PAGE MODE DRAM DRAM 684

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

TMM41256AP-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65 mA

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

262144 bit

e0

150 ns

TMM41256AT-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

18

QCCJ

256

RECTANGULAR

PLASTIC/EPOXY

YES

MOS

J BEND

72 mA

262144 words

SEPARATE

5

5

1

CHIP CARRIER

LDCC18,.33X.53

DRAMs

1.27 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQCC-J18

Not Qualified

262144 bit

e0

120 ns

TMM4164P-4

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

65536 bit

e0

200 ns

TC524257P-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

DUAL

2

R-PDIP-T28

5.5 V

4.45 mm

10.16 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

120 ns

TMM41464AZ-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

20

ZIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

80 mA

65536 words

COMMON

5

5

4

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T20

Not Qualified

262144 bit

e0

100 ns

TMM411000C-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

1048576 bit

e0

120 ns

TC524257Z-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

28

ZIP

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

1.27 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

ZIG-ZAG

2

R-PZIP-T28

5.5 V

10.16 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

36.2 mm

120 ns

TMM41256C-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

262144 bit

e0

150 ns

TMM41256T-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

18

QCCJ

256

RECTANGULAR

PLASTIC/EPOXY

YES

MOS

J BEND

262144 words

SEPARATE

5

5

1

CHIP CARRIER

LDCC18,.33X.53

DRAMs

1.27 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQCC-J18

Not Qualified

262144 bit

e0

150 ns

TMM41464AZ-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

20

ZIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65 mA

65536 words

COMMON

5

5

4

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T20

Not Qualified

262144 bit

e0

150 ns

TMM41256P-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

262144 bit

e0

120 ns

TC524257J-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J32

5.5 V

3.6 mm

10.2 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

21 mm

100 ns

TC524257P-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

DUAL

2

R-PDIP-T28

5.5 V

4.45 mm

10.16 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

100 ns

TMM4164AP-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

65536 bit

e0

150 ns

TMM416P-2

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

16384 bit

e0

150 ns

TMM41464AP-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

18

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

80 mA

65536 words

COMMON

5

5

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

262144 bit

e0

100 ns

TC524256J-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J32

5.5 V

3.6 mm

10.2 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

21 mm

120 ns

TMM41256AZ-12

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

ZIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

72 mA

262144 words

SEPARATE

5

5

1

IN-LINE

ZIP16,.1

DRAMs

1.27 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T16

Not Qualified

262144 bit

e0

120 ns

TMM411000C-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

1048576 bit

e0

100 ns

TMM416P-3

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

16384 bit

e0

200 ns

TMM41256AZ-15

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

ZIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65 mA

262144 words

SEPARATE

5

5

1

IN-LINE

ZIP16,.1

DRAMs

1.27 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T16

Not Qualified

262144 bit

e0

150 ns

TC524256J-10

Toshiba

PAGE MODE DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

256KX4

256K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J32

5.5 V

3.6 mm

10.2 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

e0

21 mm

100 ns

UPD416-2

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

200 ns

UPD41464C-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

18

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

85 mA

65536 words

COMMON

5

5

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

262144 bit

e0

80 ns

MC-41256A9B-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

30

SIMM

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

NO LEAD

810 mA

262144 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

256KX9

256K

0 Cel

SINGLE

R-PSMA-N30

16.7894 mm

Not Qualified

2359296 bit

80 ns

UPD411000C-10

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

1048576 bit

e0

100 ns

MC-411000A1A-12

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

22

256

PLASTIC/EPOXY

NO

MOS

1048576 words

SEPARATE

1

SIP22,.2

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

Not Qualified

1048576 bit

e0

120 ns

MC-41256A8B-12

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

30

SIMM

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

NO LEAD

262144 words

COMMON

5

5

8

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

SINGLE

R-PSMA-N30

16.7894 mm

Not Qualified

2097152 bit

120 ns

UPD41256D-15

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

262144 bit

e0

150 ns

MC-424256A36F-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

72

SIMM

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

960 mA

262144 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

256KX36

256K

0 Cel

SINGLE

R-PSMA-N72

25.4 mm

Not Qualified

9437184 bit

.008 Amp

80 ns

MC-424256A36B-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

72

SIMM

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

960 mA

262144 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

256KX36

256K

0 Cel

SINGLE

R-PSMA-N72

25.4 mm

Not Qualified

9437184 bit

.008 Amp

80 ns

MC-42256AB9BA-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

30

SIMM

256

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

210 mA

262144 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

256KX9

256K

0 Cel

SINGLE

R-PSMA-N30

16.7894 mm

Not Qualified

2359296 bit

.003 Amp

80 ns

UPD2118D-2

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL EXTENDED

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

22 mA

16384 words

SEPARATE

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

80 Cel

3-STATE

16KX1

16K

-10 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

120 ns

MC-41256A5C-12

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

24

256

CERAMIC

NO

MOS

262144 words

SEPARATE

5

5

5

SIP24,.2

DRAMs

2.54 mm

70 Cel

3-STATE

256KX5

256K

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

Not Qualified

1310720 bit

e0

120 ns

UPD414C-1

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

64

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

4096 words

SEPARATE

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

4KX1

4K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

4096 bit

e0

250 ns

UPD2118D-3

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL EXTENDED

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

25 mA

16384 words

SEPARATE

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

80 Cel

3-STATE

16KX1

16K

-10 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

100 ns

UPD414256C-12

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

262144 words

COMMON

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

1048576 bit

e0

120 ns

UPD4265C-20

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

65536 words

SEPARATE

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

65536 bit

e0

200 ns

UPD41464L-10

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

18

QCCJ

256

RECTANGULAR

PLASTIC/EPOXY

YES

MOS

J BEND

80 mA

65536 words

COMMON

5

5

4

CHIP CARRIER

LDCC18,.33X.53

DRAMs

1.27 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQCC-J18

Not Qualified

262144 bit

e0

100 ns

MC-42256AB9FA-60

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

30

SIMM

256

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

270 mA

262144 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

256KX9

256K

0 Cel

SINGLE

R-PSMA-N30

16.7894 mm

Not Qualified

2359296 bit

.003 Amp

60 ns

MC-411000A1A-15

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

22

256

PLASTIC/EPOXY

NO

MOS

1048576 words

SEPARATE

1

SIP22,.2

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

Not Qualified

1048576 bit

e0

150 ns

UPD41464V-10

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

20

ZIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65536 words

COMMON

5

5

4

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T20

Not Qualified

262144 bit

e0

100 ns

UPD416D

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

300 ns

MC-41256A9A-12

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

30

256

PLASTIC/EPOXY

NO

MOS

262144 words

COMMON

5

5

9

SIP30,.2

DRAMs

2.54 mm

70 Cel

3-STATE

256KX9

256K

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

18.0086 mm

Not Qualified

2359296 bit

e0

120 ns

UPD4164C-1

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

65536 bit

e0

250 ns

UPD2118C-2

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL EXTENDED

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

22 mA

16384 words

SEPARATE

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

80 Cel

3-STATE

16KX1

16K

-10 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

16384 bit

e0

120 ns

UPD41416-20

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

18

DIP

128

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

45 mA

16384 words

COMMON

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX4

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

65536 bit

e0

200 ns

MC-424512A36B-80

Renesas Electronics

PAGE MODE DRAM

COMMERCIAL

72

SIMM

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1024 mA

524288 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

512KX36

512K

0 Cel

SINGLE

R-PSMA-N72

25.4 mm

Not Qualified

18874368 bit

.016 Amp

80 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.