Micron Technology DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT4C1004JD30ADC2

Micron Technology

FAST PAGE DRAM

31

DIE

RECTANGULAR

UNSPECIFIED

FAST PAGE

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4194304 words

5

1

UNCASED CHIP

3-STATE

4MX1

4M

UPPER

1

R-XUUC-N31

Not Qualified

4194304 bit

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

MT36JDZS51272PZ-1G4F1

Micron Technology

MT12D136G-6L

Micron Technology

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1240 mA

1048576 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

18

DRAMs

1.27 mm

70 Cel

3-STATE

1MX36

1M

0 Cel

SINGLE

1

R-XSMA-N72

1

5.5 V

30.48 mm

Not Qualified

37748736 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH

.0024 Amp

60 ns

MT36KSZF1G72PZ-1G6XX

Micron Technology

DDR3 DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

1GX72

1G

0 Cel

GOLD

DUAL

1

R-XDMA-N240

1.575 V

30.5 mm

7.25 mm

77309411328 bit

1.425 V

AUTO/SELF REFRESH; WD-MAX

e4

133.35 mm

MT18HTS51272RHIY-53EXX

Micron Technology

DDR DRAM MODULE

INDUSTRIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

85 Cel

512MX72

512M

-40 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

1.9 V

3.8 mm

30 mm

Not Qualified

38654705664 bit

1.7 V

AUTO/SELF REFRESH

e4

67.6 mm

MT49H32M18CFM-25

Micron Technology

DDR DRAM

COMMERCIAL

144

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

970 mA

33554432 words

2,4,8

SEPARATE

1.5/1.8,1.8,2.5

18

GRID ARRAY

BGA144,12X18,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX18

32M

0 Cel

BOTTOM

R-PBGA-B144

400 MHz

Not Qualified

603979776 bit

.048 Amp

2,4,8

.2 ns

MT42L128M64D1KP-18AT:A

Micron Technology

LPDDR2 DRAM

168

VFBGA

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

128MX64

128M

BOTTOM

1

S-PBGA-B168

1.95 V

1 mm

12 mm

8589934592 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

12 mm

MT8JTF12864AZ-1G6XX

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.5

64

MICROELECTRONIC ASSEMBLY

70 Cel

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

Not Qualified

8589934592 bit

1.425 V

AUTO/SELF REFRESH

MT4LSDT1664AG-133

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1080 mA

16777216 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

R-PDMA-N168

1

133 MHz

Not Qualified

1073741824 bit

.008 Amp

5.4 ns

MT4HTF6464AY-667E1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1400 mA

67108864 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N240

333 MHz

Not Qualified

4294967296 bit

.028 Amp

.45 ns

MT8LSDT864AI-10EBG

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

8388608 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

6 ns

MT8JTF25664HZ-1G4M1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

DIMM

SINGLE BANK PAGE BURST

1

CMOS

SYNCHRONOUS

268435456 words

YES

1.5

64

70 Cel

256MX64

256M

0 Cel

1

1.575 V

30.15 mm

3.8 mm

17179869184 bit

1.425 V

AUTO/SELF REFRESH; WD-MAX

67.6 mm

MT16TD51232G-6

Micron Technology

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

736 mA

524288 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

512KX32

512K

0 Cel

SINGLE

R-PSMA-N72

25.654 mm

Not Qualified

16777216 bit

.016 Amp

60 ns

MT5LDT472AG-6

Micron Technology

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

825 mA

4194304 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

4MX72

4M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

Not Qualified

301989888 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.0025 Amp

60 ns

MT42L192M32D2MG-18AT:A

Micron Technology

LPDDR2 DRAM

134

TFBGA

2048

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

6.5 mA

201326592 words

YES

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

192MX32

192M

BOTTOM

1

S-PBGA-B134

1.95 V

1.2 mm

11.5 mm

6442450944 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

11.5 mm

10 ns

MT4C16258DJ-8

Micron Technology

FAST PAGE DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

150 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J40

5.5 V

3.81 mm

10.21 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.06 mm

80 ns

MT42L128M32D3MP-18IT:A

Micron Technology

LPDDR2 DRAM

220

VFBGA

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

128MX32

128M

BOTTOM

1

S-PBGA-B220

1.95 V

.8 mm

14 mm

4294967296 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

14 mm

MT18HTF12872PDY-53E

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3600 mA

134217728 words

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

55 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

R-PDMA-N240

267 MHz

Not Qualified

9663676416 bit

.09 Amp

.5 ns

MT9KDF25672PZ-1G6XX

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

268435456 words

YES

1.35

72

MICROELECTRONIC ASSEMBLY

70 Cel

256MX72

256M

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

Not Qualified

19327352832 bit

1.283 V

AUTO/SELF REFRESH

MT42L96M64D4KH-25AT:A

Micron Technology

LPDDR2 DRAM

216

VFBGA

2048

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

5 mA

100663296 words

YES

1.8

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

96MX64

96M

BOTTOM

1

S-PBGA-B216

1.95 V

.8 mm

12 mm

6442450944 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

12 mm

10 ns

MT6LDT472AG-5X

Micron Technology

EDO DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

4194304 words

NO

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

4MX72

4M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

25.4 mm

Not Qualified

301989888 bit

3 V

CAS BEFORE RAS REFRESH

.003 Amp

50 ns

MT8LSDT1664AY-13E

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

2640 mA

16777216 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

R-PDMA-N168

143 MHz

Not Qualified

1073741824 bit

.016 Amp

5.4 ns

MT36JBZS51272PY-1G1XX

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

512MX72

512M

0 Cel

GOLD

DUAL

1

R-XDMA-N240

1.575 V

4 mm

17.9 mm

Not Qualified

38654705664 bit

1.425 V

AUTO/SELF REFRESH

e4

133.35 mm

MT42L256M32D3MG-25AT:A

Micron Technology

LPDDR2 DRAM

134

TFBGA

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

256MX32

256M

BOTTOM

1

S-PBGA-B134

1.95 V

1.2 mm

11.5 mm

8589934592 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

11.5 mm

MT42L256M16D1GVEU-18WT:A

Micron Technology

LPDDR2 DRAM

MT9HTF12872RHY-80EE1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3015 mA

134217728 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

Other Memory ICs

.6 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

1.9 V

400 MHz

Not Qualified

9663676416 bit

1.7 V

AUTO/SELF REFRESH

e4

.063 Amp

.4 ns

MT9VDDT3272ALY-335

Micron Technology

COMMERCIAL

184

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

33554432 words

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

MATTE TIN

DUAL

R-PDMA-N184

1

167 MHz

Not Qualified

2415919104 bit

e3

.036 Amp

.7 ns

EDFP164A3PD-GDTJ-F-R

Micron Technology

LPDDR3 DRAM

OTHER

256

VFBGA

SQUARE

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

402653184 words

YES

1.2

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

105 Cel

384MX64

384M

-30 Cel

BOTTOM

1

S-PBGA-B256

1.3 V

.8 mm

14 mm

25769803776 bit

1.14 V

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

14 mm

MT4C1004JRG-6

Micron Technology

FAST PAGE DRAM

COMMERCIAL

20

TSOP2-R

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

4194304 words

5

1

SMALL OUTLINE, THIN PROFILE

1.27 mm

70 Cel

3-STATE

4MX1

4M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e3

17.14 mm

60 ns

MT1259P-15

Micron Technology

OTHER DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

262144 words

SEPARATE

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

262144 bit

e0

150 ns

MT42L192M32D1KU-25IT:A

Micron Technology

LPDDR2 DRAM

216

VFBGA

2048

SQUARE

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

5 mA

201326592 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

192MX32

192M

BOTTOM

1

S-PBGA-B216

1.95 V

.9 mm

12 mm

6442450944 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

12 mm

10 ns

MT18HTF12872Y-40EXX

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

70 Cel

128MX72

128M

0 Cel

GOLD

DUAL

1

R-XDMA-N240

3.6 V

Not Qualified

9663676416 bit

1.7 V

AUTO/SELF REFRESH

e4

.6 ns

MT18VDDT25672AY-26A

Micron Technology

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

5940 mA

268435456 words

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

256MX72

256M

0 Cel

DUAL

R-PDMA-N184

133 MHz

Not Qualified

19327352832 bit

.18 Amp

.75 ns

MT4LD232M-6S

Micron Technology

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

2048

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

520 mA

2097152 words

YES

COMMON

3.3

3.3

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

SINGLE

1

R-XSMA-N72

1

3.6 V

25.654 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

.0006 Amp

60 ns

MT16LSDF3264LHY-133

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

4960 mA

33554432 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

R-PDMA-N144

133 MHz

Not Qualified

2147483648 bit

.032 Amp

5.4 ns

MT4LSDT464HG-662B1

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

680 mA

4194304 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

R-PDMA-N144

29.21 mm

100 MHz

Not Qualified

268435456 bit

.012 Amp

7 ns

MT18JSF51272AZ-1G4XX

Micron Technology

DDR3 DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

4 mm

30.175 mm

Not Qualified

38654705664 bit

1.425 V

AUTO/SELF REFRESH

133.35 mm

MTA9ASF1G72PZ-3G2E1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

85 Cel

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

77309411328 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MT9JSF12872PIY-1G0XX

Micron Technology

DDR DRAM MODULE

INDUSTRIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

85 Cel

128MX72

128M

-40 Cel

GOLD

DUAL

1

R-XDMA-N240

1.575 V

Not Qualified

9663676416 bit

1.425 V

AUTO/SELF REFRESH

e4

MT18VDDT12872AIG-202XX

Micron Technology

DDR DRAM MODULE

INDUSTRIAL

184

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

85 Cel

128MX72

128M

-40 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

30

235

.8 ns

MT18JSF25672AIZ-80BXX

Micron Technology

DDR3 DRAM MODULE

INDUSTRIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

268435456 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

85 Cel

256MX72

256M

-40 Cel

DUAL

1

R-XDMA-N240

1.575 V

4 mm

30.175 mm

Not Qualified

19327352832 bit

1.425 V

AUTO/SELF REFRESH

133.35 mm

MT4VDDT3232UY-75G2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

100

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1460 mA

33554432 words

COMMON

2.5

2.5

32

MICROELECTRONIC ASSEMBLY

DIMM100

DRAMs

1.27 mm

70 Cel

3-STATE

32MX32

32M

0 Cel

DUAL

R-PDMA-N100

133 MHz

Not Qualified

1073741824 bit

.016 Amp

.75 ns

MT42L256M16D1GVLF-3WT:A

Micron Technology

LPDDR2 DRAM

MT49H32M9CFM-25

Micron Technology

DDR DRAM

144

BGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

COMMON

1.8

1.5/1.8,1.8,2.5

9

GRID ARRAY

BGA144,12X18,40/32

DRAMs

1 mm

3-STATE

32MX9

32M

TIN LEAD

BOTTOM

1

R-PBGA-B144

1.9 V

.93 mm

400 MHz

11 mm

Not Qualified

301989888 bit

1.7 V

AUTO REFRESH

e0

2,4,8

18.5 mm

.25 ns

MT4C10016DJ-5IT

Micron Technology

FAST PAGE DRAM

INDUSTRIAL

24

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SOJ24/28,.44

DRAMs

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J24

Not Qualified

16777216 bit

e0

50 ns

MT8JTF12864HY-80BXX

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.5

64

MICROELECTRONIC ASSEMBLY

70 Cel

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N204

1.575 V

Not Qualified

8589934592 bit

1.425 V

SELF CONTAINED REFRESH

e4

MT8D48N-7

Micron Technology

FAST PAGE DRAM MODULE

COMMERCIAL

30

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

800 mA

4194304 words

COMMON

5

5

8

MICROELECTRONIC ASSEMBLY

SIP30

DRAMs

70 Cel

3-STATE

4MX8

4M

0 Cel

TIN LEAD

SINGLE

1

R-XSMA-T30

5.5 V

21.2852 mm

Not Qualified

33554432 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.008 Amp

70 ns

MT42L128M64D2GU-3AT:A

Micron Technology

LPDDR2 DRAM

134

VFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.65 mm

128MX64

128M

BOTTOM

1

R-PBGA-B134

1.95 V

.7 mm

10 mm

8589934592 bit

1.7 V

SELF REFRESH; IT ALSO REQUIRES 1.2V NOM

11.5 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.