BUFFER Logic Gates 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
933999100623	NXP Semiconductors	BUFFER	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	TTL		1		5			SMALL OUTLINE		7.5 ns			1.27 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.5 V		e4			8.65 mm	F/FAST
935281037125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		6 V	1.1 mm	1.5 mm		2 V		e3			2.8 mm	HC/UH
935291716132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE		20.7 ns			.3 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.35 mm	.9 mm		.8 V		e3			1 mm	AUP/ULP/V
935277249115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			CHIP CARRIER, VERY THIN PROFILE		13.1 ns			.55 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N8		5.5 V	.5 mm	1.6 mm		1.65 V					1.6 mm	LVC/LCX/Z
935267470125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12.5 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V		e3			2 mm	AHC
935277251115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			CHIP CARRIER, VERY THIN PROFILE		10.8 ns			.5 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N8		5.5 V	.5 mm	1.6 mm		1.65 V					1.6 mm	LVC/LCX/Z
935299052125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm		1.65 V		e3			2 mm	LVC/LCX/Z
935275563125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		13.1 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V		e4			2.3 mm	LVC/LCX/Z
935277164132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		10.8 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		e3			1.45 mm	LVC/LCX/Z
935272029125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		7 ns			.95 mm	125 Cel	OPEN-DRAIN	-40 Cel	PURE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	1.65 V					2.9 mm	LVC/LCX/Z
935302025125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		6 V	1.1 mm	1.5 mm		2 V					2.9 mm	HC/UH
935280517132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		33.5 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		1.1 V		e3			1.45 mm	AUP/ULP/V
935280516125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		33.5 ns			.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		1.1 V		e3			2.05 mm	AUP/ULP/V
935281112132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V		e3			1 mm	AUP/ULP/V
935270081125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.5 mm		1.65 V		e3			2.9 mm	LVC/LCX/Z
935059840112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1					SMALL OUTLINE		715 ns			1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	6 V	1.75 mm	3.9 mm	Not Qualified	3 V		e4			8.65 mm	HC/UH
933999110602	NXP Semiconductors	BUFFER	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	TTL		1		5			IN-LINE		7.5 ns			2.54 mm	70 Cel	OPEN-COLLECTOR	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T14		5.5 V	4.2 mm	7.62 mm	Not Qualified	4.5 V		e4			19.025 mm	F/FAST
935278935115	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE, VERY THIN PROFILE		13.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8		5.5 V	.5 mm	1 mm		1.65 V		e3			1.95 mm	LVC/LCX/Z
933824710005	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD			UNSPECIFIED	UNSPECIFIED		YES	6	CMOS		1		5			UNCASED CHIP		130 ns				125 Cel		-40 Cel		UPPER	X-XUUC-N		6 V			Not Qualified	2 V						HC/UH
74HCT3G07DC	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	32 ns	4 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	5.5 V	1 mm	2 mm	Not Qualified	4.5 V		e4	30	260	2.3 mm	HCT
74LVC3G34GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8			SMALL OUTLINE		10.8 ns			.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.35 mm	1 mm	Not Qualified	1.65 V		e3			1.2 mm	LVC/LCX/Z
74AUP1G34GW-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1		1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.8 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		3.6 V	1.1 mm	1.25 mm		.8 V					2.05 mm	AUP/ULP/V
74LVC3G07GD,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1		1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.11,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	2 mm	Not Qualified	1.65 V		e4	30	260	3 mm	LVC/LCX/Z
74AUP2G17GM-H	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	3.3	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,20	20.1 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		3.6 V			Not Qualified	.8 V
74LVC3G34DP	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	10.8 ns	24 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	1.65 V		e4	30	260	3 mm	LVC/LCX/Z
74HCT2G17GV-G	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		175 ns			.95 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G6	1	6 V	1.1 mm	1.5 mm	Not Qualified	2 V		e3			2.9 mm	HCT
74LVC2G34GV	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	10.8 ns	24 Amp	Gates	.95 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified	1.65 V		e3	30	260	2.9 mm	LVC/LCX/Z
74HC4050D-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1		5		50 pF	SMALL OUTLINE		26 ns				125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V			Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e4	30	260		HC/UH
74HC3G34DP-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns			.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm		2 V					3 mm	HC/UH
74LVC1G34GN,132	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE	SOLCC6,.04,12	11 ns	24 Amp	Gates	.3 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.35 mm	.9 mm	Not Qualified	1.65 V		e3	30	260	1 mm	LVC/LCX/Z
HEF4050BTD	NXP Semiconductors	BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	BULK	5	5/15	50 pF	SMALL OUTLINE	SOP16,.25	70 ns		Gates	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	3 V	CMOS-TTL LEVEL TRANSLATOR	e4			9.9 mm	4000/14000/40000
74HC3G07DC-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		125 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		6 V	1 mm	2 mm		2 V					2.3 mm	HC/UH
74HCT3G07DC-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		32 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		4.5 V					2.3 mm	HCT
74LVC2G34GF	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS		1	TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	10.8 ns	24 Amp	Gates	.35 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	S-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1 mm	LVC/LCX/Z
74AXP2T3407GN,115	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2			SMALL OUTLINE		225 ns			.3 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N8		2.75 V	.35 mm	1 mm		.7 V					1.2 mm	AXP
74AUP2G16GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		3.6 V	.5 mm	1 mm		.8 V					1.45 mm	AUP/ULP/V
74AUP1G17GN	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		1		1.1	1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,12	20.1 ns	1.7 Amp	Gates	.3 mm	125 Cel		-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	3.6 V	.35 mm	.9 mm	Not Qualified	.8 V		e3	30	260	1 mm	AUP/ULP/V
74AXP1G17GM	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		136 ns			.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N6		2.75 V	.5 mm	1 mm		.7 V					1.45 mm	AXP
74AUP2G34GS	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		20.8 ns			.35 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	.8 V		e3			1 mm	AUP/ULP/V
74HCT9115PW-T	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	9	CMOS		1		5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		47 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G20		5.5 V	1.1 mm	4.4 mm	Not Qualified	4.5 V					6.5 mm	HCT
74HCT3G34DC-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	5	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	29 ns	4 Amp	Gates	.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm	Not Qualified	4.5 V					2.3 mm	HCT
74HC3G07DP-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	AEC-Q100	1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	125 ns	4 Amp	Gates	.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	Not Qualified	2 V					3 mm	HC/UH
74LVC3G34DC-Q100	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		10.8 ns			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V					2.3 mm	LVC/LCX/Z
74HC4050PW,112	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	6	CMOS		1	TUBE	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	26 ns	4 Amp	Gates	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	2 V	CMOS-TTL LEVEL TRANSLATOR	e4	30	260	5 mm	HC/UH
74AUP2G16GW	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.1			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		20.8 ns			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm		.8 V					2 mm	AUP/ULP/V
74LVC3G07DC-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		8.4 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1 mm	2 mm		1.65 V					2.3 mm	LVC/LCX/Z
74LVC1G07GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-COLLECTOR	-40 Cel	Tin (Sn)	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	Not Qualified	1.65 V		e3	30	260	1.45 mm	LVC/LCX/Z
74HC2G34GV-Q100H	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS	AEC-Q100	1	TR	5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37	125 ns	4 Amp	Gates	.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		6 V	1.1 mm	1.5 mm	Not Qualified	2 V					2.9 mm	HC/UH

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.