BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74HC3G34DP-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm		2 V						3 mm	HC/UH
74HCT9115NB	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	9	CMOS		1		5		50 pF	IN-LINE		47 ns			2.54 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T20		5.5 V	4.2 mm	7.62 mm	Not Qualified	4.5 V			e4			26.73 mm	HCT
74LVC2G07GX,147	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		8.4 ns				125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		5.5 V	.35 mm	.8 mm		1.65 V						1 mm	LVC/LCX/Z
74LVC3G17GS,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,14	13.1 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.35 mm	LVC/LCX/Z
74AUP3G17GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8		3.6 V	.5 mm	2 mm		.8 V		SEATED HGT-NOM				3 mm	AUP/ULP/V
74AUP1G07GX/S500H	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE		20.7 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N5		3.6 V	.35 mm	.8 mm		.8 V						.8 mm	AUP/ULP/V
74AXP1T34GW,125	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		210 ns			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G5		2.75 V	1.1 mm	1.25 mm		.7 V						2.05 mm	AXP
74LVC3G34DC	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	1.65 V			e4	30	260	2.3 mm	LVC/LCX/Z
74LVC3G07DP-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.4 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm		1.65 V						3 mm	LVC/LCX/Z
74HCT2G34GV,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	4.5 V			e3			2.8 mm	HCT
74AXP2T3407GT,115	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		225 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N8		2.75 V	.5 mm	1 mm		.7 V						1.95 mm	AXP
74HCT3G16GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		29 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8		5.5 V	.5 mm	2 mm		4.5 V		SEATED-HGT NOMINAL				3 mm	HCT
74HCT3G34DP,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	29 ns	4 Amp	Gates	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.5 V			e4	30	260	3 mm	HCT
74AXP1T34GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		210 ns				85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm		.7 V						.8 mm	AXP
74LVC07AD-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		3.3			SMALL OUTLINE		6.5 ns			1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	1.65 V			e4	30	260	8.65 mm	LVC/LCX/Z
74AXP1G07GN	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE		82 ns			.3 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.35 mm	.9 mm		.7 V						1 mm	AXP
74AUP2G34GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.8 ns	1.7 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V			e3	30	260	2 mm	AUP/ULP/V
74HCT3G07DC-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	32 ns	4 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm	Not Qualified	4.5 V						2.3 mm	HCT
74AUP1G17GW,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.1 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V			e3			2.05 mm	AUP/ULP/V
74AUP1G17GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.1 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V			e3			.8 mm	AUP/ULP/V
74AUP1G17GF,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.1 ns	1.7 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74LVC1G34GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		3.3			SMALL OUTLINE, VERY THIN PROFILE		11 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3			1 mm	LVC/LCX/Z
74LVC1G34GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1		3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	11 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
74LVC2G34GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE		10.8 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.35 mm	.9 mm	Not Qualified	1.65 V			e3			1 mm	LVC/LCX/Z
74AHCT1G07GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	4.5 V			e3			2.05 mm	AHCT/VHCT
74LVC3G07GM-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	CHIP CARRIER	LCC8,.06SQ,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		QUAD	S-PQCC-N8		5.5 V			Not Qualified	1.65 V
74HC9115D-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	9	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE	SOP20,.4	33 ns	4 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	6 V	2.65 mm	7.5 mm	Not Qualified	2 V			e4	30	260	12.8 mm	HC/UH
74LVC2G17GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
74LVC2G16GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		1.65 V						2.9 mm	LVC/LCX/Z
HEF4050BT-Q100	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1		5			SMALL OUTLINE		110 ns			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm		3 V						9.9 mm	4000/14000/40000
74AUP2G07GN,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,12	20.7 ns	1.7 Amp	Gates	.3 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N6	1	3.6 V	.35 mm	.9 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74AHCT1G17GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.5 mm		4.5 V						2.9 mm	AHCT/VHCT/VT
74AUP1G07GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1		1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.7 ns	1.7 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74HCT3G34DC,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	29 ns	4 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	4.5 V			e4	30	260	2.3 mm	HCT
74LVC3G17GF,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,14	13.1 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.35 mm	LVC/LCX/Z
74LVC1G07GF,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	8.4 ns	24 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
74HC3G34DP-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	125 ns	4 Amp	Gates	.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	Not Qualified	2 V						3 mm	HC/UH
74AXP1G17GS,125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		136 ns			.35 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm		.7 V						1 mm	AXP
74HC3G34DC-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		125 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		6 V	1 mm	2 mm		2 V						2.3 mm	HC/UH
74LVC3G34GT	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.95 mm	LVC/LCX/Z
74LVC3G17GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3			1.35 mm	LVC/LCX/Z
74LVC3G34GM,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V			e4	30	260	1.6 mm	LVC/LCX/Z
74AXP1T34GN	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE		210 ns			.3 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N6		2.75 V	.35 mm	.9 mm		.7 V						1 mm	AXP
N74F07N	NXP Semiconductors	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6	TTL		1		5	5		IN-LINE	DIP14,.3	7.5 ns	64 Amp	Gates	2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T14		5.5 V	4.2 mm	7.62 mm	Not Qualified	4.5 V	45 mA		e4			19.025 mm	F/FAST
74AXP1G07GM	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V						1.45 mm	AXP
74AHCT1G17GW,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		4.5 V						2.05 mm	AHCT/VHCT/VT
74LVC2G17GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	13.1 ns	24 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	1.65 V			e3	30	260	2.9 mm	LVC/LCX/Z
74AUP1G34GN,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,12	20.8 ns	1.7 Amp	Gates	.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	3.6 V	.35 mm	.9 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.