Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
100663296 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
96MX16 |
96M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
1610612736 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX18 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
603979776 bit |
2.37 V |
SELF CONTAINED REFRESH |
53.3 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX18 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
53.3 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX16 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
2147483648 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX16 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
2147483648 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
32MX32 |
32M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
1073741824 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX18 |
32M |
DUAL |
R-PDMA-N184 |
800 MHz |
Not Qualified |
603979776 bit |
45 ns |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
84 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX18 |
64M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
1207959552 bit |
2.37 V |
53 ns |
|||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM232,40 |
DRAMs |
1 mm |
3-STATE |
64MX32 |
64M |
DUAL |
1 |
R-XDMA-N232 |
1 |
2.63 V |
1200 MHz |
Not Qualified |
2147483648 bit |
2.37 V |
SELF CONTAINED REFRESH |
32 ns |
||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX18 |
64M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
711 MHz |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX18 |
64M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
84 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
8MX18 |
8M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
150994944 bit |
2.37 V |
||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
100663296 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
96MX18 |
96M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
1811939328 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX18 |
32M |
DUAL |
R-PDMA-N184 |
800 MHz |
Not Qualified |
603979776 bit |
40 ns |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
R-PDMA-N184 |
600 MHz |
Not Qualified |
536870912 bit |
53 ns |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
32MX18 |
32M |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.63 V |
Not Qualified |
603979776 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
536870912 bit |
2.37 V |
SELF CONTAINED REFRESH |
53 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
36 |
MICROELECTRONIC ASSEMBLY |
DIMM232,40 |
DRAMs |
1 mm |
3-STATE |
64MX36 |
64M |
DUAL |
1 |
R-XDMA-N232 |
1 |
2.63 V |
1200 MHz |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
32 ns |
||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
536870912 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
36 |
MICROELECTRONIC ASSEMBLY |
32MX36 |
32M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX16 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
2147483648 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
|
Samsung |
RAMBUS DRAM MODULE |
160 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM160,25 |
DRAMs |
.635 mm |
3-STATE |
64MX18 |
64M |
DUAL |
1 |
R-XDMA-N160 |
2.63 V |
800 MHz |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
45 ns |
||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
50331648 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
48MX18 |
48M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
711 MHz |
Not Qualified |
905969664 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX16 |
64M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
711 MHz |
Not Qualified |
1073741824 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
32MX32 |
32M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
1073741824 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
32MX32 |
32M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
1073741824 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
50331648 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
48MX16 |
48M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
805306368 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX18 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
134217728 words |
COMMON |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX18 |
128M |
DUAL |
R-PDMA-N184 |
600 MHz |
Not Qualified |
2415919104 bit |
|||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
100663296 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
96MX16 |
96M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
1610612736 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
128MX32 |
128M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
4294967296 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
32MX18 |
32M |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.63 V |
Not Qualified |
603979776 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
536870912 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
84 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
8MX18 |
8M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
150994944 bit |
2.37 V |
45 ns |
|||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
536870912 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
|
Samsung |
RAMBUS DRAM MODULE |
COMMERCIAL |
232 |
DIMM |
32768 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2270 mA |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
36 |
MICROELECTRONIC ASSEMBLY |
DIMM232,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX36 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
400 MHz |
Not Qualified |
4831838208 bit |
2.37 V |
SELF CONTAINED REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
1.464 Amp |
40 ns |
||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
201326592 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
192MX18 |
192M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
600 MHz |
Not Qualified |
3623878656 bit |
2.37 V |
SELF CONTAINED REFRESH |
53.3 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
200 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
64MX18 |
64M |
UNSPECIFIED |
1 |
R-XXMA-X200 |
2.63 V |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
84 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
16MX18 |
16M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
Not Qualified |
301989888 bit |
2.37 V |
SELF REFRESH |
||||||||||||||||||||||||||||||||||
|
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
16384 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3940 mA |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM232,40 |
DRAMs |
1 mm |
3-STATE |
128MX32 |
128M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
4294967296 bit |
2.37 V |
SELF CONTAINED REFRESH |
1.606 Amp |
32 ns |
||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
128MX32 |
128M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
4294967296 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
232 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
32 |
MICROELECTRONIC ASSEMBLY |
64MX32 |
64M |
DUAL |
1 |
R-XDMA-N232 |
2.63 V |
Not Qualified |
2147483648 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
128MX18 |
128M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
711 MHz |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX16 |
64M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
800 MHz |
Not Qualified |
1073741824 bit |
2.37 V |
SELF CONTAINED REFRESH |
45 ns |
|||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX18 |
64M |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.63 V |
1066 MHz |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
32 ns |
||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
512MX18 |
512M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
Not Qualified |
9663676416 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
256MX16 |
256M |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.63 V |
800 MHz |
Not Qualified |
4294967296 bit |
2.37 V |
SELF CONTAINED REFRESH |
40 ns |
||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
50331648 words |
2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
48MX16 |
48M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
Not Qualified |
805306368 bit |
2.37 V |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.