Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
16384 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
5.5 V |
100000 Write/Erase Cycles |
5 MHz |
Not Qualified |
5 ms |
SPI |
131072 bit |
4.5 V |
IT ALSO OPERATES AT 3MHZ AT 2.5MIN |
.00001 Amp |
|||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
16384 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
5.5 V |
100000 Write/Erase Cycles |
5 MHz |
Not Qualified |
10 ms |
SPI |
131072 bit |
4.5 V |
IT ALSO OPERATES AT 1MHZ AT 1.8MIN |
.000001 Amp |
|||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
16384 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
125 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
5.5 V |
100000 Write/Erase Cycles |
5 MHz |
Not Qualified |
10 ms |
SPI |
131072 bit |
4.5 V |
IT ALSO OPERATES AT 1MHZ AT 1.8MIN |
.00001 Amp |
|||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.000001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
10 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
131072 bit |
.00001 Amp |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
16384 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
TSSOP20,.25 |
EEPROMs |
100 |
.635 mm |
105 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G20 |
5.5 V |
100000 Write/Erase Cycles |
5 MHz |
Not Qualified |
5 ms |
SPI |
131072 bit |
4.5 V |
IT ALSO OPERATES AT 3MHZ AT 2.5MIN |
.00001 Amp |
|||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
524288 words |
3.3 |
2.5/3.3,3.3 |
1 |
SMALL OUTLINE |
SOP20,.4 |
Flash Memories |
10 |
1.27 mm |
70 Cel |
512KX1 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
15 MHz |
7.5 mm |
Not Qualified |
524288 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
12.8 mm |
45 ns |
|||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
12.8 mm |
15 ns |
||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
12.8 mm |
15 ns |
|||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
12.8 mm |
15 ns |
|||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
262144 words |
3.3 |
2.5/3.3,3.3 |
1 |
SMALL OUTLINE |
SOP20,.4 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
256KX1 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
15 MHz |
7.5 mm |
Not Qualified |
262144 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
12.8 mm |
45 ns |
|||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
524288 bit |
3 V |
e0 |
12.8 mm |
15 ns |
|||||||||||||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
25 mA |
65536 words |
3.3 |
2.5/3.3,3.3 |
8 |
SMALL OUTLINE |
SOP20,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.6416 mm |
20000 Write/Erase Cycles |
33 MHz |
7.5184 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
30 |
260 |
NOR TYPE |
.01 Amp |
12.827 mm |
15 ns |
|||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
30 mA |
1048576 words |
3.3 |
2.5/3.3,3.3 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
10 |
1.27 mm |
85 Cel |
1MX1 |
1M |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.57 mm |
10000 Write/Erase Cycles |
15 MHz |
8.9662 mm |
Not Qualified |
1048576 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
8.9662 mm |
45 ns |
|||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
12.8 mm |
15 ns |
||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
8.9662 mm |
15 ns |
|||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
QUAD |
S-PQCC-J20 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
8.9662 mm |
15 ns |
||||||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
1 |
CHIP CARRIER |
1.27 mm |
70 Cel |
128KX1 |
128K |
0 Cel |
QUAD |
S-PQCC-J20 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
131072 bit |
3 V |
8.9662 mm |
20 ns |
||||||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
e0 |
8.9662 mm |
15 ns |
|||||||||||||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
25 mA |
65536 words |
3.3 |
2.5/3.3,3.3 |
8 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
20000 Write/Erase Cycles |
33 MHz |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
30 |
245 |
NOR TYPE |
.01 Amp |
8.9662 mm |
15 ns |
|||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
131072 words |
3.3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX1 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
7.5 mm |
Not Qualified |
131072 bit |
3 V |
e3 |
12.8 mm |
20 ns |
||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
30 mA |
524288 words |
3.3 |
2.5/3.3,3.3 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
10 |
1.27 mm |
70 Cel |
512KX1 |
512K |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.57 mm |
10000 Write/Erase Cycles |
15 MHz |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
8.9662 mm |
45 ns |
|||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
30 mA |
262144 words |
3.3 |
2.5/3.3,3.3 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
10 |
1.27 mm |
85 Cel |
256KX1 |
256K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.57 mm |
10000 Write/Erase Cycles |
15 MHz |
8.9662 mm |
Not Qualified |
262144 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
8.9662 mm |
45 ns |
|||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
MILITARY |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
1 |
SMALL OUTLINE |
SOP20,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
15 MHz |
7.5 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
30 |
225 |
.00005 Amp |
12.8 mm |
|||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
8.9662 mm |
15 ns |
||||||||||||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
8.9662 mm |
15 ns |
||||||||||||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
131072 words |
3.3 |
2.5/3.3,3.3 |
1 |
SMALL OUTLINE |
SOP20,.4 |
Flash Memories |
10 |
1.27 mm |
70 Cel |
128KX1 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
15 MHz |
7.5 mm |
Not Qualified |
131072 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
12.8 mm |
45 ns |
||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL/SERIAL |
SYNCHRONOUS |
25 mA |
32768 words |
3.3 |
2.5/3.3,3.3 |
8 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
10 |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
10000 Write/Erase Cycles |
33 MHz |
8.9662 mm |
Not Qualified |
262144 bit |
3 V |
e0 |
30 |
225 |
NOR TYPE |
.01 Amp |
8.9662 mm |
15 ns |
||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
30 mA |
131072 words |
3.3 |
2.5/3.3,3.3 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
Flash Memories |
10 |
1.27 mm |
70 Cel |
128KX1 |
128K |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.57 mm |
15 MHz |
8.9662 mm |
Not Qualified |
131072 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
8.9662 mm |
45 ns |
||||||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
524288 words |
3.3 |
2.5/3.3,3.3 |
1 |
SMALL OUTLINE |
SOP20,.4 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
512KX1 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
15 MHz |
7.5 mm |
Not Qualified |
524288 bit |
3 V |
SERIAL MODE ALSO AVAILABLE |
e0 |
30 |
225 |
NOR TYPE |
.0001 Amp |
12.8 mm |
45 ns |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.