Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4S64163LF-AF75

Samsung

SYNCHRONOUS DRAM

OTHER

52

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

115 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA52,6X13,30

DRAMs

.75 mm

70 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

1

R-PBGA-B52

3

2.7 V

1 mm

133 MHz

6.6 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

260

.0005 Amp

1,2,4,8

11 mm

5.4 ns

KMM53216004AK-5

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1200 mA

16777216 words

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

16MX32

16M

0 Cel

SINGLE

R-PSMA-N72

Not Qualified

536870912 bit

.008 Amp

50 ns

M381L1713BT1-LA0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

Not Qualified

1207959552 bit

2.3 V

AUTO/SELF REFRESH

.8 ns

K4D551638D-LC450

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

390 mA

16777216 words

2,4,8

YES

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

222 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

260

.07 Amp

2,4,8

22.22 mm

.7 ns

M392B1K73BM1

Samsung

DDR3 DRAM

KM44C1010CT-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

65 mA

1048576 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSSOP20/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

1MX4

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

70 ns

M393AAG40M32-CYF

Samsung

DDR DRAM MODULE

288

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

17179869184 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

16GX72

16G

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

4.3 mm

1236950581248 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

M381L2923MT1-CA2

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

KMM5328004CK-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

656 mA

8388608 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.016 Amp

60 ns

M368L3223DTL-LB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2240 mA

33554432 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

2147483648 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

KM48S8030CT-FLKZ

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

125 mA

8388608 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

3

100 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

KM48C2004ALLT-5

Samsung

EDO DRAM

COMMERCIAL

28

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

100 mA

2097152 words

YES

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

18.41 mm

50 ns

KMM464S924T-GL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

800 mA

8388608 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

R-PDMA-N144

25.4 mm

100 MHz

Not Qualified

536870912 bit

.004 Amp

6 ns

KMM374F124BJ-6

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

1024

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

720 mA

1048576 words

NO

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

1MX72

1M

3 V

0 Cel

DUAL

R-PDMA-N168

Not Qualified

75497472 bit

.005 Amp

60 ns

K4N56163QG-GC25

Samsung

GDDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

400 mA

16777216 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B84

400 MHz

Not Qualified

268435456 bit

.01 Amp

4,8

.4 ns

K4F170812D-FC500

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

2097152 words

3.3

8

SMALL OUTLINE, THIN PROFILE

1.27 mm

70 Cel

2MX8

2M

0 Cel

DUAL

1

R-PDSO-G28

3.6 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

18.41 mm

50 ns

KM48V8000AS-L7

Samsung

FAST PAGE DRAM

COMMERCIAL

50

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

130 mA

8388608 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G50

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0005 Amp

20.95 mm

70 ns

M381L3313BT1-CB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

4096

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

2415919104 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

K4S510732B-TL1L

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

225 mA

67108864 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

100 MHz

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

e0

.004 Amp

1,2,4,8

22.22 mm

6 ns

KMM5362000B1G-8

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

2097152 words

5

36

MICROELECTRONIC ASSEMBLY

70 Cel

2MX36

2M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

75497472 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

80 ns

KMM5364000H-8

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

630 mA

4194304 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

Other Memory ICs

1.27 mm

70 Cel

3-STATE

4MX36

4M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

31.75 mm

Not Qualified

150994944 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

.009 Amp

80 ns

M312L6523CZ0-CCC

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4220 mA

67108864 words

YES

COMMON

2.6

2.6

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

200 MHz

Not Qualified

4831838208 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.42 Amp

.65 ns

K4M51163LC-RL75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

33554432 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

M393T5160CZA-E60

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

30 mm

4 mm

38654705664 bit

1.7 V

AUTO/SELF REFRESH; SEATED HGT-NOM

133.35 mm

.45 ns

K4H510838B-GCCC0

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

2.6

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

e0

12 mm

.65 ns

KMM372F1600AK-5

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

2700 mA

16777216 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

31.75 mm

Not Qualified

1207959552 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

50 ns

KM416C254DT-L4

Samsung

EDO DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

180 mA

262144 words

YES

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.00015 Amp

18.41 mm

40 ns

M470L3324DU0-LCC

Samsung

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1600 mA

33554432 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N200

2.7 V

200 MHz

Not Qualified

2147483648 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.65 ns

KM49V512ALLT-8

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

70 mA

524288 words

YES

COMMON

3.3

3.3

9

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

512KX9

512K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G28

3.6 V

1.2 mm

10.16 mm

Not Qualified

4718592 bit

3 V

RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH

e0

.0001 Amp

18.41 mm

80 ns

M395T5663CZ4-CD56

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3500 mA

268435456 words

YES

COMMON

1.8

1.5,1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

256MX72

256M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

266 MHz

Not Qualified

19327352832 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

KM44V4104CJ-6

Samsung

KM44V4104CJ-5

Samsung

M372C0405CT0-C60

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

660 mA

4194304 words

COMMON

5

5

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

4MX72

4M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

25.4 mm

Not Qualified

301989888 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

60 ns

K4T1G164QD-ZCCC0

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

245 mA

67108864 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX16

64M

0 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

200 MHz

9 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

.015 Amp

4,8

13 mm

.6 ns

K4S641632K-UC75T

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

85 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

DUAL

1

R-PDSO-G54

3

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

16777216 bit

3 V

AUTO/SELF REFRESH

260

.001 Amp

1,2,4,8

22.22 mm

5.4 ns

K4M561633G-RG1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

1

3.6 V

1 mm

111 MHz

8 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

.001 Amp

1,2,4,8

11 mm

7 ns

KMM374F803BK-6

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

990 mA

8388608 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

8MX72

8M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

31.75 mm

Not Qualified

603979776 bit

3 V

.0045 Amp

60 ns

K4S643232H-UC600

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

86

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

150 mA

2097152 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP86,.46,20

DRAMs

.5 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

Tin/Bismuth (Sn/Bi)

DUAL

1

R-PDSO-G86

3

3.6 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e6

40

260

.002 Amp

1,2,4,8

22.22 mm

5.5 ns

KM44C4000ASR-8

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2-R

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

60 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

YES

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

80 ns

M381L6423ETM-CAA

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3020 mA

67108864 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

4831838208 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

K4A8G165WB-BCTD0

Samsung

DDR4 DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

7.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

13.3 mm

KM48C2100CJ-L5

Samsung

K4E660812C-JL450

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

8388608 words

YES

3.3

8

SMALL OUTLINE

1.27 mm

70 Cel

8MX8

8M

0 Cel

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

30

225

20.96 mm

45 ns

KM41C16002ALSR-8

Samsung

STATIC COLUMN DRAM

COMMERCIAL

24

TSOP2-R

4096

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

YES

1

CMOS

GULL WING

ASYNCHRONOUS

60 mA

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

SRAMs

1.27 mm

70 Cel

YES

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0003 Amp

17.14 mm

80 ns

K4S560432C-TC1LT

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

190 mA

67108864 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

100 MHz

Not Qualified

268435456 bit

e0

.002 Amp

1,2,4,8

6 ns

KMM53216004CV-5

Samsung

EDO DRAM MODULE

COMMERCIAL

72

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

16777216 words

5

32

MICROELECTRONIC ASSEMBLY

70 Cel

16MX32

16M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

536870912 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

50 ns

K4S563233F-HG1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

7 ns

KMM332F204BT-L5

Samsung

EDO DRAM MODULE

COMMERCIAL

72

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

242 mA

2097152 words

YES

COMMON

3.3

3.3

32

MICROELECTRONIC ASSEMBLY

DIMM72

DRAMs

1.27 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

ZIG-ZAG

1

R-XZMA-N72

3.6 V

25.53 mm

3.81 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH; WD-MAX

.0008 Amp

59.68 mm

50 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.