Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
DDR1 DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1820 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.34 Amp |
.75 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.8 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1560 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN SILVER COPPER |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
267 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
.5 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
333 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.128 Amp |
.45 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3240 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
2.7 V |
166 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.08 Amp |
.7 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1800 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
200 MHz |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
e0 |
.65 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1120 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.032 Amp |
.4 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.4 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1160 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
267 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.12 Amp |
.5 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1440 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.75 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2760 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
333 MHz |
Not Qualified |
17179869184 bit |
1.7 V |
AUTO/SELF REFRESH |
.128 Amp |
.45 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1400 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.02 Amp |
.75 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1520 mA |
16777216 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
200 MHz |
Not Qualified |
1073741824 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
||||||||||||||||||||
Samsung |
CACHE DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1820 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
1 |
166 MHz |
Not Qualified |
4294967296 bit |
.7 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1120 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
333 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
.45 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.7 ns |
||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1360 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
.4 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1080 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
200 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.6 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1120 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.06 Amp |
.4 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1900 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.03 Amp |
.7 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1120 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
3.8 mm |
333 MHz |
30 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
67.6 mm |
.45 ns |
|||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2930 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.05 Amp |
.75 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1200 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
3.8 mm |
400 MHz |
30 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.12 Amp |
67.6 mm |
.4 ns |
|||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR2 DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2400 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
333 MHz |
Not Qualified |
17179869184 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.24 Amp |
.4 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1380 mA |
8388608 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.012 Amp |
.7 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2430 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3.6 V |
100 MHz |
Not Qualified |
1207959552 bit |
3 V |
AUTO/SELF REFRESH |
.02 Amp |
7 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
2.7 V |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1600 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.024 Amp |
.7 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1140 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
200 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.064 Amp |
.6 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1440 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.75 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1560 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.04 Amp |
.75 ns |
||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
200 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
128MX18 |
128M |
UNSPECIFIED |
1 |
R-XXMA-X200 |
2.63 V |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.025 Amp |
.7 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3040 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
960 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
200 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.6 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2680 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1520 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.7 ns |
|||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
30.15 mm |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX72 |
16M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
235 |
.9 ns |
|||||||||||||||||||||||||||
Micron Technology |
INDUSTRIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3150 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
85 Cel |
3-STATE |
64MX72 |
64M |
-40 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
4831838208 bit |
.045 Amp |
.75 ns |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.75 ns |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1452 mA |
16777216 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
1073741824 bit |
.024 Amp |
.75 ns |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
16777216 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
1207959552 bit |
.02 Amp |
.75 ns |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2200 mA |
16777216 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
MATTE TIN |
DUAL |
R-PDMA-N200 |
1 |
125 MHz |
Not Qualified |
1073741824 bit |
e3 |
.024 Amp |
.8 ns |
|||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4160 mA |
67108864 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
200 MHz |
Not Qualified |
4294967296 bit |
.064 Amp |
.7 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2925 mA |
16777216 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
1207959552 bit |
.75 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1300 mA |
33554432 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
65 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N200 |
267 MHz |
Not Qualified |
2147483648 bit |
260 |
.02 Amp |
.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.