Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4T51043QG-HLE6

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

175 mA

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

BOTTOM

R-PBGA-B60

333 MHz

Not Qualified

536870912 bit

.005 Amp

4,8

.45 ns

M372V1680CJ0-C50

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1980 mA

16777216 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

31.75 mm

Not Qualified

1207959552 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

50 ns

K4E641612C-TL45

Samsung

EDO DRAM

COMMERCIAL

50

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

130 mA

4194304 words

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G50

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0002 Amp

20.95 mm

45 ns

M470T2863EH3-LE7

Samsung

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

792 mA

134217728 words

YES

COMMON

1.8

1.8

8

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

128MX8

128M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

3

1.9 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

260

67.6 mm

.4 ns

KM44C4000ASLS-8

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

60 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

17.14 mm

80 ns

M470L1714BT0-LA2

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1820 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

133 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.34 Amp

.75 ns

K4S561632J-UP750

Samsung

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

180 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

1,2,4,8

22.22 mm

5.4 ns

M53620400DB0-60

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

720 mA

4194304 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

4MX36

4M

0 Cel

SINGLE

R-PSMA-N72

Not Qualified

150994944 bit

.009 Amp

60 ns

K4E171612C-TC45

Samsung

EDO DRAM

COMMERCIAL

44

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

100 mA

1048576 words

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44/50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0005 Amp

20.95 mm

45 ns

KM44C4103ALTR-5

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2-R

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

110 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

YES

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

18.41 mm

50 ns

KM44V16004AK-L6

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

140 mA

16777216 words

YES

COMMON

3.3

3.3

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

20.96 mm

60 ns

KM48V8100BK-6

Samsung

FAST PAGE DRAM

COMMERCIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

110 mA

8388608 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

20.96 mm

60 ns

KM41C16002ALK-6

Samsung

STATIC COLUMN DRAM

COMMERCIAL

24

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

YES

1

CMOS

J BEND

ASYNCHRONOUS

80 mA

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SOJ24/26,.34

SRAMs

1.27 mm

70 Cel

3-STATE

16MX1

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J24

5.5 V

3.68 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.145 mm

60 ns

K4S641632N-LL600

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

120 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

1,2,4,8

22.22 mm

5 ns

KM48C2004ASLJ-5

Samsung

EDO DRAM

COMMERCIAL

28

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

100 mA

2097152 words

NO

COMMON

5

5

8

SMALL OUTLINE

SOJ28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J28

5.5 V

3.76 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

18.42 mm

50 ns

K4H511638D-UPB0

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

345 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

KM44C1010BTR-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

TSOP2-R

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

80 mA

1048576 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSSOP20/26,.36

DRAMs

1.27 mm

70 Cel

YES

3-STATE

1MX4

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.001 Amp

17.14 mm

70 ns

KM44C4102AK-8

Samsung

STATIC COLUMN DRAM

COMMERCIAL

24

SOJ

2048

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

YES

1

CMOS

J BEND

ASYNCHRONOUS

80 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ24/26,.34

SRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J24

5.5 V

3.76 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.145 mm

80 ns

K4J52324KI-HC7A

Samsung

GDDR3 DRAM

OTHER

136

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

760 mA

16777216 words

4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA136,12X17,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

0 Cel

BOTTOM

R-PBGA-B136

1300 MHz

Not Qualified

536870912 bit

260

.095 Amp

.18 ns

K4J55323QG-BC14

Samsung

DDR3 DRAM

OTHER

136

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

935 mA

8388608 words

4,8

YES

COMMON

1.8

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA136,12X17,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B136

3

1.9 V

1.2 mm

700 MHz

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.09 Amp

4,8

14 mm

.26 ns

K4M51163LC-BF75T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

33554432 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

M391T5663QZ3-CF7

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2565 mA

268435456 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

95 Cel

3-STATE

256MX72

256M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

400 MHz

Not Qualified

19327352832 bit

1.7 V

AUTO/SELF REFRESH

260

.27 Amp

.4 ns

K4E151611D-JC45T

Samsung

EDO DRAM

COMMERCIAL

42

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

150 mA

1048576 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ42,.44

DRAMs

1.27 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

DUAL

R-PDSO-J42

Not Qualified

16777216 bit

.001 Amp

45 ns

M383L3310BT1-CA0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

125 MHz

Not Qualified

2415919104 bit

2.3 V

AUTO/SELF REFRESH

.8 ns

KM48V512BLJ-6

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

70 mA

524288 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J28

3.6 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0001 Amp

18.42 mm

60 ns

KM416C1200AR-L6

Samsung

FAST PAGE DRAM

COMMERCIAL

44

TSOP2-R

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

160 mA

1048576 words

YES

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44/50,.46,32

DRAMs

.8 mm

70 Cel

YES

3-STATE

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

20.95 mm

60 ns

KM44C1004CLT-8

Samsung

EDO DRAM

COMMERCIAL

20

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

55 mA

1048576 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSSOP20/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

1MX4

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

17.14 mm

80 ns

KM48S8030BT-G10TH

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

135 mA

8388608 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

3

100 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

7 ns

KM44C258AZ-12

Samsung

STATIC COLUMN DRAM

COMMERCIAL

20

ZIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

55 mA

262144 words

COMMON

5

5

4

IN-LINE

ZIP20,.1

SRAMs

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

ZIG-ZAG

R-PZIP-T20

3

Not Qualified

1048576 bit

e0

.001 Amp

120 ns

KM41C1000CP-7

Samsung

FAST PAGE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

65 mA

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T18

5.5 V

4.65 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

22.02 mm

70 ns

K4M28323LH-FN75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

4194304 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

134217728 bit

.0005 Amp

1,2,4,8

5.4 ns

K4T51083QE-ZCD5T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

266 MHz

Not Qualified

536870912 bit

e1

260

.008 Amp

4,8

.5 ns

M378T5663AZ3-CE600

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

2760 mA

268435456 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

R-PDMA-N240

333 MHz

Not Qualified

17179869184 bit

.24 Amp

.45 ns

K4S513233F-MC75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

16777216 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

e0

.001 Amp

1,2,4,8

5.4 ns

K4S64163LH-BN1L

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

4194304 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

7 ns

KMM366S824BT-GL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1200 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

35.052 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

K4F151612D-J60

Samsung

KM44V16000CK-L5

Samsung

FAST PAGE DRAM

COMMERCIAL

32

SOJ

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

110 mA

16777216 words

YES

COMMON

3.3

3.3

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

CAS BEFORE RAS/RAS ONLY/HIDDEN/SELF REFRESH

e0

.0002 Amp

20.96 mm

50 ns

M393T6553CZ0-CD5000

Samsung

DDR DRAM MODULE

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

64MX72

64M

DUAL

1

R-XDMA-N240

1.9 V

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

.5 ns

KMM5328004BSW-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

224 mA

8388608 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.004 Amp

60 ns

KM44C1000ATR-10

Samsung

FAST PAGE DRAM

COMMERCIAL

20

TSOP2-R

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

85 mA

1048576 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSSOP20/26,.36

DRAMs

1.27 mm

70 Cel

YES

3-STATE

1MX4

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

100 ns

K4D263238E-VC2A

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

935 mA

4194304 words

2,4,8,FP

YES

COMMON

2.5

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

BOTTOM

1

S-PBGA-B144

3

2.625 V

1.4 mm

350 MHz

12 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

260

.095 Amp

2,4,8

12 mm

.55 ns

M470L3223DT0-CA0

Samsung

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1880 mA

33554432 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N200

1

2.7 V

100 MHz

Not Qualified

2147483648 bit

2.3 V

AUTO/SELF REFRESH

.8 ns

K4E661612E-TI45

Samsung

EDO DRAM

INDUSTRIAL

50

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

4194304 words

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

1

R-PDSO-G50

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

20.95 mm

45 ns

M53233200BE0-C60

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

896 mA

33554432 words

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

32MX32

32M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

1073741824 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.016 Amp

60 ns

KM44C4010ASLS-5

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

17.14 mm

50 ns

K4E640411D-JC60

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

110 mA

16777216 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J32

5.5 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

20.96 mm

60 ns

K4E640412B-JL50

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

120 mA

16777216 words

YES

COMMON

3.3

3.3

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0003 Amp

20.96 mm

50 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.