BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
M54HC4050DT	STMicroelectronics	BUFFER		THROUGH-HOLE	16	DIP	RECTANGULAR	50k Rad(Si)	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1					IN-LINE	DIP16,.3				2.54 mm	125 Cel		-55 Cel		DUAL	R-GDIP-T16		6 V	3.83 mm	7.62 mm		2 V					20.32 mm	HC
74LCX07YM	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1		3			SMALL OUTLINE		7 ns			1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G14		3.6 V	1.75 mm	3.9 mm		2 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm	LVC/LCX/Z
74V2G07STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	12.5 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL	R-PDSO-G8	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V					2.9 mm	74V
HCC4050BKG	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED		YES	6	CMOS		1	TR	5			FLATPACK					1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F16		20 V	2.38 mm	6.91 mm		3 V	CMOS-TTL LEVEL TRANSLATOR				9.94 mm	4000/14000/40000
M54HC4050BF1	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED		NO	6	CMOS		1		5		50 pF	IN-LINE		26 ns			2.54 mm	125 Cel		-55 Cel		DUAL	R-GDIP-T16		6 V	5 mm	7.62 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.1V; IOL = 6MA @ VOL = 0.4V					HC/UH
M54HC4050DG	STMicroelectronics	BUFFER		THROUGH-HOLE	16	DIP	RECTANGULAR	50k Rad(Si)	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1					IN-LINE	DIP16,.3				2.54 mm	125 Cel		-55 Cel		DUAL	R-GDIP-T16		6 V	3.83 mm	7.62 mm		2 V					20.32 mm	HC
74LX1G70CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	12 ns	24 Amp	Gates	.65 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V		e3			2 mm	TTL/H/L
M54HC4050KT	STMicroelectronics	BUFFER		FLAT	16	DFP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1					FLATPACK	FL16,.3				1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F16		6 V	2.38 mm	6.91 mm		2 V					9.94 mm	HC
HCC4050BDT	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED		NO	6	CMOS		1		5			IN-LINE					2.54 mm	125 Cel		-55 Cel		DUAL	R-CDIP-T16		20 V	3.83 mm	7.62 mm		3 V	CMOS-TTL LEVEL TRANSLATOR				20.32 mm	4000/14000/40000
HCC4050BDG	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED		NO	6	CMOS		1	TR	5			IN-LINE					2.54 mm	125 Cel		-55 Cel		DUAL	R-CDIP-T16		20 V	3.83 mm	7.62 mm		3 V	CMOS-TTL LEVEL TRANSLATOR				20.32 mm	4000/14000/40000
74LX1G70STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	12 ns	24 Amp	Gates	.95 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5		5.5 V	1.45 mm	1.625 mm	Not Qualified	1.65 V		e4			2.9 mm	TTL/H/L
74V1T70C	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	8.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V		e0			2 mm	74V
M54HC4050F1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	2/6	150 pF	IN-LINE	DIP16,.3	30 ns	6 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T16		6 V	5.08 mm	7.62 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e0			19.304 mm	HC/UH
74V1T07C	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10 ns	8 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V		e0			2 mm	74V
HCC4050BK1	STMicroelectronics	BUFFER		FLAT	16	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1		5			FLATPACK	FL16,.3				1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F16		15 V	2.38 mm	6.91 mm		3 V					9.94 mm	HC
M54HCT07F1	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC	NO	NO		CMOS							IN-LINE	DIP14,.3			Gates	2.54 mm	125 Cel		-55 Cel		DUAL	R-XDIP-T14					Not Qualified
74V1G70CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	10 ns	4 Amp	Gates	.65 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e4	30	260	2 mm	74V
HCC4503BDT	STMicroelectronics	BUFFER		THROUGH-HOLE	14	DIP	RECTANGULAR	100k Rad(Si)	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1					IN-LINE	DIP14,.3				2.54 mm	125 Cel		-55 Cel		DUAL	R-GDIP-T14		20 V	3.7 mm	7.62 mm		3 V					19 mm	4000/14000/40000
74V1T07S	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		5	5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	10 ns	8 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.45 mm	1.625 mm	Not Qualified	4.5 V		e0			2.9 mm	74V
74V2G70CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.09,20	10.5 ns	4 Amp	Gates	.5 mm	125 Cel		-55 Cel		DUAL	R-PDSO-G8		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V					2 mm	74V
74V1G07STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	12.5 ns	4 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V		e3	30	260	2.9 mm	74V
74V2T70STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	8.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel		DUAL	R-PDSO-G8	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	4.5 V					2.9 mm	74V
74LX1G07BJR	STMicroelectronics	BUFFER	INDUSTRIAL	BALL	4	VFBGA	SQUARE		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	8.3 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	S-PBGA-B4		5.5 V	.625 mm	.87 mm	Not Qualified	1.65 V	DUMMY VAL				.87 mm	TTL/H/L
74LCX07TTR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.7	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	7 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14		3.6 V	1.2 mm	4.4 mm	Not Qualified	2 V		e4			5 mm	LVC/LCX/Z
HCC4050BKT	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED		YES	6	CMOS		1	TR	5			FLATPACK					1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F16		20 V	2.38 mm	6.91 mm		3 V	CMOS-TTL LEVEL TRANSLATOR				9.94 mm	4000/14000/40000
M54HC07F1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	2/6	50 pF	IN-LINE	DIP14,.3	27 ns	4 Amp	Gates	2.54 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-GDIP-T14		6 V	5.08 mm	7.62 mm	Not Qualified	2 V		e0				HC/UH
74LCX07YTTR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1	TR	3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	7 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G14		3.6 V	1.2 mm	4.4 mm	Not Qualified	2 V			NOT SPECIFIED	NOT SPECIFIED	5 mm	LVC/LCX/Z
74V1G07CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	12.5 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e4	30	260	2 mm	74V
74V1G07S	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	12.5 ns	4 Amp	Gates	.95 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V		e0			2.9 mm	74V
74V1T70CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	8.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V		e3	30	260	2 mm	74V
74V1T70S	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		5	5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	8.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.45 mm	1.625 mm	Not Qualified	4.5 V		e0			2.9 mm	74V
M54HC4050D	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	NO	6	CMOS	ESCC9000	1		4.5	2/6	50 pF	IN-LINE	DIP16,.3	150 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDIP-T16		6 V	3.83 mm	7.62 mm	Not Qualified	2 V		e0			20.32 mm	HC/UH
M54HC4050D1	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	NO	6	CMOS		1		4.5	2/6	50 pF	IN-LINE	DIP16,.3	150 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDIP-T16		6 V	3.83 mm	7.62 mm	Not Qualified	2 V		e0			20.32 mm	HC/UH
HCC4503BKG	STMicroelectronics	BUFFER		FLAT	14	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1					FLATPACK	FL14,.3				1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F14		20 V	2.33 mm	6.91 mm		3 V	SEATED HT-CALCULATED				9.95 mm	4000/14000/40000
74LCX07YMTR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1	TR	3	3.3	50 pF	SMALL OUTLINE	SOP14,.25	7 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	3.6 V	1.75 mm	3.9 mm	Not Qualified	2 V		e4	40	260	8.65 mm	LVC/LCX/Z
HCC4503BDG	STMicroelectronics	BUFFER		THROUGH-HOLE	14	DIP	RECTANGULAR	100k Rad(Si)	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1					IN-LINE	DIP14,.3				2.54 mm	125 Cel		-55 Cel		DUAL	R-GDIP-T14		20 V	3.7 mm	7.62 mm		3 V					19 mm	4000/14000/40000
74V2G07CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.09,20	12.5 ns	4 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL	R-PDSO-G8		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V					2 mm	74V
M54HC4050K	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS	ESCC9000	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	150 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDFP-F16		6 V	2.38 mm	6.91 mm	Not Qualified	2 V		e0			9.94 mm	HC/UH
M54HC4050K1	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1	TR	4.5	2/6	50 pF	FLATPACK	FL16,.3	150 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDFP-F16		6 V	2.38 mm	6.91 mm	Not Qualified	2 V		e0			9.94 mm	HC/UH
74V2G70STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	10.5 ns	4 Amp	Gates	.65 mm	125 Cel		-55 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G8	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V		e3	30	260	2.9 mm	74V
74V2T07STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	10 ns	8 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL	R-PDSO-G8	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	4.5 V					2.9 mm	74V
74V2T70CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	3	CMOS		1	TR	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.5 ns			.5 mm	125 Cel		-55 Cel		DUAL	R-PDSO-G8		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V					2 mm	74V
74LX1G07STR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	8.3 ns	24 Amp	Gates	.95 mm	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	1.65 V	DUMMY VAL	e4	30	260	2.9 mm	TTL/H/L
74V1G07C	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		3.3	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	12.5 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e0			2 mm	74V
M54HCT7007F1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	5	50 pF	IN-LINE	DIP14,.3	35 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T14		5.5 V	5.08 mm	7.62 mm	Not Qualified	4.5 V		e0				HCT
74V2T07CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	8	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.09,20	10 ns	8 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL	R-PDSO-G8		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V					2 mm	74V
74V1G70STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	10 ns	4 Amp	Gates	.95 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V		e3	30	260	2.9 mm	74V
74V1T70STR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	8.5 ns	8 Amp	Gates	.95 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	4.5 V		e4	30	260	2.9 mm	74V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.