BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935140000112	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	TTL		1	5			SMALL OUTLINE		17 ns			1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL	R-PDSO-G14		5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V				40	260	8.65 mm	F/FAST
HEC4050BD	NXP Semiconductors	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED		NO	6	CMOS		1	5		50 pF	IN-LINE		70 ns			2.54 mm	125 Cel		-55 Cel		DUAL	R-CDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	3 V		CMOS-TTL LEVEL TRANSLATOR					4000/14000/40000
935275558125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		1.65 V			e4			3 mm	LVC/LCX/Z
935271657125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	2 V			e3			2.9 mm	AHC
935292906132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	3			SMALL OUTLINE, VERY THIN PROFILE		14 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.35 mm	1 mm		1.65 V			e3			1 mm	LVC/LCX/Z
935302424125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		.8 V						1 mm	AUP/ULP/V
935291516115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	3.3			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.5 mm	1 mm		1.65 V			e3			1.35 mm	LVC/LCX/Z
935301511125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.95 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		1.65 V						2.9 mm	LVC/LCX/Z
935277163115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.8			SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V			e3			1.45 mm	LVC/LCX/Z
935279024115	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.1 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V			e3			2.05 mm	AUP/ULP/V
935303437125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.5 ns			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.5 mm		2 V						2.9 mm	AHC/VHC/H/U/V
935275566125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		1.65 V			e4			3 mm	LVC/LCX/Z
935272157125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		4.5 V			e4			3 mm	HCT
935280575125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.5 mm		1.65 V			e3			2.9 mm	LVC/LCX/Z
935278936115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.5 mm	1 mm		1.65 V			e3			1.95 mm	LVC/LCX/Z
935280576125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V			e3			2.05 mm	LVC/LCX/Z
935272998125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		32 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		4.5 V			e4			3 mm	HCT
935274779125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		29 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		4.5 V			e4			2.3 mm	HCT
935274777125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		125 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		6 V	1 mm	2 mm		2 V			e4			2.3 mm	HC/UH
935301183118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1	5			SMALL OUTLINE		715 ns			1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G14		6 V	1.75 mm	3.9 mm		2 V						8.65 mm	HC/UH
935277175132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.5 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V			e3			1.45 mm	LVC/LCX/Z
935277163132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.8			SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V			e3			1.45 mm	LVC/LCX/Z
935304093125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.2			SMALL OUTLINE		82 ns			.3 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.35 mm	.9 mm		.7 V						1 mm	AXP
935281031125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		175 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		6 V	1.1 mm	1.25 mm		2 V			e3			2 mm	HC/UH
935279992132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V			e3			1.45 mm	AUP/ULP/V
935290239132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	3.3			SMALL OUTLINE		11 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.35 mm	.9 mm		1.65 V			e3			1 mm	LVC/LCX/Z
935277249125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			CHIP CARRIER, VERY THIN PROFILE		13.1 ns			.55 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N8		5.5 V	.5 mm	1.6 mm		1.65 V						1.6 mm	LVC/LCX/Z
933987840118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1	5			SMALL OUTLINE		165 ns			1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	6 V	2.65 mm	7.5 mm	Not Qualified	2 V			e4			12.8 mm	HC/UH
935304092125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V						1.45 mm	AXP
935279991125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.1 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm		.8 V			e3			2 mm	AUP/ULP/V
935292256115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			SMALL OUTLINE		13.1 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.35 mm	1 mm		1.65 V			e3			1.2 mm	LVC/LCX/Z
935279025115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V			e3			1.45 mm	AUP/ULP/V
N7407N	NXP Semiconductors	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	TTL		1	5	5		IN-LINE	DIP14,.3	30 ns	40 Amp	Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel	TIN LEAD	DUAL	R-PDIP-T14		5.25 V			Not Qualified	4.75 V	41 mA		e0				74
935279028125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.8 ns			.65 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V			e3			2.05 mm	AUP/ULP/V
935300219125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm		2 V						3 mm	HC/UH
933987860112	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	9	CMOS		1	5			IN-LINE		47 ns			2.54 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T20		5.5 V	4.2 mm	7.62 mm	Not Qualified	4.5 V			e4			26.73 mm	HCT
935292876132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.2			SMALL OUTLINE, VERY THIN PROFILE		33.5 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		1.1 V			e3			1 mm	AUP/ULP/V
933282760652	NXP Semiconductors	BUFFER		THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	CMOS		1	5			IN-LINE		110 ns			2.54 mm				NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		15 V	4.7 mm	7.62 mm	Not Qualified	3 V			e4			21.6 mm	4000/14000/40000
935300862125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm		2 V						3 mm	HC/UH
935292813115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.35 mm	1 mm		1.65 V			e3			1.35 mm	LVC/LCX/Z
935267471118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V						2 mm	AHCT/VHCT
935301353125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		6 V	1.1 mm	1.25 mm		2 V						2 mm	HC/UH
935292889132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		.8 V			e3			1 mm	AUP/ULP/V
935292257115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	1.8			SMALL OUTLINE		10.8 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.35 mm	1 mm		1.65 V			e3			1.2 mm	LVC/LCX/Z
935299662125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V			e3			2.05 mm	LVC/LCX/Z
935273332115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6.5 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N14		5.5 V	1 mm	2.5 mm		1.65 V			e4			3 mm	LVC/LCX/Z
935267471125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V			e3			2 mm	AHCT/VHCT
935302422125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V						1 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.