BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC3G17DC	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	1.65 V			e4	30	260	2.3 mm	LVC/LCX/Z
74LVC3G07DC-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm	Not Qualified	1.65 V						2.3 mm	LVC/LCX/Z
74LVC3G34DC-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm	Not Qualified	1.65 V						2.3 mm	LVC/LCX/Z
74LVC3G07GF,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,14	8.4 ns	24 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.35 mm	LVC/LCX/Z
74LVC3G07GS,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,12	8.4 ns	24 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.35 mm	LVC/LCX/Z
74HCT3G34GD,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.12,20	29 ns	4 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	4.5 V			e4	30	260	3 mm	HCT
N74F07D,602	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	TTL		1		5	5	50 pF	SMALL OUTLINE	SOP14,.25	7.5 ns	64 Amp	Gates	1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V	45 mA	IOL = 64MA @ VOL = 0.5V; IOH = 0.25MA @ VOH = 12V	e4	30	260	8.65 mm	F/FAST
74HC2G34GW-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		6 V	1.1 mm	1.25 mm		2 V						2 mm	HC/UH
74HC4050PW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1		5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	26 ns	4 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	2 V		CMOS-TTL LEVEL TRANSLATOR	e4	30	260	5 mm	HC/UH
74AXP1G17GX,125	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			CHIP CARRIER, VERY THIN PROFILE		136 ns				85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm		.7 V						.8 mm	AXP
74AUP1G34GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		1.1	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,12	20.8 ns	1.7 Amp	Gates	.3 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	3.6 V	.35 mm	.9 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74HC9015DB-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, SHRINK PITCH		32 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		6 V	2 mm	5.3 mm	Not Qualified	2 V						7.2 mm	HC/UH
N74F07AD	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	TTL		1		5		50 pF	SMALL OUTLINE		17 ns			1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel		DUAL	R-PDSO-G14		5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V	45 mA	IOL = 48MA @ VOL = 0.5V; IOH = 0.1MA @ VOH = 30V				8.65 mm	F/FAST
74HCT9015D	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE		48 ns			1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G20		5.5 V	2.65 mm	7.5 mm	Not Qualified	4.5 V						12.8 mm	HCT
74LVC2G17GN,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE	SOLCC6,.04,12	13.1 ns	24 Amp	Gates	.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.35 mm	.9 mm	Not Qualified	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
74AUP2G07GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	.8 V			e3			1 mm	AUP/ULP/V
74LVC3G07GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC8,.06SQ,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V			e4	30	260	1.6 mm	LVC/LCX/Z
74LVC2G17GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	13.1 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
74HC9015N	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	9	CMOS		1		5		50 pF	IN-LINE		32 ns				125 Cel		-40 Cel		DUAL	R-PDIP-T20		6 V			Not Qualified	2 V							HC/UH
74AUP1G17GX,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE	LCC5(UNSPEC)	20.1 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm	Not Qualified	.8 V			e3	30	260	.8 mm	AUP/ULP/V
74LVC07ABQ-Q100X	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	14	QCCN	RECTANGULAR	PLASTIC/EPOXY	NO	YES		CMOS	AEC-Q100		TR	3.3	3.3	50 pF	CHIP CARRIER	LCC14,.1X.12,20		24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		QUAD	R-PQCC-N14					Not Qualified
74LVC3G34GD,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.11,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
74LVC3G17GD	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.11,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
74LVC1G34GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	11 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
74LVC3G17GT	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1		1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.95 mm	LVC/LCX/Z
74AXP2G07GSH	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.35 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm		.7 V						1 mm	AXP
74LVC3G07DP	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	8.4 ns	24 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
74AXP2G07GM	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		82 ns			.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V						1.45 mm	AXP
74HC7014P	NXP Semiconductors	BUFFER	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	CMOS		1		5		50 pF	IN-LINE		175 ns			2.54 mm	125 Cel		-40 Cel		DUAL	R-PDIP-T14		6 V	4.2 mm	7.62 mm	Not Qualified	3 V						19.025 mm	HC/UH
HEF4050BDB	NXP Semiconductors	BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED		NO	6	CMOS		1		5		50 pF	IN-LINE		70 ns			2.54 mm	85 Cel		-40 Cel		DUAL	R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	3 V		CMOS-TTL LEVEL TRANSLATOR					4000/14000/40000
74HC2G16GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		6 V	1.1 mm	1.25 mm		2 V						2 mm	HC/UH
74HC9115PW-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		33 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G20		6 V	1.1 mm	4.4 mm	Not Qualified	2 V						6.5 mm	HC/UH
74AUP2G3407GWH	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.1	1.2/3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	20.8 ns	1.7 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm	Not Qualified	.8 V						2 mm	AUP/ULP/V
74HCT3G07DP	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	32 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.5 V			e4	30	260	3 mm	HCT
74LVC3G34GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3			1.35 mm	LVC/LCX/Z
74HCT9115DB-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, SHRINK PITCH		47 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G20		5.5 V	2 mm	5.3 mm	Not Qualified	4.5 V						7.2 mm	HCT
74HC9115D	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	9	CMOS		1		5	2/6	50 pF	SMALL OUTLINE	SOP20,.4	33 ns	4 Amp	Gates	1.27 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	6 V	2.65 mm	7.5 mm	Not Qualified	2 V			e4	30	260	12.8 mm	HC/UH
74AUP1G17GM-H	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm	Not Qualified	.8 V						1.45 mm	AUP/ULP/V
74AUP2G07GF,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	20.7 ns	1.7 Amp	Gates	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	.8 V			e3	30	260	1 mm	AUP/ULP/V
74AXP1T34GM,125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		210 ns			.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V						1.45 mm	AXP
74LVC07ABQ-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS	AEC-Q100	1		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6.5 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		QUAD	R-PQCC-N14	1	5.5 V	1 mm	1.5 mm		1.65 V						2.5 mm	LVC/LCX/Z
74HC2G17GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	175 ns	4 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	6 V	1.1 mm	1.5 mm	Not Qualified	2 V			e3	30	260	2.9 mm	HC/UH
74LVC3G07GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		3.3			SMALL OUTLINE		8.4 ns			.3 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V			e3			1.2 mm	LVC/LCX/Z
74LVC2G07GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
74AUP1G07GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.7 ns			.35 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	.8 V			e3			1 mm	AUP/ULP/V
74AUP1G34GX,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE	LCC5(UNSPEC)	20.8 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm	Not Qualified	.8 V			e3	30	260	.8 mm	AUP/ULP/V
74AUP2G3407GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.8 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm		.8 V						2 mm	AUP/ULP/V
74LVC3G07GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC8,.06SQ,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		QUAD	S-PQCC-N8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V				30	260	1.6 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.