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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74V1G70S	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1		3.3	2/5.5	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	9.2 ns	4 Amp	Gates	.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G5		5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V		e0			2.9 mm	74V
HCC4050BF	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	3/18	50 pF	IN-LINE	DIP16,.3	110 ns		Gates	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T16		18 V	5.08 mm	7.62 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e0			19.43 mm	4000/14000/40000
74LCX07T	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		2.7	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	7 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	TIN LEAD	DUAL	R-PDSO-G14		3.6 V	1.2 mm	4.4 mm	Not Qualified	2 V		e0			5 mm	LVC/LCX/Z
74V1T07CTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	10 ns	8 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V		e3	30	260	2 mm	74V
HCC4503BKT	STMicroelectronics	BUFFER		FLAT	14	DFP	RECTANGULAR	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS		1					FLATPACK	FL14,.3				1.27 mm	125 Cel		-55 Cel		DUAL	R-CDFP-F14		20 V	2.33 mm	6.91 mm		3 V	SEATED HT-CALCULATED				9.95 mm	4000/14000/40000
74LCX07MTR	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	2.7	3.3	50 pF	SMALL OUTLINE	SOP14,.25	7 ns	24 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14		3.6 V	1.75 mm	3.9 mm	Not Qualified	2 V		e4	40	260	8.65 mm	LVC/LCX/Z
5962-8682001VFX	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, GLASS-SEALED		YES	6	CMOS	MIL-PRF-38535 Class V	1		4.5			FLATPACK		130 ns				125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
M74HC4050B1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1	TUBE	4.5	2/6	150 pF	IN-LINE	DIP16,.3	150 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		6 V	5.1 mm	7.62 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e4				HC/UH
HCF4049BC1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY		YES	6	CMOS		1		5			CHIP CARRIER		120 ns			1.27 mm	85 Cel		-40 Cel		QUAD	S-PQCC-J20		15 V	4.57 mm	8.965 mm		3 V					8.965 mm	4000/14000/40000
HCF4010BM1	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	200 ns		Gates	1.27 mm	125 Cel	OPEN-DRAIN	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	20 V	1.75 mm	3.9 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e4			9.9 mm	4000/14000/40000
5962-8682001VFC	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	YES	6	CMOS	MIL-PRF-38535 Class V	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	GOLD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e4				HC/UH
M74HC07TTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	4.5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	135 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel		DUAL	R-PDSO-G14		6 V	1.2 mm	4.4 mm	Not Qualified	2 V					5 mm	HC/UH
M74HC4050C1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		UNSPECIFIED	NO	YES	6	CMOS		1		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	120 ns	6 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-J20		6 V			Not Qualified	2 V		e0				HC/UH
M74HCT07B1	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO		CMOS							IN-LINE	DIP14,.3			Gates	2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T14					Not Qualified
5962-8682001XC	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS	MIL-STD-883	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	GOLD	DUAL	R-CDFP-F16		6 V			Not Qualified	2 V		e4				HC/UH
5962-8682001XX	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED		YES	6	CMOS		1		4.5			FLATPACK		130 ns				125 Cel		-55 Cel		DUAL	R-CDFP-F16		6 V			Not Qualified	2 V						HC/UH
M74HCT7007C1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5	50 pF	CHIP CARRIER	LDCC20,.4SQ	33 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20		5.5 V	4.57 mm	8.9662 mm	Not Qualified	4.5 V	IOL = 4.0MA @ VOL = 0.33V; IOH = 4.0MA @ VOH = 4.13V	e0			8.9662 mm	HCT
M74HC07M1R	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		4.5	2/6	50 pF	SMALL OUTLINE	SOP14,.25	135 ns	4 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	6 V	1.75 mm	3.9 mm	Not Qualified	2 V		e4			8.65 mm	HC/UH
5962-8682001XA	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS	MIL-STD-883	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
M74HCT7007F1	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	NO	6	CMOS		1		5	5	50 pF	IN-LINE	DIP14,.3	33 ns	4 Amp	Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-GDIP-T14		5.5 V	5 mm	7.62 mm	Not Qualified	4.5 V	IOL = 4.0MA @ VOL = 0.33V; IOH = 4.0MA @ VOH = 4.13V	e0				HCT
M74HC4050B1N	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	2/6	50 pF	IN-LINE	DIP16,.3	125 ns	6 Amp	Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDIP-T16		6 V			Not Qualified	2 V		e0				HC/UH
M74HCT7007M1	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5	50 pF	SMALL OUTLINE	SOP14,.25	33 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14		5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V	IOL = 4.0MA @ VOL = 0.33V; IOH = 4.0MA @ VOH = 4.13V	e0			8.65 mm	HCT
HCF4050BM	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	3/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		15 V	2 mm	4.5 mm	Not Qualified	3 V	LG-MAX, WD-MAX	e0			10.16 mm	4000/14000/40000
HCF4050BEY	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1	TUBE	5	5/15	50 pF	IN-LINE	DIP16,.3	140 ns		Gates	2.54 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		20 V	5.1 mm	7.62 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e4				4000/14000/40000
M74HC4050RM13TR	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	4.5	2/6	150 pF	SMALL OUTLINE	SOP16,.25	150 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.75 mm	3.9 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e4	30	260	9.9 mm	HC/UH
5962-8682001FX	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, GLASS-SEALED		YES	6	CMOS	MIL-PRF-38535	1		4.5			FLATPACK		130 ns				125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
M74HC4050BM1	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY		YES	6	CMOS		1		5		50 pF	SMALL OUTLINE		21 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V	1.75 mm	3.9 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V				9.9 mm	HC/UH
M74HCT7007B1N	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	5	50 pF	IN-LINE	DIP14,.3	33 ns	4 Amp	Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDIP-T14		5.5 V	5.1 mm	7.62 mm	Not Qualified	4.5 V	IOL = 4.0MA @ VOL = 0.33V; IOH = 4.0MA @ VOH = 4.13V	e0				HCT
M74HCT7007M1R	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5	50 pF	SMALL OUTLINE	SOP14,.25	35 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V		e4			8.65 mm	HCT
HCF4050BM1	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	20 V	1.75 mm	3.9 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e4			9.9 mm	4000/14000/40000
M74HCT07F1	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR		CERAMIC	NO	NO		CMOS							IN-LINE	DIP14,.3			Gates	2.54 mm	85 Cel		-40 Cel		DUAL	R-XDIP-T14					Not Qualified
M74HC07B1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		4.5	2/6	50 pF	IN-LINE	DIP14,.3	135 ns	4 Amp	Gates	2.54 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL	R-PDIP-T14		6 V	5.1 mm	7.62 mm	Not Qualified	2 V		e3				HC/UH
M74HC4050BF1	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		CERAMIC, GLASS-SEALED		NO	6	CMOS		1		5		50 pF	IN-LINE		21 ns			2.54 mm	85 Cel		-40 Cel		DUAL	R-GDIP-T16		6 V	5 mm	7.62 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V					HC/UH
5962-8682001VFA	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, GLASS-SEALED	NO	YES	6	CMOS	MIL-PRF-38535 Class V	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
M74HCT7007B1R	STMicroelectronics	BUFFER	MILITARY	THROUGH-HOLE	14	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	5	50 pF	IN-LINE	DIP14,.3	35 ns	4 Amp	Gates	2.54 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-PDIP-T14		5.5 V	5.1 mm	7.62 mm	Not Qualified	4.5 V		e3			19.43 mm	HCT
M74HC4050BB1N	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY		NO	6	CMOS		1		5		50 pF	IN-LINE		21 ns			2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T16		6 V	5.1 mm	7.62 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V					HC/UH
M74HCT7007RM13TR	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE	SOP14,.25	35 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V		e4	40	260	8.65 mm	HCT
5962-8682001VXA	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS	MIL-PRF-38535 Class V	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-CDFP-F16		6 V			Not Qualified	2 V		e0				HC/UH
5962-8682001VXC	STMicroelectronics	BUFFER	MILITARY	FLAT	16	DFP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	YES	6	CMOS	MIL-PRF-38535 Class V	1		4.5	2/6	50 pF	FLATPACK	FL16,.3	130 ns	4 Amp	Gates	1.27 mm	125 Cel		-55 Cel	GOLD	DUAL	R-CDFP-F16		6 V			Not Qualified	2 V		e4				HC/UH
HCF4049BEY	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY		NO	6	CMOS		1		5			IN-LINE		120 ns			2.54 mm	85 Cel		-40 Cel		DUAL	R-PDIP-T16		15 V	5.1 mm	7.62 mm		3 V	LG-MAX				20 mm	4000/14000/40000
HCF4050BE	STMicroelectronics	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR		PLASTIC/EPOXY	NO	NO	6	CMOS		1		5	3/15	50 pF	IN-LINE	DIP16,.3	140 ns		Gates	2.54 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDIP-T16		15 V	5.1 mm	7.62 mm	Not Qualified	3 V	LG-MAX	e0			20 mm	4000/14000/40000
M74HC4050BC1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY		YES	6	CMOS		1		5		50 pF	CHIP CARRIER		21 ns			1.27 mm	85 Cel		-40 Cel		QUAD	S-PQCC-J20		6 V	4.57 mm	8.9662 mm	Not Qualified	2 V	WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V				8.9662 mm	HC/UH
M74HCT7007C1R	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	5	50 pF	CHIP CARRIER	LDCC20,.4SQ	29 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20		5.5 V	4.57 mm	8.9662 mm	Not Qualified	4.5 V		e3			8.9662 mm	HCT
HCF4050BC1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	3/15	50 pF	CHIP CARRIER	LDCC20,.4SQ	110 ns		Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20		15 V	4.57 mm	8.9662 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e3			8.9662 mm	4000/14000/40000
M74HC4050M1	STMicroelectronics	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	125 ns	6 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		6 V			Not Qualified	2 V		e0				HC/UH
HCF4010BC1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE		PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	3/15	50 pF	CHIP CARRIER	LDCC20,.4SQ	130 ns		Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	QUAD	S-PQCC-J20		15 V	4.57 mm	8.9662 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e3			8.9662 mm	4000/14000/40000
HCF4050M013TR	STMicroelectronics	BUFFER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	140 ns		Gates	1.27 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	3	20 V	1.75 mm	3.9 mm	Not Qualified	3 V	HIGH TO LOW LEVEL TRANSLATOR	e4	30	260	9.9 mm	4000/14000/40000
M74HCT7007TTR	STMicroelectronics	BUFFER	MILITARY	GULL WING	14	TSSOP	RECTANGULAR		PLASTIC/EPOXY	NO	YES	6	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	35 ns	4 Amp	Gates	.65 mm	125 Cel		-55 Cel		DUAL	R-PDSO-G14		5.5 V	1.2 mm	4.4 mm	Not Qualified	4.5 V					5 mm	HCT

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.