BGA DRAM 903

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT46H32M32LFMB-5AIT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46V16M16FG-75ZLHIT

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

16777216 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

133 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT46V32M4FJ-6T

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

355 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

134217728 bit

e0

.003 Amp

2,4,8

.7 ns

MT46H32M32LGMB-6AIT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H32M32LGMB-75AAT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

105 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

6 ns

MT40A8G4CLU-062H:ETR

Micron Technology

DDR4 DRAM

OTHER

78

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8589934592 words

YES

1.2

4

GRID ARRAY

95 Cel

8GX4

8G

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

34359738368 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

MT47H512M4-25:E

Micron Technology

DDR2 DRAM

OTHER

63

BGA

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

4

GRID ARRAY

85 Cel

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B63

1.9 V

Not Qualified

1073741824 bit

1.7 V

SELF CONTAINED REFRESH

MT46V64M4FJ-8

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

125 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT46V64M4FG-6T

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT40A4G4DVN-068H:E

Micron Technology

DDR4 DRAM

OTHER

78

BGA

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4294967296 words

YES

1.2

4

GRID ARRAY

95 Cel

4GX4

4G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

17179869184 bit

1.14 V

AUTO/SELF REFRESH

MT47H64M16HR-25EV:H

Micron Technology

DDR2 DRAM

OTHER

84

BGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

ASYNCHRONOUS

67108864 words

YES

16

GRID ARRAY

85 Cel

64MX16

64M

0 Cel

BOTTOM

1

R-PBGA-B84

1073741824 bit

SELF REFRESH

MT46H32M32LFMB-75AAT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

105 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

6 ns

MT44K64M18RCT-125E

Micron Technology

DDR DRAM

168

BGA

UNSPECIFIED

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

1.35

18

GRID ARRAY

64MX18

64M

TIN SILVER COPPER

BOTTOM

1

X-PBGA-B168

1207959552 bit

e1

MT46H32M32LGMB-75IT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

6 ns

MT46V64M4FG-6TL

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT46H16M16LGBF-75AT:H

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY

105 Cel

16MX16

16M

-40 Cel

BOTTOM

1

R-PBGA-B60

1.95 V

268435456 bit

1.7 V

AUTO/SELF REFRESH

6 ns

MT46V64M4BG-6TL

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

268435456 bit

260

2,4,8

MT47H128M8CF-25S:H

Micron Technology

DDR2 DRAM

OTHER

60

BGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

ASYNCHRONOUS

134217728 words

YES

8

GRID ARRAY

85 Cel

128MX8

128M

0 Cel

BOTTOM

1

R-PBGA-B60

1073741824 bit

SELF REFRESH

MT44K64M18RCT-125IT

Micron Technology

DDR DRAM

168

BGA

UNSPECIFIED

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

1.35

18

GRID ARRAY

64MX18

64M

TIN SILVER COPPER

BOTTOM

1

X-PBGA-B168

1207959552 bit

e1

MT46H32M32LGMB-54IT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46V64M4FJ-6T

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT46V32M16FN-5BLIT:D

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

480 mA

33554432 words

2,4,8

COMMON

2.6

2.6

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.7 ns

MT46V16M16FG-6LHIT

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

16777216 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

268435456 bit

e0

2,4,8

MT46H32M32LFMB-54IT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46V32M16BN-5BLIT:D

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

480 mA

33554432 words

2,4,8

COMMON

2.6

2.6

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

MT46V32M4BJ-6TLIT

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

355 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B60

167 MHz

Not Qualified

134217728 bit

.003 Amp

2,4,8

.7 ns

MT46H32M32LFMB-54:B

Micron Technology

LPDDR1 DRAM

COMMERCIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

70 Cel

32MX32

32M

0 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H32M32LGMB-6AAT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

105 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H32M32LFMB-6:B

Micron Technology

LPDDR1 DRAM

COMMERCIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

70 Cel

32MX32

32M

0 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H8M32LFB5-6AT:H

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

1.8

32

GRID ARRAY

105 Cel

8MX32

8M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

268435456 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H16M16LGBF-6AT:H

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY

105 Cel

16MX16

16M

-40 Cel

BOTTOM

1

R-PBGA-B60

1.95 V

268435456 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H8M32LGB5-5AT:H

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

1.8

32

GRID ARRAY

105 Cel

8MX32

8M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

268435456 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H32M32LFMB-5AT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

105 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H32M32LGMB-5AAT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

152

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY

105 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B152

1.95 V

1073741824 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46H4M32LFB5-5AT:K

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

1.8

32

GRID ARRAY

105 Cel

4MX32

4M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

134217728 bit

1.7 V

AUTO/SELF REFRESH

5 ns

MT46V32M16FN-6L:D

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

405 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.7 ns

MT46V32M16BN-6IT:D

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

405 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

MT46V32M16FN-6LIT:D

Micron Technology

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

405 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.7 ns

MT46V32M16BN-6L:D

Micron Technology

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

405 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.