SOP DRAM 313

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT4LC16M4A7TW-6

Micron Technology

FAST PAGE DRAM

COMMERCIAL

34

SOP

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

120 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE

TSOP(UNSPEC)

DRAMs

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G34

3.6 V

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

60 ns

MT4LC16M4T8TW-6

Micron Technology

FAST PAGE DRAM

COMMERCIAL

34

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

160 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE

TSOP(UNSPEC)

DRAMs

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G34

3.6 V

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

60 ns

MT45C8128DJ-10

Micron Technology

COMMERCIAL

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

60 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE

SO32(UNSPEC)

Other Memory ICs

70 Cel

3-STATE

128KX8

128K

4.5 V

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G32

Not Qualified

1048576 bit

e0

.0002 Amp

100 ns

MT4C10016TG-6V

Micron Technology

FAST PAGE DRAM

COMMERCIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

3.3

3.3

1

SMALL OUTLINE

SO(UNSPEC)

DRAMs

70 Cel

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

60 ns

MT45C8128G-10

Micron Technology

COMMERCIAL

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

60 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE

SOP32,.5

Other Memory ICs

1.27 mm

70 Cel

3-STATE

128KX8

128K

4.5 V

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G32

Not Qualified

1048576 bit

e0

.0002 Amp

100 ns

MT4C10016TG-8VIT

Micron Technology

FAST PAGE DRAM

INDUSTRIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

3.3

3.3

1

SMALL OUTLINE

SO(UNSPEC)

DRAMs

85 Cel

3-STATE

16MX1

16M

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

80 ns

MT4C10017TG-5

Micron Technology

STATIC COLUMN DRAM

COMMERCIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SO(UNSPEC)

SRAMs

70 Cel

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

50 ns

MT4LC16M4A7TW-5

Micron Technology

FAST PAGE DRAM

COMMERCIAL

34

SOP

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

130 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE

TSOP(UNSPEC)

DRAMs

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G34

3.6 V

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

50 ns

MT4LC8M8B6TW-6

Micron Technology

FAST PAGE DRAM

COMMERCIAL

34

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

165 mA

8388608 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

TSOP(UNSPEC)

DRAMs

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G34

3.6 V

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

60 ns

MT4C10016TG-6IT

Micron Technology

FAST PAGE DRAM

INDUSTRIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SO(UNSPEC)

DRAMs

85 Cel

3-STATE

16MX1

16M

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

60 ns

MT4C10017TG-7V

Micron Technology

STATIC COLUMN DRAM

COMMERCIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

3.3

3.3

1

SMALL OUTLINE

SO(UNSPEC)

SRAMs

70 Cel

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

70 ns

MT42C256K16A1SG-6TR

Micron Technology

VIDEO DRAM

COMMERCIAL

64

SOP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

262144 words

5

16

SMALL OUTLINE

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-G64

5.5 V

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 16 SAM PORT

e0

60 ns

MT4LC8M8E1TW-7

Micron Technology

FAST PAGE DRAM

COMMERCIAL

34

SOP

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

115 mA

8388608 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

TSOP(UNSPEC)

DRAMs

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G34

3.6 V

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

70 ns

MT4C10017TG-8VIT

Micron Technology

STATIC COLUMN DRAM

INDUSTRIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

3.3

3.3

1

SMALL OUTLINE

SO(UNSPEC)

SRAMs

85 Cel

3-STATE

16MX1

16M

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

80 ns

MT4C10016TG-7

Micron Technology

FAST PAGE DRAM

COMMERCIAL

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SO(UNSPEC)

DRAMs

70 Cel

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

Not Qualified

16777216 bit

e0

70 ns

MT48LC4M16A2-8E

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

SOP

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

190 mA

4194304 words

1,2,4,8,FP

COMMON

3.3

3.3

16

SMALL OUTLINE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G54

3.6 V

125 MHz

Not Qualified

67108864 bit

3 V

e3

.002 Amp

1,2,4,8

6 ns

MT48LC1M16A1-7S

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

50

SOP

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

1048576 words

3.3

16

SMALL OUTLINE

70 Cel

1MX16

1M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G50

3.6 V

Not Qualified

16777216 bit

3 V

e3

5.5 ns

MT48LC2M32B2-7S

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

86

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

3.3

32

SMALL OUTLINE

70 Cel

2MX32

2M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G86

3.6 V

Not Qualified

67108864 bit

3 V

e3

5.5 ns

MT48LC8M8A2-75L

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

3.3

8

SMALL OUTLINE

70 Cel

8MX8

8M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G54

3.6 V

Not Qualified

67108864 bit

3 V

e3

5.4 ns

MT48LC4M16A2-7EL

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

3.3

16

SMALL OUTLINE

70 Cel

4MX16

4M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G54

3.6 V

Not Qualified

67108864 bit

3 V

e3

5.4 ns

MT48LC2M32B2-8AS

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

86

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

3.3

32

SMALL OUTLINE

70 Cel

2MX32

2M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G86

3.6 V

Not Qualified

67108864 bit

3 V

e3

6 ns

MT48LC1M16A1-8AS

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

50

SOP

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

1048576 words

3.3

16

SMALL OUTLINE

70 Cel

1MX16

1M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G50

3.6 V

Not Qualified

16777216 bit

3 V

e3

6 ns

MT48LC16M4A2-8EL

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

3.3

4

SMALL OUTLINE

70 Cel

16MX4

16M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G54

3.6 V

Not Qualified

67108864 bit

3 V

e3

6 ns

MT48LC2M32B2-6S

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

86

SOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

3.3

32

SMALL OUTLINE

70 Cel

2MX32

2M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G86

3.6 V

Not Qualified

67108864 bit

3 V

e3

5 ns

MT48LC1M16A1-6S

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

50

SOP

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

1048576 words

3.3

16

SMALL OUTLINE

70 Cel

1MX16

1M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G50

3.6 V

Not Qualified

16777216 bit

3 V

e3

5.5 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.