Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.9 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.23 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
160 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
260 |
.001 Amp |
1,2,4,8 |
13 mm |
5.4 ns |
||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1 mm |
11 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
11 mm |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.26 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
11 mm |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
DDR2 DRAM |
COMMERCIAL EXTENDED |
60 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX4 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
1.9 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
11 mm |
.5 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
150 mA |
16777216 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
1.95 V |
1 mm |
133 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.0003 Amp |
2,4,8,16 |
13 mm |
6 ns |
|||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
1.95 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.0003 Amp |
1,2,4,8 |
13 mm |
6 ns |
|||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
75 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
1.95 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO REFRESH |
e1 |
260 |
.00001 Amp |
1,2,4,8 |
11 mm |
6 ns |
||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.29 ns |
|||||||||||||||||||||
|
Samsung |
GDDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1520 mA |
16777216 words |
4,8 |
YES |
COMMON |
1.9 |
1.9 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
3 |
2 V |
1.2 mm |
1000 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.8 V |
AUTO/SELF REFRESH |
e1 |
260 |
.11 Amp |
4,8 |
14 mm |
.2 ns |
|||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
|
Samsung |
DDR2 DRAM |
COMMERCIAL EXTENDED |
60 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
220 mA |
134217728 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA63,9X11,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
3 |
1.9 V |
1.2 mm |
200 MHz |
10 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.008 Amp |
4,8 |
11 mm |
.6 ns |
|||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
115 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
3.6 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
8 mm |
5.4 ns |
|||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
|||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
2.7 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
260 |
11 mm |
5.4 ns |
||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.35 ns |
|||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
COMMERCIAL EXTENDED |
84 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
340 mA |
67108864 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
64MX16 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B84 |
1.9 V |
1.2 mm |
266 MHz |
11 mm |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.015 Amp |
4,8 |
18 mm |
.5 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
3 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
|||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
1.95 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
240 |
.0003 Amp |
1,2,4,8 |
13 mm |
6 ns |
||||||||||||
|
Samsung |
DDR2 DRAM |
COMMERCIAL EXTENDED |
84 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
300 mA |
33554432 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B84 |
3 |
1.9 V |
1.2 mm |
267 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.008 Amp |
4,8 |
13 mm |
.5 ns |
|||||||||
|
Samsung |
DDR2 DRAM |
COMMERCIAL EXTENDED |
84 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
300 mA |
33554432 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B84 |
3 |
1.9 V |
1.2 mm |
200 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.008 Amp |
4,8 |
13 mm |
.6 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
240 |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
14 mm |
||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
|||||||||||
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
14 mm |
.35 ns |
|||||||||||||||||||||||||
|
Samsung |
GDDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1130 mA |
16777216 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
3 |
1.9 V |
1.2 mm |
800 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.09 Amp |
4,8 |
14 mm |
.23 ns |
|||||||||
|
Samsung |
GDDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1270 mA |
16777216 words |
4,8 |
YES |
COMMON |
1.9 |
1.9 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
2 V |
1.2 mm |
900 MHz |
11 mm |
Not Qualified |
536870912 bit |
1.8 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.1 Amp |
4,8 |
14 mm |
.22 ns |
|||||||||||
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
14 mm |
.29 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
120 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
3.6 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.001 Amp |
1,2,4,8 |
11 mm |
5.4 ns |
|||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
240 |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.7 V |
AUTO/SELF REFRESH |
8 mm |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL EXTENDED |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
|||||||||||||||||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
94 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
134217728 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA94,11X19,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B94 |
1.575 V |
1.2 mm |
533 MHz |
11 mm |
Not Qualified |
1073741824 bit |
1.452 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
8 |
18 mm |
.3 ns |
|||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
112 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA112,11X22,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
64MX16 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B112 |
1.575 V |
1.2 mm |
667 MHz |
11 mm |
Not Qualified |
1073741824 bit |
1.452 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
8 |
18 mm |
.255 ns |
|||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
94 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA94,11X19,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
256MX4 |
256M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B94 |
1.575 V |
1.2 mm |
667 MHz |
11 mm |
Not Qualified |
1073741824 bit |
1.452 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
8 |
18 mm |
.255 ns |
|||||||||||||
|
Samsung |
DDR3 DRAM |
COMMERCIAL EXTENDED |
112 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA112,11X22,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
64MX16 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B112 |
1.575 V |
1.2 mm |
400 MHz |
11 mm |
Not Qualified |
1073741824 bit |
1.452 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
8 |
18 mm |
.4 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.