TBGA DRAM 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

TC59LM906AMB-50

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

24 ns

TC59LM914AMG-45

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

400 mA

33554432 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

222 MHz

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.085 Amp

2,4

16.5 mm

.6 ns

TC59LM836DKB-33

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

36

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX36

8M

0 Cel

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

18.5 mm

.5 ns

TC59YM916AMG32A

Toshiba

RAMBUS DRAM

108

TBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE

1.27 mm

32MX16

32M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B108

1.86 V

1.2 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

e1

TC59LM836DKB-40

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

36

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX36

8M

0 Cel

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

18.5 mm

.6 ns

TC59LM818DMG-30

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2,4

YES

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

250 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e1

2,4

16.5 mm

.5 ns

TC59LM913AMG-50

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

2,4

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

200 MHz

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.65 ns

TC59LM906AMB-45

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

8

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

222 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

16.5 mm

22 ns

TC59YM916AMG32B

Toshiba

RAMBUS DRAM

108

TBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE

1.27 mm

32MX16

32M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B108

1.86 V

1.2 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

e1

TC59LM914AMG-50

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

350 mA

33554432 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.625 V

1.2 mm

200 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.08 Amp

2,4

16.5 mm

.65 ns

TC59LM818DMB-40

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

18

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX18

16M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

.65 ns

TC59LM914AMB-50

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

24 ns

TC59LM836DKG-30

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

850 mA

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

8MX36

8M

0 Cel

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

333 MHz

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

18.5 mm

.5 ns

TC59LM836DMB-30

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

8MX36

8M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

250 MHz

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

18.5 mm

.5 ns

TC59LM914AMB-37

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

22 ns

TC59LM905AMB-55

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e0

16.5 mm

.75 ns

TC59LM836DKB-30

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

36

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX36

8M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

18.5 mm

.5 ns

TC59LM906AMG-50

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

350 mA

67108864 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

8

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.625 V

1.2 mm

200 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.08 Amp

2,4

16.5 mm

.65 ns

TC59LM914AMG-37

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

450 mA

33554432 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.625 V

1.2 mm

266 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.09 Amp

2,4

16.5 mm

.5 ns

TC59LM818DMB-30

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

18

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX18

16M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

.5 ns

TC59LM913AMB-60

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e0

16.5 mm

26 ns

TC59LM913AMB-55

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e0

16.5 mm

.75 ns

TC59LM818DMGI-37

Toshiba

DDR1 DRAM

INDUSTRIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

420 mA

16777216 words

2,4

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

-40 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

266 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.65 ns

TC59LM836DKG-33

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

800 mA

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

8MX36

8M

0 Cel

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

300 MHz

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

18.5 mm

.5 ns

TC59LM836DMB-40

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

8MX36

8M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

200 MHz

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

18.5 mm

.6 ns

TC59LM818DMG-33

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2,4

YES

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

222 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.5 ns

TC59LM914AMB-45

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

222 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

16.5 mm

22 ns

TC59LM905AMB-50

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e0

16.5 mm

.65 ns

TC59LM818DMG-40

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2,4

YES

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

200 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.65 ns

TC59LM818DMBI-37

Toshiba

DDR1 DRAM

INDUSTRIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2.5

18

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX18

16M

-40 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO REFRESH

e0

16.5 mm

.65 ns

TC59LM906AMG-37

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

450 mA

67108864 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

8

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.625 V

1.2 mm

266 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.09 Amp

2,4

16.5 mm

.5 ns

TC59LM836DKG-40

Toshiba

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

750 mA

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

8MX36

8M

0 Cel

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

250 MHz

11 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

18.5 mm

.6 ns

TC59LM913AMB-50

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

0 Cel

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

16.5 mm

.65 ns

TC59LM906AMB-37

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

22 ns

TC59LM906AMG-45

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

400 mA

67108864 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

8

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

222 MHz

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e1

NOT SPECIFIED

250

.085 Amp

2,4

16.5 mm

.6 ns

TC59LM905AMB-60

Toshiba

DDR1 DRAM

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B64

2.65 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.35 V

AUTO/SELF REFRESH

e0

16.5 mm

26 ns

TC59YM916AMG24A

Toshiba

RAMBUS DRAM

108

TBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE

1.27 mm

32MX16

32M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B108

1.86 V

1.2 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

e1

UPD48576209FF-E24-DW1-A

Renesas Electronics

DDR1 DRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

872 mA

67108864 words

2,4,8

COMMON

1.8

1.5/1.8,1.8,2.5

9

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

3-STATE

64MX9

64M

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

.055 Amp

18.5 mm

.3 ns

UPD48576118FF-E18-DW1

Renesas Electronics

DDR DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1078 mA

33554432 words

2,4,8

SEPARATE

1.8

1.5/1.8,1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

32MX18

32M

0 Cel

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

533 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

.055 Amp

2,4,8

18.5 mm

.12 ns

UPD48576218FF-E24-DW1

Renesas Electronics

DDR1 DRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

872 mA

33554432 words

2,4,8

COMMON

1.8

1.5/1.8,1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

3-STATE

32MX18

32M

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

.055 Amp

18.5 mm

.3 ns

UPD48288118AFF-E25-DW1-A

Renesas Electronics

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

SEPARATE

1.8

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

95 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

301989888 bit

1.7 V

AUTO REFRESH; IT ALSO REQUIRES AT 2.5V

2,4,8

18.5 mm

.3 ns

UPD48576118FF-E25-DW1-A

Renesas Electronics

DDR DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

872 mA

33554432 words

2,4,8

SEPARATE

1.8

1.5/1.8,1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

85 Cel

3-STATE

32MX18

32M

0 Cel

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

.055 Amp

2,4,8

18.5 mm

.2 ns

UPD48288118AFF-E24-DW1

Renesas Electronics

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

SEPARATE

1.8

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

95 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

301989888 bit

1.7 V

AUTO REFRESH; IT ALSO REQUIRES AT 2.5V

NOT SPECIFIED

NOT SPECIFIED

2,4,8

18.5 mm

.3 ns

UPD48576209F1-E24-DW1-A

Renesas Electronics

SYNCHRONOUS DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

371 mA

67108864 words

2,4,8

NO

COMMON

1.8

9

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

1 mm

95 Cel

64MX9

64M

0 Cel

TIN BISMUTH

BOTTOM

1

R-PBGA-B144

1.9 V

1.2 mm

400 MHz

11 mm

603979776 bit

1.7 V

AUTO REFRESH, TERM PITCH-MAX

e6

.215 Amp

2,4,8

18.5 mm

UPD48576236FF-E24-DW1-A

Renesas Electronics

DDR1 DRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

891 mA

16777216 words

2,4,8

COMMON

1.8

1.5/1.8,1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

3-STATE

16MX36

16M

TIN BISMUTH

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

e6

.055 Amp

18.5 mm

.3 ns

UPD48576236FF-E25-DW1-A

Renesas Electronics

DDR1 DRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

891 mA

16777216 words

2,4,8

COMMON

1.8

1.5/1.8,1.8,2.5

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

3-STATE

16MX36

16M

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

603979776 bit

1.7 V

AUTO REFRESH

.055 Amp

18.5 mm

.3 ns

UPD48288118AFF-E25-DW1

Renesas Electronics

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

SEPARATE

1.8

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

DRAMs

1 mm

95 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B144

1.9 V

1.17 mm

400 MHz

11 mm

Not Qualified

301989888 bit

1.7 V

AUTO REFRESH; IT ALSO REQUIRES AT 2.5V

2,4,8

18.5 mm

.3 ns

UPD48576236F1-E24-DW1-A

Renesas Electronics

SYNCHRONOUS DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

409 mA

16777216 words

2,4,8

NO

COMMON

1.8

36

GRID ARRAY, THIN PROFILE

BGA144,12X18,40/32

1 mm

95 Cel

16MX36

16M

0 Cel

TIN BISMUTH

BOTTOM

1

R-PBGA-B144

1.9 V

1.2 mm

400 MHz

11 mm

603979776 bit

1.7 V

AUTO REFRESH, TERM PITCH-MAX

e6

.215 Amp

2,4,8

18.5 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.