BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
5962-8682001FC	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	YES	6	CMOS	MIL-PRF-38535	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	GOLD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e4				HC/UH
M74HC4050M1R	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	4.5	2/6	150 pF	SMALL OUTLINE	SOP16,.25	150 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	6 V	1.75 mm	3.9 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e4			9.9 mm	HC/UH
M74HC4050F1	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	6	CMOS		1		5	2/6	50 pF	IN-LINE	DIP16,.3	120 ns	6 Amp	Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-CDIP-T16		6 V			Not Qualified	2 V		e0				HC/UH
HCF4010YM013TR	STMicroelectronics	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1	TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	200 ns		Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	20 V	1.75 mm	3.9 mm	Not Qualified	3 V		e4		260	9.9 mm	4000/14000/40000
5962-8682001VXX	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED		YES	6	CMOS		1		4.5			FLATPACK		130 ns				125 Cel		-55 Cel		DUAL	R-CDFP-F16		6 V			Not Qualified	2 V						HC/UH
M74HC4050C1R	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	2/6	150 pF	CHIP CARRIER	LDCC20,.4SQ	25 ns	6 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20		6 V	4.57 mm	8.965 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e3			8.965 mm	HC/UH
M74HC07C1R	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	23 ns	4 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	QUAD	S-PQCC-J20		6 V	4.57 mm	8.9662 mm	Not Qualified	2 V		e3			8.9662 mm	HC/UH
M74HC07RM13TR	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	4.5	2/6	50 pF	SMALL OUTLINE	SOP14,.25	135 ns	4 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14		6 V	1.75 mm	3.9 mm	Not Qualified	2 V		e4			8.65 mm	HC/UH
M74HC4050M013TR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	TR	5		50 pF	SMALL OUTLINE		21 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V	1.75 mm	3.9 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V				9.9 mm	HC/UH
HCF4050BF	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	3/15	50 pF	IN-LINE	DIP16,.3	140 ns		Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-GDIP-T16		15 V	5 mm	7.62 mm	Not Qualified	3 V		e0			20 mm	4000/14000/40000
HCF4010BEY	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	CMOS		1	TUBE	5	5/15	50 pF	IN-LINE	DIP16,.3	200 ns		Gates	2.54 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL	R-PDIP-T16		20 V	5.1 mm	7.62 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e3				4000/14000/40000
HCF4049BM1	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5			SMALL OUTLINE		120 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm		3 V					9.9 mm	4000/14000/40000
M74HC4050TTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	4.5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	150 ns	4 Amp	Gates	.65 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	3	6 V	1.2 mm	4.4 mm	Not Qualified	2 V		e4	40	260	5 mm	HC/UH
5962-8682001FA	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	YES	6	CMOS	MIL-PRF-38535	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
M74HCT07C1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES		CMOS							CHIP CARRIER	LDCC20,.4SQ			Gates	1.27 mm	85 Cel		-40 Cel		QUAD	S-PQCC-J20					Not Qualified
935288591125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		125 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8		6 V	.5 mm	2 mm		2 V					3 mm	HC/UH
935272999125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm		2 V		e4			3 mm	HC/UH
935277169115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.5 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1.45 mm	LVC/LCX/Z
935270079125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2.05 mm	LVC/LCX/Z
935279024125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.1 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V		e3			2.05 mm	AUP/ULP/V
935274165125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.65 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2 mm	LVC/LCX/Z
935298381125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		3.3			SMALL OUTLINE		11 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5		5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
935279018115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
933987850005	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD			UNSPECIFIED	UNSPECIFIED		YES	9	CMOS		1		5			UNCASED CHIP		165 ns				125 Cel	OPEN-DRAIN	-40 Cel		UPPER	X-XUUC-N		6 V			Not Qualified	2 V						HC/UH
935302421125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V					1.45 mm	AUP/ULP/V
935266681125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		7 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	PURE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V					2 mm	LVC/LCX/Z
935059840118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1					SMALL OUTLINE		715 ns			1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	6 V	1.75 mm	3.9 mm	Not Qualified	3 V		e4			8.65 mm	HC/UH
935279025132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
935291803132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE		13.1 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.35 mm	.9 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935267471115	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V			NOT SPECIFIED	NOT SPECIFIED	2 mm	AHCT/VHCT
935188730118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5			SMALL OUTLINE, SHRINK PITCH		130 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	2 V		e4			6.2 mm	HC/UH
935302423125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE		20.8 ns			.3 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		3.6 V	.35 mm	.9 mm		.8 V					1 mm	AUP/ULP/V
933669730652	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	CMOS		1		5			IN-LINE		130 ns			2.54 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		6 V	4.7 mm	7.62 mm	Not Qualified	2 V		e4			21.6 mm	HC/UH
935292888132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V
935187470118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		130 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	2 V		e4			5 mm	HC/UH
935304094125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.35 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm		.7 V					1 mm	AXP
935300903125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		1.65 V					3 mm	LVC/LCX/Z
935300865125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		32 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		4.5 V					3 mm	HCT
935277184132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		3.3			SMALL OUTLINE, VERY THIN PROFILE		11 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1.45 mm	LVC/LCX/Z
935277181132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		3			SMALL OUTLINE, VERY THIN PROFILE		14 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1.45 mm	LVC/LCX/Z
935302021125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		45 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		4.5 V					2 mm	HCT
935300902125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		10.8 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V					2.3 mm	LVC/LCX/Z
935301358125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		4.5 V		e3			2.9 mm	HCT
935288587125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		32 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8		5.5 V	.5 mm	2 mm		4.5 V		e4			3 mm	HCT
935298377125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		3.3			SMALL OUTLINE		8.4 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N5		5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
935187470112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		130 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	2 V		e4			5 mm	HC/UH
935301512125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		1.65 V					2 mm	LVC/LCX/Z
935292831132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.