Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
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|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
e3 |
.0001 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
125 Cel |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.19 |
EEPROMs |
200 |
.65 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
Matte Tin (Sn) |
1010XXMR |
DUAL |
1 |
HARDWARE |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
e3 |
40 |
260 |
.000001 Amp |
3 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
32768 words |
4.5 |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
200 |
.65 mm |
125 Cel |
NO |
OPEN-DRAIN |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
262144 bit |
2.5 V |
e3 |
40 |
260 |
.000005 Amp |
4.4 mm |
4.5 |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
200 |
.65 mm |
125 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
40 |
260 |
.000005 Amp |
4.4 mm |
4.5 |
||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
16384 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
10 MHz |
3.9 mm |
Not Qualified |
5 ms |
SPI |
131072 bit |
2.5 V |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
YES |
2/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
NO |
TOTEM POLE |
256X16 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
3 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
ALSO CONFIGURABLE AS 512 X 8 |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
|||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
Matte Tin (Sn) |
YES |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
3 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
4.5 V |
1000000 ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
YES |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
200 |
1.27 mm |
125 Cel |
NO |
TOTEM POLE |
128X16 |
128 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
2048 bit |
2.5 V |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
|||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
2 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
.5 mA |
128 words |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
SURF MNT 2,.14X.2 |
100 |
2 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
DUAL |
1 |
R-XDSO-N2 |
4.5 V |
.4 mm |
1000000 Write/Erase Cycles |
3.5 mm |
5 ms |
1-WIRE |
1024 bit |
2.7 V |
.000003 Amp |
5 mm |
|||||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
10100DMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
2.16 mm |
100000 Write/Erase Cycles |
.4 MHz |
5.24 mm |
Not Qualified |
10 ms |
I2C |
1048576 bit |
2.7 V |
e0 |
240 |
.000003 Amp |
5.29 mm |
|||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
65536 words |
3.6 |
8 |
SMALL OUTLINE |
SOP8,.25 |
40 |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
5 ms |
I2C |
524288 bit |
2.5 V |
128 |
.000006 Amp |
4.9 mm |
3.6 |
||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
EEPROMs |
100 |
.5 mm |
85 Cel |
NO |
3-STATE |
2048X8 |
2048 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
e4 |
40 |
260 |
.000001 Amp |
3 mm |
5 |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE |
SOLCC8,.12,20 |
EEPROMs |
100 |
.5 mm |
85 Cel |
OPEN-DRAIN |
4KX8 |
4K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
e4 |
40 |
260 |
.000006 Amp |
3 mm |
5 |
||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
TIN COPPER |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.78 mm |
1000000 Write/Erase Cycles |
.4 MHz |
4.4 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e2 |
10 |
260 |
.000002 Amp |
5 mm |
|||||||||||||||||||||
|
Catalyst Semiconductor |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1 mA |
256 words |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
2048 bit |
.000002 Amp |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
1.8/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
260 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
20 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
1024 bit |
1.8 V |
e4 |
30 |
260 |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
20 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
1024 bit |
1.8 V |
e4 |
40 |
260 |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
20 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
4096 bit |
1.8 V |
e4 |
30 |
260 |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
5 MHz |
3 mm |
5 ms |
SPI |
1048576 bit |
1.8 V |
e4 |
40 |
260 |
4.4 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
NO |
TIN |
DUAL |
R-PDIP-T24 |
5.5 V |
6.35 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
16384 bit |
4.5 V |
e3 |
.0001 Amp |
31.875 mm |
200 ns |
5 |
YES |
||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
10000 PROGRAM/ERASE CYCLES |
64 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.33 mm |
.4 MHz |
.8 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
e1 |
30 |
260 |
1.2 mm |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.8 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
e4 |
30 |
260 |
.000001 Amp |
4.4 mm |
|||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.4 mA |
2048 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
1010C11R |
DUAL |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.8 V |
.00003 Amp |
4.9 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16384 words |
2.5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
R-PDSO-N8 |
1 |
5.5 V |
.8 mm |
10 MHz |
2 mm |
4 ms |
SPI |
131072 bit |
1.8 V |
3 mm |
||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.3 mm |
1 MHz |
.77 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
IT ALSO OPERATES AT 0.4MHZ |
e1 |
30 |
260 |
.77 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
150 Cel |
256X8 |
256 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
10 MHz |
3.9 mm |
4 ms |
SPI |
2048 bit |
2.5 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
100 |
.5 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
5.5 V |
.55 mm |
1000000 Write/Erase Cycles |
10 MHz |
2 mm |
5 ms |
SPI |
8192 bit |
2.5 V |
IT ALSO OPERATES AT 1.8 TO 5.5 V SUPPLY VOLTAGE AT 5 MHZ FREQUENCY |
e4 |
30 |
260 |
.000002 Amp |
3 mm |
80 ns |
5 |
||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
150 Cel |
8KX8 |
8K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
10 MHz |
3.9 mm |
4 ms |
SPI |
65536 bit |
2.5 V |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
5 ms |
I2C |
2048 bit |
2.5 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
.000001 Amp |
9.271 mm |
5 |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
2.5 |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
BALL |
SERIAL |
SYNCHRONOUS |
1 mA |
16384 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA4,2X2,16 |
200 |
.4 mm |
85 Cel |
OPEN-DRAIN |
16KX8 |
16K |
-40 Cel |
TIN SILVER COPPER |
1010DDDR |
BOTTOM |
1 |
SOFTWARE |
R-PBGA-B4 |
5.5 V |
.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
5 ms |
I2C |
131072 bit |
1.6 V |
e1 |
.000001 Amp |
1.8 |
|||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
2/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
EEPROMs |
200 |
.65 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
S-PDSO-N8 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
1 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @ 0.4MHZ |
e3 |
.000001 Amp |
3 mm |
4.5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
Matte Tin (Sn) |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
16 |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
5 |
YES |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
.000001 Amp |
9.271 mm |
5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
Matte Tin (Sn) |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
OPEN-DRAIN |
4KX8 |
4K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G6 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
e3 |
40 |
260 |
.000005 Amp |
2.9 mm |
5 |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
4KX8 |
4K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
6 V |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
R-PDSO-G8 |
1 |
6 V |
2.03 mm |
1000000 Write/Erase Cycles |
.1 MHz |
5.25 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
40 |
260 |
.000005 Amp |
5.245 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
2.5 |
YES |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
NO |
TOTEM POLE |
512X8 |
512 |
-40 Cel |
Matte Tin (Sn) |
YES |
DUAL |
1 |
SOFTWARE |
R-PDSO-G6 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
3 MHz |
1.63 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
e3 |
40 |
260 |
.000001 Amp |
2.95 mm |
||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
16 |
SMALL OUTLINE |
200 |
1.27 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1 MHz |
3.9 mm |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
4.9 mm |
|||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
100 |
.65 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
1 MHz |
3 mm |
5 ms |
I2C |
2048 bit |
4.5 V |
.000018 Amp |
4.4 mm |
5 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1 mA |
2048 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
100 |
.5 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
2 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
ALSO OPERATES 1.7V AT 100 KHZ STD MODE AND 400 KHZ @ FAST MODE |
e4 |
40 |
260 |
.0000008 Amp |
3 mm |
||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
4096 words |
3.3 |
2/5 |
1 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
1.7 V |
e4 |
30 |
260 |
.000001 Amp |
2.9 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.