EEPROM EEPROM 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

93LC46C-I/P

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

THROUGH-HOLE

SERIAL

SYNCHRONOUS

2 mA

64 words

3

3/5

16

IN-LINE

DIP8,.3

8

EEPROMs

200

2.54 mm

85 Cel

NO

TOTEM POLE

64X16

64

-40 Cel

MATTE TIN

YES

DUAL

1

SOFTWARE

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

3 MHz

7.62 mm

Not Qualified

6 ms

MICROWIRE

1024 bit

2.5 V

e3

260

.000001 Amp

9.27 mm

AT24C128B-PU

Microchip Technology

EEPROM

8

DIP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

16384 words

3

8

IN-LINE

DIP8,.3

40

.4 mm

85 Cel

16KX8

16K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

3.6 V

.4 mm

1000000 Write/Erase Cycles

1 MHz

1.8 mm

5 ms

I2C

131072 bit

1.8 V

.000006 Amp

2.2 mm

3

AT24C32D-XHM-B

Microchip Technology

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

100

.65 mm

85 Cel

OPEN-DRAIN

4KX8

4K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

1 MHz

3 mm

5 ms

I2C

32768 bit

1.7 V

e4

40

260

.000006 Amp

4.4 mm

5

AT24C512BN-SH25-B

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

65536 words

3.6

8

SMALL OUTLINE

SOP8,.25

40

1.27 mm

85 Cel

64KX8

64K

-40 Cel

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

5.5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

5 ms

I2C

524288 bit

2.5 V

128

.000006 Amp

4.9 mm

3.6

AT28C256-15SU-T

Microchip Technology

EEPROM

INDUSTRIAL

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

32768 words

5

8

SMALL OUTLINE

1.27 mm

85 Cel

32KX8

32K

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

5.5 V

2.65 mm

7.5 mm

10 ms

262144 bit

4.5 V

e3

30

260

17.9 mm

150 ns

5

AT28HC256E-12JU

Microchip Technology

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

80 mA

32768 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

1.27 mm

85 Cel

32KX8

32K

-40 Cel

NO

MATTE TIN

QUAD

R-PQCC-J32

2

5.5 V

3.556 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

10 ms

262144 bit

4.5 V

64

e3

40

245

.0003 Amp

13.97 mm

120 ns

5

YES

DS1973-F5

Maxim Integrated

EEPROM

INDUSTRIAL

2

ROUND

METAL

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

512 words

8

DISK BUTTON

85 Cel

512X8

512

-40 Cel

TIN LEAD

END

O-MEDB-N2

1

6 V

.0163 MHz

Not Qualified

1-WIRE

4096 bit

2.8 V

e0

DS1973-F5+

Analog Devices

EEPROM

INDUSTRIAL

2

ROUND

METAL

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

512 words

8

DISK BUTTON

85 Cel

512X8

512

-40 Cel

Matte Tin (Sn) - annealed

END

O-MEDB-N2

6 V

.0163 MHz

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

DS28E04S-100/T

Maxim Integrated

EEPROM

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

4096 words

3

3/5

1

SMALL OUTLINE

SOP16,.25

EEPROMs

1.27 mm

85 Cel

4KX1

4K

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

5.25 V

1.75 mm

50000 Write/Erase Cycles

3.9 mm

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

30

260

9.9 mm

DS28E04S-100+T

Analog Devices

EEPROM

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

4096 words

3

3/5

1

SMALL OUTLINE

SOP16,.25

EEPROMs

1.27 mm

85 Cel

4KX1

4K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

5.25 V

1.75 mm

50000 Write/Erase Cycles

3.9 mm

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

30

260

9.9 mm

M24512-WMW6T

STMicroelectronics

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1 mA

65536 words

3.3

3/5

8

SMALL OUTLINE

SOP8,.3

EEPROMs

40

1.27 mm

85 Cel

64KX8

64K

-40 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

2.03 mm

100000 Write/Erase Cycles

.4 MHz

5.25 mm

Not Qualified

10 ms

I2C

524288 bit

2.5 V

e0

.000002 Amp

5.3 mm

M24C16-WDW6TP

STMicroelectronics

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1 mA

2048 words

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

200

.65 mm

85 Cel

OPEN-DRAIN

2KX8

2K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

R-PDSO-G8

1

5.5 V

1.2 mm

4000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

16384 bit

2.5 V

e4

30

260

.000002 Amp

4.4 mm

M24C32-FMN6TP

STMicroelectronics

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

4096 words

1.8

1.8/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

85 Cel

4KX8

4K

-20 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

10 ms

I2C

32768 bit

1.7 V

e0

.000001 Amp

4.9 mm

M95256-DRMF3TG/K

STMicroelectronics

EEPROM

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

32768 words

2.5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

32KX8

32K

-40 Cel

DUAL

R-PDSO-N8

1

5.5 V

.8 mm

10 MHz

2 mm

4 ms

SPI

262144 bit

1.7 V

3 mm

24C02C/SN

Microchip Technology

EEPROM

COMMERCIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

70 Cel

256X8

256

0 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

1 ms

I2C

2048 bit

4.5 V

e3

30

260

.00005 Amp

4.9 mm

5

25LC010A-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

128 words

5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

3-STATE

128X8

128

-40 Cel

MATTE TIN

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

Not Qualified

5 ms

SPI

1024 bit

4.5 V

ALSO OPERATES AT 2.5V TO 4.5V @5MHZ

e3

30

260

.000001 Amp

4.9 mm

5

25LC640A-I/ST

Microchip Technology

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

8192 words

5

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

200

.65 mm

85 Cel

8KX8

8K

-40 Cel

Matte Tin (Sn)

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

10 MHz

3 mm

Not Qualified

5 ms

SPI

65536 bit

2.5 V

e3

40

260

.000001 Amp

4.4 mm

5

AT21CS11-MSH10-T

Microchip Technology

EEPROM

INDUSTRIAL

2

VSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

ASYNCHRONOUS

.5 mA

128 words

8

SMALL OUTLINE, VERY THIN PROFILE

SURF MNT 2,.14X.2

100

2 mm

85 Cel

OPEN-DRAIN

128X8

128

-40 Cel

DUAL

1

R-XDSO-N2

4.5 V

.4 mm

1000000 Write/Erase Cycles

3.5 mm

5 ms

1-WIRE

1024 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

.000003 Amp

5 mm

AT24C02C-STUM-T

Microchip Technology

EEPROM

INDUSTRIAL

5

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

8

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSOP5/6,.11,37

100

.95 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G5

1

5.5 V

1 mm

1000000 Write/Erase Cycles

1 MHz

1.6 mm

5 ms

I2C

2048 bit

1.7 V

e3

40

260

.000006 Amp

2.9 mm

2.5

AT24C04C-PUM

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

512 words

3

8

IN-LINE

DIP8,.3

100

2.54 mm

85 Cel

OPEN-DRAIN

512X8

512

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

1 MHz

7.62 mm

5 ms

I2C

4096 bit

2.5 V

ALSO OPERATES AT 1.7V TO 2.5V @0.4MHZ

e3

.000006 Amp

9.271 mm

3

AT24CS64-MAHM-T

Microchip Technology

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

8192 words

5

1.8/5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

EEPROMs

100

.5 mm

85 Cel

NO

OPEN-DRAIN

8KX8

8K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE

R-PDSO-N8

1

5.5 V

.6 mm

1000000 Write/Erase Cycles

1 MHz

2 mm

Not Qualified

5 ms

I2C

65536 bit

2.5 V

e4

40

260

.000001 Amp

3 mm

5

AT28BV256-20SU-T

Microchip Technology

EEPROM

INDUSTRIAL

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

15 mA

32768 words

3

YES

8

SMALL OUTLINE

SOP28,.4

1.27 mm

85 Cel

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G28

3

3.6 V

2.65 mm

10000 Write/Erase Cycles

7.5 mm

10 ms

262144 bit

2.7 V

THE PART EXISTS IN EEPROM3V

64

e3

30

260

.00005 Amp

17.9 mm

200 ns

3

AT28C256-15PC

Atmel

EEPROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

32768 words

5

YES

5

8

IN-LINE

DIP28,.6

EEPROMs

10

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

NO

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

1

5.5 V

4.826 mm

10000 Write/Erase Cycles

15.24 mm

Not Qualified

10 ms

262144 bit

4.5 V

AUTOMATIC WRITE

64

e0

30

225

.0002 Amp

37.0205 mm

150 ns

5

YES

DS2432P/T&R

Maxim Integrated

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

5

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

e0

3.94 mm

DS2432P+T&R

Analog Devices

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

5

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

85 Cel

1KX1

1K

-40 Cel

MATTE TIN

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

e3

30

260

3.94 mm

ST25DV16KC-IE6T3

STMicroelectronics

EEPROM

12

ST25DV16KC-IE8S3

STMicroelectronics

EEPROM

12

X28HC64JI-90

Renesas Electronics

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

8192 words

5

8

CHIP CARRIER

1.27 mm

85 Cel

8KX8

8K

-40 Cel

QUAD

R-PQCC-J32

5.5 V

3.55 mm

11.43 mm

5 ms

65536 bit

4.5 V

13.97 mm

90 ns

5

24AA025-I/P

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

2/5

8

IN-LINE

DIP8,.3

EEPROMs

200

2.54 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

5 ms

I2C

2048 bit

1.7 V

e3

.000001 Amp

9.271 mm

2.5

24C01C-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

128 words

5

8

SMALL OUTLINE

SOP8,.23

200

1.27 mm

85 Cel

OPEN-DRAIN

128X8

128

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

1 ms

I2C

1024 bit

4.5 V

e3

30

260

.000005 Amp

4.9 mm

5

24LC128T-I/MS

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

16384 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.19

EEPROMs

200

.65 mm

85 Cel

OPEN-DRAIN

16KX8

16K

-40 Cel

Matte Tin (Sn)

1010DDDR

DUAL

1

HARDWARE

S-PDSO-G8

1

5.5 V

1.1 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

131072 bit

2.5 V

e3

40

260

.000005 Amp

3 mm

4.5

24LC32A-I/SMG

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

5

3/5

8

SMALL OUTLINE

SOP8,.3

EEPROMs

200

1.27 mm

85 Cel

4KX8

4K

-40 Cel

Matte Tin (Sn)

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

2.03 mm

1000000 Write/Erase Cycles

.4 MHz

5.25 mm

Not Qualified

5 ms

I2C

32768 bit

2.5 V

2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED

e3

.000001 Amp

5.26 mm

24LC32AT-E/SN

Microchip Technology

EEPROM

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

5

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

125 Cel

4KX8

4K

-40 Cel

MATTE TIN

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

32768 bit

2.5 V

2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED

e3

30

260

.000005 Amp

4.9 mm

25AA256T-E/ST

Microchip Technology

EEPROM

AUTOMOTIVE

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

6 mA

32768 words

2.5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

200

.65 mm

125 Cel

NO

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

10 MHz

3 mm

Not Qualified

5 ms

SPI

262144 bit

1.8 V

e3

40

260

.000001 Amp

4.4 mm

1.8

25LC128-E/ST

Microchip Technology

EEPROM

AUTOMOTIVE

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

16384 words

5

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

200

.65 mm

125 Cel

16KX8

16K

-40 Cel

Matte Tin (Sn)

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

10 MHz

3 mm

Not Qualified

5 ms

SPI

131072 bit

2.5 V

e3

40

260

.000005 Amp

4.4 mm

5

25LC640A-I/MS

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

8192 words

5

3/5

8

SMALL OUTLINE

SOP8,.19

EEPROMs

200

.65 mm

85 Cel

8KX8

8K

-40 Cel

Matte Tin (Sn)

DUAL

1

HARDWARE/SOFTWARE

S-PDSO-G8

1

5.5 V

1.1 mm

1000000 Write/Erase Cycles

10 MHz

3 mm

Not Qualified

5 ms

SPI

65536 bit

2.5 V

e3

40

260

.000001 Amp

3 mm

5

AT21CS11-SSH10-T

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

ASYNCHRONOUS

.5 mA

128 words

8

SMALL OUTLINE

SOP8,.23

100

1.27 mm

85 Cel

OPEN-DRAIN

128X8

128

-40 Cel

DUAL

1

R-PDSO-G8

4.5 V

1.75 mm

1000000 Write/Erase Cycles

3.9 mm

5 ms

1-WIRE

1024 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

.000003 Amp

4.9 mm

AT24C01C-XHM-B

Microchip Technology

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

128 words

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

100

.65 mm

85 Cel

NO

OPEN-DRAIN

128X8

128

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

5 ms

I2C

1024 bit

1.7 V

ALSO HAS 1 MHZ CLOCK FREQ AT 2.5V AND 5V SUPPLY

8

e4

40

260

.000006 Amp

4.4 mm

2.5

YES

AT24C1024BN-SH25-T

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

131072 words

8

SMALL OUTLINE

SOP8,.25

40

1.27 mm

85 Cel

OPEN-DRAIN

128KX8

128K

-40 Cel

1010DDMR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

5 ms

I2C

1048576 bit

2.5 V

IT ALSO OPERATES AT 0.4MHZ AT 1.8MIN SUPPLY

256

.000006 Amp

4.925 mm

AT25640B-XHL-T

Microchip Technology

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

8192 words

5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.65 mm

85 Cel

3-STATE

8KX8

8K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

20 MHz

3 mm

Not Qualified

5 ms

SPI

65536 bit

4.5 V

2.5V TO 5.5V @ 10MHz AND 1.8V TO 5.5V @ 5MHz

32

e4

.00001 Amp

4.4 mm

5

AT28C010-12EM/883

Microchip Technology

EEPROM

MILITARY

32

QCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883

NO LEAD

PARALLEL

ASYNCHRONOUS

80 mA

131072 words

5

YES

5

8

CHIP CARRIER

LCC32,.45X.55

EEPROMs

10

1.27 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

NO

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

2.54 mm

10000 Write/Erase Cycles

11.43 mm

Not Qualified

10 ms

1048576 bit

4.5 V

AUTOMATIC WRITE; DATA RETENTION: 10 YEARS

128

e0

.0003 Amp

13.97 mm

120 ns

5

YES

AT28C256F-15DM/883

Microchip Technology

EEPROM

MILITARY

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883 Class B

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

32768 words

5

YES

8

IN-LINE

DIP28,.6

10

2.54 mm

125 Cel

32KX8

32K

-55 Cel

NO

DUAL

1

R-GDIP-T28

5.5 V

5.72 mm

10000 Write/Erase Cycles

15.24 mm

3 ms

262144 bit

4.5 V

64

NOT SPECIFIED

NOT SPECIFIED

.0003 Amp

37.215 mm

150 ns

5

YES

AT28HC64B-90JU

Microchip Technology

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

40 mA

8192 words

5

YES

5

8

CHIP CARRIER

LCC32,.45X.55

EEPROMs

10

1.27 mm

85 Cel

3-STATE

8KX8

8K

-40 Cel

NO

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

10 ms

65536 bit

4.5 V

64

e3

40

245

.0001 Amp

13.97 mm

90 ns

5

YES

AT93C86A-10PU-2.7

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

2 mA

1024 words

5

3/5

16

IN-LINE

DIP8,.3

8

EEPROMs

100

2.54 mm

85 Cel

1KX16

1K

-40 Cel

MATTE TIN

DUAL

1

SOFTWARE

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

2 MHz

7.62 mm

Not Qualified

10 ms

MICROWIRE

16384 bit

2.7 V

OPERATES AT 1 MHz AT MIN 2.7V

e3

.00001 Amp

9.271 mm

5

CAT24C128YI-GT3JN

Onsemi

EEPROM

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

16384 words

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

1

100

.65 mm

85 Cel

OPEN-DRAIN

16KX8

16K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

1 MHz

3 mm

5 ms

I2C

131072 bit

2.5 V

5MICROAMP STANDBY CURRENT AVAILABLE @ 125 TEMP, AND OPERATES WITH 1.8VMIN SUPPLY @ 0.1MHZ

e4

.000002 Amp

4.4 mm

3.3

CAV24C04WE-GT3

Onsemi

EEPROM

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2 mA

4096 words

3.6

1

SMALL OUTLINE

SOP8,.25

100

1.27 mm

125 Cel

4KX1

4K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

4096 bit

2.5 V

100 YEAR DATA RETENTION

e4

30

260

.000005 Amp

4.9 mm

M24256X-FCU6T/VF

STMicroelectronics

EEPROM

24AA64T/SN

Microchip Technology

EEPROM

COMMERCIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

70 Cel

OPEN-DRAIN

8KX8

8K

0 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

65536 bit

1.7 V

e3

30

260

.000001 Amp

4.9 mm

2.5

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.