG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.25	3.8 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified		2 V			e3	30	260	8.65 mm	LVC/LCX/Z
MC14050BFR1	Onsemi	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.3	140 ns	6 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G16		18 V	2.05 mm	5.275 mm	Not Qualified		3 V			e0			10.2 mm	4000/14000/40000
NC7SP17L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	46.3 ns	.5 Amp	Gates	.5 mm	85 Cel		-40 Cel	NICKEL GOLD	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V			e4	30	260	1.45 mm	P
MC74VHC1G07MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	14.5 ns	8 Amp		.5 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		R-PDSO-N6		5.5 V	.55 mm	1 mm			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED	1.45 mm	AHC/VHC
MC74VHC50DR2G	Onsemi	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	3	2/5.5	50 pF	SMALL OUTLINE	SOP14,.25	14.5 ns	8 Amp	Gates	1.27 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified		2 V			e3	30	260	8.65 mm	AHC/VHC
MC74VHCT50AD	Onsemi	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	3.3	5	50 pF	SMALL OUTLINE	SOP14,.25	13 ns	8 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified		2 V			e0		235	8.65 mm	AHCT/VHCT
MC74VHC1G07DTT1	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1			3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	14.5 ns	8 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		2 V			e0		235	3 mm	AHC/VHC
NC7WZ16L6XF113	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1			1.8			SMALL OUTLINE, VERY THIN PROFILE		10.6 ns			.5 mm	85 Cel		-40 Cel		DUAL		R-PDSO-N6		5.5 V	.55 mm	1 mm			1.65 V						1.45 mm	LVC/LCX/Z
NL27WZ07DTT1	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	12 ns	24 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V			e0		235	3 mm	27WZ
MC74VHC2G17DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.5 ns	8 Amp		.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.25 mm			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED	2 mm	AHC/VHC
NL17SZ07DFT2	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	12 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e0		235	2 mm	17SZ
NL17SG34DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP5/6,.11,37	22.4 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G5		3.6 V	1.1 mm	1.5 mm	Not Qualified		.9 V	20 mA					3 mm	17SG
MC74VHC1GT50DTT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1			1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		25.5 ns			.95 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	3 mm	AHC/VHC
MC74VHC1G50DFT1	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		2 V			e0		235	2 mm	AHC/VHC
MC74VHC2G17MU2TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1		TR	5		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,16	20.5 ns	8 Amp		.4 mm	125 Cel		-55 Cel		DUAL		R-PDSO-N6		5.5 V	.55 mm	1 mm			2 V	.04 mA					1.2 mm	AHC/VHC
NL27WZ16DTT3	Onsemi	BUFFER	INDUSTRIAL	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37	5.8 ns	24 Amp	Gates	.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G6		5.5 V			Not Qualified		2 V			e0
NL17VHC1GT50DF1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	25.5 ns	8 Amp		.65 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm			1.65 V	.04 mA		e3	30	260	2 mm	AHC/VHC/H/U/V
NL27WZ17MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE	UNSPECIFIED	YES	YES	2	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	15.6 ns	32 Amp		.35 mm	125 Cel		-55 Cel	NICKEL GOLD PALLADIUM	DUAL		S-XDSO-N6	1	5.5 V	.55 mm	1 mm			1.65 V	100 mA			30	260	1 mm	LVC/LCX/Z
NL27WZ07MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	12 ns	24 Amp		.5 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		R-PDSO-N6		5.5 V	.65 mm	1 mm			1.65 V	.1 mA			NOT SPECIFIED	NOT SPECIFIED	1.45 mm	LVC/LCX/Z
NC7SP34P5X	Onsemi	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	46.3 ns	.5 Amp	Gates	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G5	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.9 V			e3	30	260	2 mm	HC/UH
74LVC07ADTR2G	Onsemi	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm			1.65 V			e4	30	260	5 mm	LV/LV-A/LVX/H
MC74LVX50DG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	2.7	3.3	50 pF	SMALL OUTLINE	SOP14,.25	16 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G14	1	3.6 V	1.75 mm	3.9 mm	Not Qualified		2 V			e3	40	260	8.65 mm	LV/LV-A/LVX/H
NC7SP34L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	46.3 ns	.5 Amp	Gates	.5 mm	85 Cel		-40 Cel	GOLD NICKEL	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V			e4	30	260	1.45 mm	HC/UH

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.