Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1200 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3280 mA |
536870912 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
R-PDMA-N200 |
3 |
400 MHz |
Not Qualified |
34359738368 bit |
260 |
.128 Amp |
.4 ns |
||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3330 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ns |
|||||||||||||||||
Samsung |
LPDDR4 DRAM |
200 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
536870912 words |
32 |
GRID ARRAY |
512MX32 |
512M |
BOTTOM |
1 |
R-PBGA-B200 |
17179869184 bit |
||||||||||||||||||||||||||||||||||||||||
Samsung |
DDR1 DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1820 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.34 Amp |
.75 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1320 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
200 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
.06 Amp |
.6 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
|||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2520 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1500 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN SILVER COPPER |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
200 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.6 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
2.7 V |
Not Qualified |
8589934592 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
2.7 V |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1580 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
TIN SILVER COPPER |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
333 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.12 Amp |
.45 ns |
||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
333 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.128 Amp |
.45 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1600 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
200 MHz |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.65 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
960 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
267 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.5 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.7 ns |
||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1020 mA |
8388608 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
100 MHz |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.01 Amp |
.8 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1400 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
333 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
.032 Amp |
.45 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.025 Amp |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1720 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
333 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
.08 Amp |
.45 ns |
|||||||||||||||||
Samsung |
CACHE DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1640 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
1 |
133 MHz |
Not Qualified |
4294967296 bit |
.75 ns |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1350 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N200 |
100 MHz |
Not Qualified |
603979776 bit |
.011 Amp |
6 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2040 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
200 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.128 Amp |
.6 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3120 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.08 Amp |
.75 ns |
|||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1080 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
200 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.6 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ns |
||||||||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
200 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
128MX18 |
128M |
UNSPECIFIED |
1 |
R-XXMA-X200 |
2.63 V |
Not Qualified |
2415919104 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3280 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
30 mm |
400 MHz |
3.8 mm |
Not Qualified |
34359738368 bit |
1.7 V |
AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM |
260 |
.24 Amp |
67.6 mm |
.4 ns |
|||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1400 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
333 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
.06 Amp |
.45 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2240 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.4 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
860 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
200 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.6 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1400 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
||||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
200 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
64MX18 |
64M |
UNSPECIFIED |
1 |
R-XXMA-X200 |
2.63 V |
Not Qualified |
1207959552 bit |
2.37 V |
SELF CONTAINED REFRESH |
||||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ns |
||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1360 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.064 Amp |
.4 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1580 mA |
8388608 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.012 Amp |
.7 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1600 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
200 MHz |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.65 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1460 mA |
8388608 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.012 Amp |
.75 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1080 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
333 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.45 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
2.7 V |
Not Qualified |
8589934592 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
|||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1840 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
267 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
230 |
.064 Amp |
.5 ns |
|||||||||||||||||
Samsung |
LPDDR4 DRAM |
COMMERCIAL EXTENDED |
200 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
NO |
1.1 |
32 |
85 Cel |
256MX32 |
256M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B200 |
8589934592 bit |
|||||||||||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
.8 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.