BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
933987880005	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD			UNSPECIFIED	UNSPECIFIED		YES	9	CMOS		1	5		UNCASED CHIP		47 ns				125 Cel	OPEN-DRAIN	-40 Cel		UPPER	X-XUUC-N		5.5 V			Not Qualified	4.5 V						HCT
935140000118	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	TTL		1	5		SMALL OUTLINE		17 ns			1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL	R-PDSO-G14		5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm	F/FAST
935274164125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.95 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		1.65 V		e3			2.9 mm	LVC/LCX/Z
935265481118	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	1.8		SMALL OUTLINE		3.6 ns			1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	1.65 V		e4			8.65 mm	LVC/LCX/Z
935297926125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE		20.7 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N5		3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
935291737132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE		20.8 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.35 mm	.9 mm		.8 V		e3			1 mm	AUP/ULP/V
935282434132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935281108132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V
935267470118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V					2 mm	AHC
N7407D	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1	5	5	SMALL OUTLINE	SOP14,.25	30 ns	40 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	TIN LEAD	DUAL	R-PDSO-G14		5.25 V			Not Qualified	4.75 V	51 mA	e0				74
935274808125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	5		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		125 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		6 V	1 mm	2 mm		2 V		e4			2.3 mm	HC/UH
935299308125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13.1 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2 mm	LVC/LCX/Z
935298483125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2.05 mm	LVC/LCX/Z
935267470165	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e3			2 mm	AHC
935292912132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	3.3		SMALL OUTLINE, VERY THIN PROFILE		11 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.35 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935279992115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
935059830112	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	CMOS		1	4.75		IN-LINE		715 ns			2.54 mm	125 Cel		-40 Cel		DUAL	R-PDIP-T14		6 V	4.2 mm	7.62 mm	Not Qualified	3 V			NOT SPECIFIED	NOT SPECIFIED	19.025 mm	HC/UH
935292932132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.35 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935140010112	NXP Semiconductors	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	TTL		1	5		IN-LINE		17 ns			2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL	R-PDIP-T14		5.5 V	4.2 mm	7.62 mm	Not Qualified	4.5 V					19.025 mm	F/FAST
935282435132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935286862125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	3.3		SMALL OUTLINE, VERY THIN PROFILE		8.4 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8		5.5 V	.5 mm	2 mm		1.65 V		e4			3 mm	LVC/LCX/Z
935277251125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	1.8		CHIP CARRIER, VERY THIN PROFILE		10.8 ns			.5 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N8		5.5 V	.5 mm	1.6 mm		1.65 V					1.6 mm	LVC/LCX/Z
935300046118	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1	5		SMALL OUTLINE		130 ns			1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V	1.75 mm	3.9 mm		2 V					9.9 mm	HC/UH
935281034125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		4.5 V		e3			2.8 mm	HCT
935277246125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	3.3		CHIP CARRIER, VERY THIN PROFILE		8.4 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		QUAD	S-PQCC-N8		5.5 V	.5 mm	1.6 mm		1.65 V					1.6 mm	LVC/LCX/Z
933714810652	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	5		SMALL OUTLINE		130 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V			Not Qualified	2 V		e4				HC/UH
935298228125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE		20.1 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5		3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
935300859125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1	5		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		125 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		6 V	1 mm	2 mm		2 V					2.3 mm	HC/UH
935304347125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13.1 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm		1.65 V					3 mm	LVC/LCX/Z
935279995132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
935279018132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
935302019125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		45 ns			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		4.5 V					2.9 mm	HCT
935281033125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		175 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		6 V	1.1 mm	1.5 mm		2 V		e3			2.9 mm	HC/UH
935292862132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.35 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V
935271656125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	4.5 V		e3			2.9 mm	AHCT/VHCT
933372930653	NXP Semiconductors	BUFFER		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	5		SMALL OUTLINE		110 ns			1.27 mm				NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1		1.75 mm	3.9 mm	Not Qualified			e4			9.9 mm	4000/14000/40000
933999100602	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	TTL		1	5		SMALL OUTLINE		7.5 ns			1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V		e4			8.65 mm	F/FAST
935285653125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2 mm	LVC/LCX/Z
935275565125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	1.8		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		10.8 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V		e4			2.3 mm	LVC/LCX/Z
935282415132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	3		SMALL OUTLINE, VERY THIN PROFILE		14 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935188730112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	5		SMALL OUTLINE, SHRINK PITCH		130 ns			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	2 V		e4			6.2 mm	HC/UH
933714810653	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	5		SMALL OUTLINE		130 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V			Not Qualified	2 V		e4				HC/UH
935281296132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V
935292931132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		5.5 V	.35 mm	1 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935279995115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1.45 mm	AUP/ULP/V
935274811125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	5		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		32 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		4.5 V		e4			2.3 mm	HCT
935291801132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1	1.8		SMALL OUTLINE		8.4 ns			.3 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.35 mm	.9 mm		1.65 V		e3			1 mm	LVC/LCX/Z
935300768125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1	1.1		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.8 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V		e3			2.05 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.