BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74HC9015D	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE		32 ns			1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		6 V	2.65 mm	7.5 mm	Not Qualified	2 V					12.8 mm	HC/UH
74HC9015D-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE		32 ns			1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		6 V	2.65 mm	7.5 mm	Not Qualified	2 V					12.8 mm	HC/UH
74AHCT1G07GW,165	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V		e3			2.05 mm	AHCT/VHCT/VT
74LVC3G17GT,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1.95 mm	LVC/LCX/Z
74HCT3G16DP	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		4.5 V					3 mm	HCT
74LVC2G07GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns				125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		5.5 V	.35 mm	.8 mm		1.65 V					1 mm	LVC/LCX/Z
74HCT9015DB	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, SHRINK PITCH		48 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		5.5 V	2 mm	5.3 mm	Not Qualified	4.5 V					7.2 mm	HCT
74AUP2G3407GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V					1 mm	AUP/ULP/V
74HCT2G16GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		4.5 V					2 mm	HC/UH
74LVC2G07GF/S500	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.35 mm	125 Cel	OPEN-COLLECTOR	-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V					1 mm	LVC/LCX/Z
74AXP2G07GMH	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V					1.45 mm	AXP
74HC9015PW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		32 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		6 V	1.1 mm	4.4 mm	Not Qualified	2 V					6.5 mm	HC/UH
74LVC3G17GN,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE	SOLCC8,.04,12	13.1 ns	24 Amp	Gates	.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V		e3	30	240	1.2 mm	LVC/LCX/Z
74LVC2G07GF/S500,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.35 mm	125 Cel	OPEN-COLLECTOR	-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V					1 mm	LVC/LCX/Z
74LVC3G17DC,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		13.1 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V					2.3 mm	LVC/LCX/Z
74AXP1G17GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		136 ns				85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm		.7 V					.8 mm	AXP
74HCT2G34GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		4.5 V					2 mm	HCT
74LVC1G16GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		11 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V					1.45 mm	LVC/LCX/Z
HEF4050BPN	NXP Semiconductors	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1	BULK	5	5/15	50 pF	IN-LINE	DIP16,.3	70 ns		Gates	2.54 mm	85 Cel		-40 Cel	TIN	DUAL	R-PDIP-T16		15 V	4.7 mm	7.62 mm	Not Qualified	3 V	CMOS-TTL LEVEL TRANSLATOR	e3			21.6 mm	4000/14000/40000
HEF4050BTD-T	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	70 ns		Gates	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	3 V	CMOS-TTL LEVEL TRANSLATOR	e4			9.9 mm	4000/14000/40000
74HCT3G34GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.12,20	29 ns	4 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	4.5 V			30	260	3 mm	HCT
74LVC1G07GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.35 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	S-PDSO-N6	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V		e3			1 mm	LVC/LCX/Z
74AUP2G34GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.8 ns	1.7 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V		e3	30	260	1 mm	AUP/ULP/V
74LVC3G34DPR	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm	Not Qualified	1.65 V					3 mm	LVC/LCX/Z
74LVC3G07GT	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1.95 mm	LVC/LCX/Z
74LVC3G07GT,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1.95 mm	LVC/LCX/Z
74HC2G34GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	125 ns	4 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	6 V	1.1 mm	1.5 mm	Not Qualified	2 V		e3	30	260	2.8 mm	HC/UH
74LVC1G34GX/S500H	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		3.3			SMALL OUTLINE		11 ns			.48 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N5		5.5 V	.35 mm	.8 mm		1.65 V					.8 mm	LVC/LCX/Z
74LVC1G07GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.8			SMALL OUTLINE		8.4 ns			.3 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.35 mm	.9 mm	Not Qualified	1.65 V		e3			1 mm	LVC/LCX/Z
74HC3G07GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		125 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8	1	6 V	.5 mm	2 mm	Not Qualified	2 V		e4			3 mm	HC/UH
74LVC07AD,112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	3.3	3.3	50 pF	SMALL OUTLINE	SOP14,.25	6.5 ns	24 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	1.65 V		e4	30	260	8.65 mm	LVC/LCX/Z
74AXP2G07GS,125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.35 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm		.7 V					1 mm	AXP
74LVC2G16GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.35 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V					1 mm	LVC/LCX/Z
74AHC1G07GW,165	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e3			2.05 mm	AHC/VHC/H/U/V
74HC3G34DC-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	5	2/6	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	125 ns	4 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		6 V	1 mm	2 mm	Not Qualified	2 V					2.3 mm	HC/UH
74HCT3G34DC	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		29 ns			.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	4.5 V		e4	30	260	2.3 mm	HCT
74LVC3G34DP-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	10.8 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm	Not Qualified	1.65 V					3 mm	LVC/LCX/Z
74LVC3G34GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC8,.04,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V			30	260	1.6 mm	LVC/LCX/Z
74HCT3G07GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		32 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	4.5 V		e4			3 mm	HCT
74AUP2G17GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	20.1 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V		e3	30	260	1.45 mm	AUP/ULP/V
74AUP2G17GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.1 ns	1.7 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V		e3	30	260	2 mm	AUP/ULP/V
74AUP1T34GF,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	33.5 ns	1.7 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	1.1 V		e3	30	260	1 mm	AUP/ULP/V
74LVC1G07GM,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1.45 mm	LVC/LCX/Z
74LVC3G17GT-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES		CMOS			TR	3.3	3.3	50 pF	SMALL OUTLINE	SOLCC8,.04,20		24 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8					Not Qualified
74AUP2G17GM,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	20.1 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V		e3	30	260	1.45 mm	AUP/ULP/V
74AHC1G07GW-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V					2.05 mm	AHC
74HC3G07DP,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	125 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	6 V	1.1 mm	3 mm	Not Qualified	2 V		e4	30	260	3 mm	HC/UH
74AXP2T3407DP	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		225 ns			.65 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-G8		2.75 V	1.1 mm	3 mm		.7 V					3 mm	AXP

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.