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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
NC7NP34L8X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE		UNSPECIFIED	NO	YES	3	CMOS		1		TR	1.2	1.2/3.3	30 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	46.3 ns	.5 Amp	Gates	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N8	1	3.6 V	.55 mm	1.6 mm	Not Qualified		.9 V			e4	30	260	1.6 mm	P
MC74LCX07M	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.3	3.8 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	5.5 V	2.05 mm	5.275 mm	Not Qualified		2 V			e4		260	10.2 mm	LVC/LCX/Z
NC7WV16L6XF113	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR		UNSPECIFIED		YES	2	CMOS		1			1.2			CHIP CARRIER, VERY THIN PROFILE		17.9 ns			.5 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-N6		3.6 V	.55 mm	1 mm			.9 V						1.45 mm	AUP/ULP/V
MC10197P	Onsemi	BUFFER	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	ECL		1			-5.2			IN-LINE	DIP16,.3	5 ns		Gates	2.54 mm	85 Cel		-30 Cel	TIN LEAD	DUAL		R-PDIP-T16		-5.72 V	4.44 mm	7.62 mm	Not Qualified		-4.68 V	54 mA		e0		235	19.175 mm	10K
MC74VHC1G07DFR2	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY		YES	1	CMOS		1			3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified		2 V			e0			2 mm	AHC/VHC
MC14050BFL1	Onsemi	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.3	140 ns	6 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16		18 V	2.05 mm	5.275 mm	Not Qualified		3 V			e4			10.2 mm	4000/14000/40000
MC74VHC1GT07DFT1G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.5 ns	8 Amp		.65 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED	2 mm	AHC/VHC
NC7WV16L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR		UNSPECIFIED	NO	YES	2	CMOS		1		TR	1.2	1.2/3.3	15 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.04,20	17.9 ns	4 Amp	Gates	.5 mm	85 Cel		-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V			e4	30	260	1.45 mm	AUP/ULP/V
MC74VHC50DR2	Onsemi	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	3	2/5.5	50 pF	SMALL OUTLINE	SOP14,.25	14.5 ns	8 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified		2 V			e0		235	8.65 mm	AHC/VHC
NLV18SZ16DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS	AEC-Q100	1		TR	2.3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	15.6 ns	32 Amp		.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm			1.65 V	.01 mA					2 mm	LVC/LCX/Z
74LVC07ADR2G	Onsemi	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY		YES	6	CMOS		1			3.3			SMALL OUTLINE		6.5 ns			1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL		R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm			1.65 V			e3		260	8.65 mm	LV/LV-A/LVX/H
NL27WZ07MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	12 ns	24 Amp		.35 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		S-PDSO-N6		5.5 V	.55 mm	1 mm			1.65 V	.1 mA			NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
MC14050BCL	Onsemi	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED		NO	6	CMOS		1			5			IN-LINE		140 ns			2.54 mm	85 Cel		-40 Cel		DUAL		R-CDIP-T16		18 V	4.19 mm	7.62 mm			3 V						19.3 mm	4000/14000/40000
MC10E122FNR2G	Onsemi	BUFFER	OTHER	J BEND	28	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	9	ECL		1		TR	5	-5.2		CHIP CARRIER	LDCC28,.5SQ	.5 ns		Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN	QUAD		S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified		4.2 V	57 mA	NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	10E
MC74VHCT50ADTG	Onsemi	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	3.3	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	13 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4			5 mm	AHCT/VHCT
NLVVHC1GT50DFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS	AEC-Q100	1		TR	5	3.3/5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	25.5 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V	.04 mA		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm	AHC/VHC/H/U/V
NL17SZ16DFT2	Onsemi	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	12 ns	24 Amp	Gates	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V			e0		235	2 mm	17SZ
NLV17SG34AMUTCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY		YES	1	CMOS		1			1.1			SMALL OUTLINE, VERY THIN PROFILE		22.4 ns			.5 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm			.9 V			e4	30	260	1.45 mm	LVP
NL17SV125MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		2		TR	3.3		30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	14.9 ns	24 Amp		.5 mm	125 Cel		-55 Cel		DUAL		R-PDSO-N5	1	3.6 V	.55 mm	1 mm			.9 V	.005 mA					1.45 mm	AUP/ULP/V
NL17SV16XV5T2G	Onsemi	BUFFER	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3.3	1.2/3.3	15 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.047,20	13 ns	2 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN	DUAL		R-PDSO-F5	1	3.6 V	.6 mm	1.2 mm	Not Qualified		.9 V			e3	30	260	1.6 mm	AUP/ULP/V
NL27WZ16DBVT1G	Onsemi	BUFFER	MILITARY	GULL WING	6	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	2	CMOS		1		TR	2.3		50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37	10.2 ns	32 Amp		.95 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm			1.65 V	100 mA		e3	30	260	3 mm	LVC/LCX/Z
MC74VHC1GT07MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	14.5 ns	8 Amp		.35 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL		S-PDSO-N6		5.5 V	.65 mm	1 mm			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED	1 mm	AHC/VHC
MC10E122FNG	Onsemi	BUFFER	OTHER	J BEND	28	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	9	ECL		1			5	-5.2		CHIP CARRIER	LDCC28,.5SQ	.5 ns		Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN	QUAD		S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified		4.2 V	57 mA	NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	10E
MC74LCX07DTR2	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3.8 ns	24 Amp	Gates	.65 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4		260	5 mm	LVC/LCX/Z
MC10E122FNR2	Onsemi	BUFFER	OTHER	J BEND	28	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	9	ECL		1		TR	5	-5.2		CHIP CARRIER	LDCC28,.5SQ	.5 ns		Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	1	5.7 V	4.57 mm	11.505 mm	Not Qualified		4.2 V	57 mA	NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V	e0		235	11.505 mm	10E
MC10197FNR2	Onsemi	BUFFER	OTHER	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	6	ECL		1		TR	-5.2			CHIP CARRIER	LDCC20,.4SQ	5 ns		Gates	1.27 mm	85 Cel		-30 Cel	TIN LEAD	QUAD		S-PQCC-J20		-5.72 V	4.57 mm	8.965 mm	Not Qualified		-4.68 V	54 mA		e0		235	8.965 mm	10K
MC74VHCT50ADT	Onsemi	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	3.3	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	13 ns	8 Amp	Gates	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	5.5 V	1.2 mm	4.4 mm	Not Qualified		2 V			e4		260	5 mm	AHCT/VHCT
NL37WZ17MU1TCG	Onsemi	BUFFER	AUTOMOTIVE	NO LEAD	8	USSON	RECTANGULAR		PLASTIC/EPOXY	YES	YES	3	CMOS		1		TR	3.3		50 pF	SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH	SOLCC8,.04,20	9.2 ns	24 Amp		.5 mm	125 Cel		-40 Cel		DUAL		R-PDSO-N8	1	5.5 V	.55 mm	1 mm			1.65 V	.01 mA			10	260	1.95 mm	LVC/LCX/Z
MC74VHC1GT50P5T5G	Onsemi	BUFFER	MILITARY	FLAT	5	VSOF	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.03,14	14.5 ns	8 Amp		.35 mm	125 Cel		-55 Cel		DUAL		R-PDSO-F5		5.5 V	.4 mm	.8 mm			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED	1 mm	AHC/VHC
MC74LVX50DR2	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.7	3.3	50 pF	SMALL OUTLINE	SOP14,.25	16 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G14	1	3.6 V	1.75 mm	3.9 mm	Not Qualified		2 V			e0		235	8.65 mm	LV/LV-A/LVX/H
NL17SZ16XV5T2	Onsemi	BUFFER	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	TSSOP5/6,.08	12 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN	DUAL		R-PDSO-F5		5.5 V	.6 mm	1.2 mm	Not Qualified		1.65 V			e3		260	1.6 mm	17SZ
NLV14050BDR2G	Onsemi	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS	AEC-Q100	1		TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	18 V	1.75 mm	3.9 mm	Not Qualified		3 V			e3	30	260	9.9 mm	4000/14000/40000
NC7WV17L6X	Onsemi	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR		UNSPECIFIED	YES	YES	2	CMOS		1		TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	19.9 ns	24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	GOLD NICKEL	DUAL		R-XDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V			e4	30	260	1.45 mm	AUP/ULP/V
NLU1GT126BMX1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR		PLASTIC/EPOXY		YES	1	CMOS		1	1	TR	5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,16	16 ns	4 Amp	Bus Driver/Transceivers	.4 mm	125 Cel	3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	ENABLE HIGH	R-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	TRUE	1.65 V			e4		260	1.2 mm	1G
MC10H188MG	Onsemi	BUFFER	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY		YES	6	ECL		1	6	RAIL	-5.2			SMALL OUTLINE	SOP16,.3	1.9 ns		Bus Driver/Transceivers	1.27 mm	75 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	ENABLE HIGH	R-PDSO-G16		-5.46 V	2.05 mm	5.275 mm	Not Qualified	INVERTED	-4.94 V	46 mA		e4		260	10.2 mm	10H
MC14050BD	Onsemi	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		RAIL	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	18 V	1.75 mm	3.9 mm	Not Qualified		3 V			e0		235	9.9 mm	4000/14000/40000
MM74HC125NX	Onsemi	BUFFER	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	4	CMOS		1		TR	4.5		150 pF	IN-LINE	DIP14,.3	163 ns	7.8 Amp		2.54 mm	85 Cel	3-STATE	-40 Cel		DUAL		R-PDIP-T14		6 V	5.08 mm	7.62 mm			2 V	.08 mA					19.18 mm	HC/UH
NL17SZ17XV5T2G	Onsemi	BUFFER	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR		PLASTIC/EPOXY	YES	YES	1	CMOS		1		TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.047,20	15.6 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-F5	1	5.5 V	.6 mm	1.2 mm	Not Qualified		1.65 V	.01 mA		e3	40	260	1.6 mm	17SZ
MC74VHC1GT50XV5T2G	Onsemi	BUFFER	MILITARY	FLAT	5	VSOF	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		TR	3		50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.06,20	14.5 ns	8 Amp		.5 mm	125 Cel		-55 Cel	MATTE TIN	DUAL		R-PDSO-F5	1	5.5 V	.6 mm	1.2 mm			2 V	.04 mA		e3	30	260	1.6 mm	AHC/VHC
MC14050BDTR2	Onsemi	BUFFER	MILITARY	GULL WING	16	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	5	5/15	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	140 ns		Gates	.65 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	18 V	1.2 mm	4.4 mm	Not Qualified		3 V			e4	40	260	5 mm	4000/14000/40000
MC74LCX07MELG	Onsemi	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		TR	2.5	3.3	50 pF	SMALL OUTLINE	SOP14,.3	3.8 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		5.5 V	2.05 mm	5.275 mm	Not Qualified		2 V			e4		260	10.2 mm	LVC/LCX/Z
NLU1GT126CMX1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	SQUARE		PLASTIC/EPOXY		YES	1	CMOS		1	1	TR	5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	16 ns	4 Amp	Bus Driver/Transceivers	.35 mm	125 Cel	3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	ENABLE HIGH	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	TRUE	1.65 V			e4		260	1 mm	1G
HCC4050BD	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	NO	6	CMOS	ESCC9000	1				5/15		IN-LINE	DIP16,.3			Gates	2.54 mm	125 Cel		-55 Cel		DUAL		R-CDIP-T16		20 V	3.83 mm	7.62 mm	Not Qualified		3 V				NOT SPECIFIED	NOT SPECIFIED	20.32 mm	4000/14000/40000
HCC4049BF	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED		NO	6	CMOS		1			5			IN-LINE		120 ns			2.54 mm	125 Cel		-55 Cel		DUAL		R-CDIP-T16		18 V	5.08 mm	7.62 mm			3 V		LG-MAX				20 mm	4000/14000/40000
M54HCT7007F1	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1			5	5	50 pF	IN-LINE	DIP14,.3	39 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-GDIP-T14		5.5 V	5 mm	7.62 mm	Not Qualified		4.5 V		IOL = 4.0MA @ VOL = 0.40V; IOH = 4.0MA @ VOH = 4.10V	e0				HCT
M54HC4050F1	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	NO	6	CMOS		1			5	2/6	50 pF	IN-LINE	DIP16,.3	100 ns	6 Amp	Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL		R-CDIP-T16		6 V			Not Qualified		2 V			e0				HC/UH
M54HC4050KG	STMicroelectronics	BUFFER		FLAT	16	DFP	RECTANGULAR	50k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1						FLATPACK	FL16,.3				1.27 mm	125 Cel		-55 Cel		DUAL		R-CDFP-F16		6 V	2.38 mm	6.91 mm			2 V						9.94 mm	HC
HCC4010BF	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1			5	3/18	50 pF	IN-LINE	DIP16,.3	130 ns		Gates	2.54 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL		R-GDIP-T16		18 V	5.08 mm	7.62 mm	Not Qualified		3 V		HIGH TO LOW LEVEL TRANSLATOR	e0			19.43 mm	4000/14000/40000

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.