Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
64MX8 |
64M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
24 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
400 mA |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
222 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.085 Amp |
2,4 |
16.5 mm |
.6 ns |
|||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
8MX36 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
18.5 mm |
.5 ns |
|||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
108 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE |
1.27 mm |
32MX16 |
32M |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B108 |
1.86 V |
1.2 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
e1 |
|||||||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
8MX36 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
18.5 mm |
.6 ns |
|||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2,4 |
YES |
COMMON |
2.5 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
250 MHz |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
2,4 |
16.5 mm |
.5 ns |
|||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
200 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
16.5 mm |
.65 ns |
||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
222 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
16.5 mm |
22 ns |
|||||||||||||||
Toshiba |
RAMBUS DRAM |
108 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE |
1.27 mm |
32MX16 |
32M |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B108 |
1.86 V |
1.2 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
e1 |
|||||||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
350 mA |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.625 V |
1.2 mm |
200 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.08 Amp |
2,4 |
16.5 mm |
.65 ns |
|||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX18 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.65 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
24 ns |
|||||||||||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
850 mA |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
333 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
18.5 mm |
.5 ns |
|||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
250 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
18.5 mm |
.5 ns |
|||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
22 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
64MX8 |
64M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.75 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
8MX36 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
18.5 mm |
.5 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
350 mA |
67108864 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.625 V |
1.2 mm |
200 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.08 Amp |
2,4 |
16.5 mm |
.65 ns |
|||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
450 mA |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.625 V |
1.2 mm |
266 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.09 Amp |
2,4 |
16.5 mm |
.5 ns |
|||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX18 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.5 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
26 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.75 ns |
|||||||||||||||||||||||
|
Toshiba |
DDR1 DRAM |
INDUSTRIAL |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
420 mA |
16777216 words |
2,4 |
COMMON |
2.5 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
266 MHz |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
16.5 mm |
.65 ns |
||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
800 mA |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
300 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
18.5 mm |
.5 ns |
|||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
200 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
18.5 mm |
.6 ns |
|||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2,4 |
YES |
COMMON |
2.5 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
222 MHz |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
16.5 mm |
.5 ns |
||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
222 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
16.5 mm |
22 ns |
|||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
64MX8 |
64M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.65 ns |
|||||||||||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2,4 |
YES |
COMMON |
2.5 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
200 MHz |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
16.5 mm |
.65 ns |
||||||||||||||
Toshiba |
DDR1 DRAM |
INDUSTRIAL |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX18 |
16M |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO REFRESH |
e0 |
16.5 mm |
.65 ns |
||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
450 mA |
67108864 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.625 V |
1.2 mm |
266 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.09 Amp |
2,4 |
16.5 mm |
.5 ns |
|||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
750 mA |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
250 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
18.5 mm |
.6 ns |
|||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
16.5 mm |
.65 ns |
|||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
64MX8 |
64M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
22 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
400 mA |
67108864 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
222 MHz |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e1 |
NOT SPECIFIED |
250 |
.085 Amp |
2,4 |
16.5 mm |
.6 ns |
|||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
64MX8 |
64M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
26 ns |
|||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
108 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE |
1.27 mm |
32MX16 |
32M |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B108 |
1.86 V |
1.2 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
e1 |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
DDR1 DRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
872 mA |
67108864 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
9 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
3-STATE |
64MX9 |
64M |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
.055 Amp |
18.5 mm |
.3 ns |
|||||||||||||||||||
Renesas Electronics |
DDR DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1078 mA |
33554432 words |
2,4,8 |
SEPARATE |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX18 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
533 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
.055 Amp |
2,4,8 |
18.5 mm |
.12 ns |
||||||||||||||||
Renesas Electronics |
DDR1 DRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
872 mA |
33554432 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
3-STATE |
32MX18 |
32M |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
.055 Amp |
18.5 mm |
.3 ns |
||||||||||||||||||||
|
Renesas Electronics |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
SEPARATE |
1.8 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V |
2,4,8 |
18.5 mm |
.3 ns |
||||||||||||||||||
|
Renesas Electronics |
DDR DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
872 mA |
33554432 words |
2,4,8 |
SEPARATE |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX18 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
.055 Amp |
2,4,8 |
18.5 mm |
.2 ns |
|||||||||||||||
Renesas Electronics |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
SEPARATE |
1.8 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V |
NOT SPECIFIED |
NOT SPECIFIED |
2,4,8 |
18.5 mm |
.3 ns |
|||||||||||||||||
|
Renesas Electronics |
SYNCHRONOUS DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
371 mA |
67108864 words |
2,4,8 |
NO |
COMMON |
1.8 |
9 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
1 mm |
95 Cel |
64MX9 |
64M |
0 Cel |
TIN BISMUTH |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
400 MHz |
11 mm |
603979776 bit |
1.7 V |
AUTO REFRESH, TERM PITCH-MAX |
e6 |
.215 Amp |
2,4,8 |
18.5 mm |
|||||||||||||||||
|
Renesas Electronics |
DDR1 DRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
891 mA |
16777216 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
3-STATE |
16MX36 |
16M |
TIN BISMUTH |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
e6 |
.055 Amp |
18.5 mm |
.3 ns |
|||||||||||||||||
|
Renesas Electronics |
DDR1 DRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
891 mA |
16777216 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
3-STATE |
16MX36 |
16M |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
.055 Amp |
18.5 mm |
.3 ns |
|||||||||||||||||||
Renesas Electronics |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
SEPARATE |
1.8 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
400 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V |
2,4,8 |
18.5 mm |
.3 ns |
|||||||||||||||||||
|
Renesas Electronics |
SYNCHRONOUS DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
409 mA |
16777216 words |
2,4,8 |
NO |
COMMON |
1.8 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
1 mm |
95 Cel |
16MX36 |
16M |
0 Cel |
TIN BISMUTH |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
400 MHz |
11 mm |
603979776 bit |
1.7 V |
AUTO REFRESH, TERM PITCH-MAX |
e6 |
.215 Amp |
2,4,8 |
18.5 mm |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.