BUFFER Logic Gates 2,400+

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Minimum Operating Temperature Terminal Finish Terminal Position Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

935279993125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

20.8 ns

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

3.6 V

1.1 mm

1.25 mm

.8 V

e3

2 mm

AUP/ULP/V

935273783125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

10.8 ns

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

e3

2 mm

LVC/LCX/Z

935300863125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

AEC-Q100

1

5

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

32 ns

.5 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G8

5.5 V

1 mm

2 mm

4.5 V

2.3 mm

HCT

935292814115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

1.8

SMALL OUTLINE, VERY THIN PROFILE

10.8 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N8

5.5 V

.35 mm

1 mm

1.65 V

e3

1.35 mm

LVC/LCX/Z

935288592125

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

5

SMALL OUTLINE, VERY THIN PROFILE

29 ns

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N8

5.5 V

.5 mm

2 mm

4.5 V

3 mm

HCT

935277181115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

3

SMALL OUTLINE, VERY THIN PROFILE

14 ns

.5 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

5.5 V

.5 mm

1 mm

1.65 V

e3

1.45 mm

LVC/LCX/Z

935298379125

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

SMALL OUTLINE

14 ns

.48 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N5

5.5 V

.35 mm

.8 mm

1.65 V

e3

.8 mm

LVC/LCX/Z

935281325132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.1 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

e3

1 mm

AUP/ULP/V

935291804132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

SMALL OUTLINE

10.8 ns

.3 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

5.5 V

.35 mm

.9 mm

1.65 V

e3

1 mm

LVC/LCX/Z

935265481112

NXP Semiconductors

BUFFER

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

1

1.8

SMALL OUTLINE

3.6 ns

1.27 mm

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.5 V

1.75 mm

3.9 mm

Not Qualified

1.65 V

e4

8.65 mm

LVC/LCX/Z

935291519115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

1.8

SMALL OUTLINE, VERY THIN PROFILE

10.8 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N8

5.5 V

.5 mm

1 mm

1.65 V

e3

1.35 mm

LVC/LCX/Z

935299307125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

13.1 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

2.9 mm

LVC/LCX/Z

935266681165

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

7 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

R-PDSO-G5

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

2 mm

LVC/LCX/Z

935299051125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

10.8 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

2.9 mm

LVC/LCX/Z

935281294115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.7 ns

.35 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

S-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

e3

1 mm

AUP/ULP/V

935292854132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.1 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

3.6 V

.35 mm

1 mm

.8 V

e3

1 mm

AUP/ULP/V

935281066125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

12.5 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

2 V

e3

2.05 mm

AHC/VHC/H/U/V

935301184125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

29 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

4.5 V

2 mm

HCT

935300047118

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

AEC-Q100

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

130 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

6 V

1.1 mm

4.4 mm

2 V

5 mm

HC/UH

935281036125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

125 ns

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

6 V

1.1 mm

1.25 mm

2 V

e3

2 mm

HC/UH

933987870112

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

9

CMOS

1

5

SMALL OUTLINE

47 ns

1.27 mm

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

e4

12.8 mm

HCT

935303456125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

11 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

4.5 V

2.05 mm

AHCT/VHCT/VT

935298482125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, SHRINK PITCH

14 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G5

5.5 V

1.9 mm

1.5 mm

1.65 V

e3

2.9 mm

LVC/LCX/Z

935299661125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

11 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

2.9 mm

LVC/LCX/Z

935281028125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

175 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

6 V

1.1 mm

1.5 mm

2 V

e3

2.9 mm

HCT

935267470115

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

12.5 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.25 mm

Not Qualified

2 V

2 mm

AHC

935291518115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

1.8

SMALL OUTLINE, VERY THIN PROFILE

13.1 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N8

5.5 V

.5 mm

1 mm

1.65 V

e3

1.35 mm

LVC/LCX/Z

935291763132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE

20.1 ns

.3 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

3.6 V

.35 mm

.9 mm

.8 V

e3

1 mm

AUP/ULP/V

935304364125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

AEC-Q100

1

1.8

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

13.1 ns

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

5.5 V

1 mm

2 mm

1.65 V

2.3 mm

LVC/LCX/Z

935291764132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE

20.8 ns

.3 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

3.6 V

.35 mm

.9 mm

.8 V

e3

1 mm

AUP/ULP/V

935292896132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.8

SMALL OUTLINE, VERY THIN PROFILE

8.4 ns

.35 mm

125 Cel

OPEN-COLLECTOR

-40 Cel

TIN

DUAL

S-PDSO-N6

5.5 V

.35 mm

1 mm

1.65 V

e3

1 mm

LVC/LCX/Z

935291761132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE

20.7 ns

.3 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

R-PDSO-N6

3.6 V

.35 mm

.9 mm

.8 V

e3

1 mm

AUP/ULP/V

935303455125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

11 ns

.95 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.1 mm

1.5 mm

4.5 V

2.9 mm

AHCT/VHCT/VT

933987870118

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

9

CMOS

1

5

SMALL OUTLINE

47 ns

1.27 mm

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

e4

12.8 mm

HCT

935300248125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

AEC-Q100

1

3.3

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

8.4 ns

.5 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G8

5.5 V

1 mm

2 mm

1.65 V

2.3 mm

LVC/LCX/Z

935291781132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

3

SMALL OUTLINE

14 ns

.3 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

5.5 V

.35 mm

.9 mm

1.65 V

e3

1 mm

LVC/LCX/Z

935273319125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

13.1 ns

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

2.9 mm

LVC/LCX/Z

935265482112

NXP Semiconductors

BUFFER

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

1

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.6 ns

.65 mm

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.5 V

1.1 mm

4.4 mm

Not Qualified

1.65 V

e4

5 mm

LVC/LCX/Z

935279029115

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.8 ns

.5 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

e3

1.45 mm

AUP/ULP/V

935302018125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

175 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

6 V

1.1 mm

1.25 mm

2 V

2 mm

HC/UH

935272146125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3

CMOS

1

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

125 ns

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

6 V

1.1 mm

3 mm

2 V

e4

3 mm

HC/UH

935265482118

NXP Semiconductors

BUFFER

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

1

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.6 ns

.65 mm

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.5 V

1.1 mm

4.4 mm

Not Qualified

1.65 V

e4

5 mm

LVC/LCX/Z

935302419125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

20.8 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-G6

3.6 V

1.1 mm

1.25 mm

.8 V

2 mm

AUP/ULP/V

935302098125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

1.2

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

33.5 ns

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G5

3.6 V

1.1 mm

1.25 mm

1.1 V

2.05 mm

AUP/ULP/V

935282421132

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

SMALL OUTLINE, VERY THIN PROFILE

11 ns

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

5.5 V

.5 mm

1 mm

1.65 V

e3

1 mm

LVC/LCX/Z

935279017125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

20.7 ns

.65 mm

125 Cel

OPEN-DRAIN

-40 Cel

TIN

DUAL

R-PDSO-G5

3.6 V

1.1 mm

1.25 mm

.8 V

e3

2.05 mm

AUP/ULP/V

935302887125

NXP Semiconductors

BUFFER

AUTOMOTIVE

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE

33.5 ns

.48 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N5

3.6 V

.35 mm

.8 mm

1.1 V

.8 mm

AUP/ULP/V

935300223125

NXP Semiconductors

BUFFER

AUTOMOTIVE

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

AEC-Q100

1

5

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

125 ns

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

6 V

1 mm

2 mm

2 V

2.3 mm

HC/UH

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.