32 EPROM 1,425

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)

M27W801-100F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

1048576 words

COMMON

3

3/3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

85 Cel

3-STATE

1MX8

1M

-40 Cel

MATTE TIN

DUAL

R-CDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

8388608 bit

2.7 V

ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V

e3

.000015 Amp

41.885 mm

100 ns

M27V101-90F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

131072 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

e0

.00002 Amp

41.885 mm

90 ns

M27V101-120L6

STMicroelectronics

INDUSTRIAL

32

QCCN

RECTANGULAR

CERAMIC

YES

CMOS

NO LEAD

30 mA

131072 words

COMMON

3.3

3.3

8

CHIP CARRIER

LCC32,.45X.55

EPROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

R-XQCC-N32

Not Qualified

1048576 bit

e0

.00002 Amp

120 ns

WS27C010L-17CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

60 mA

131072 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

13.97 mm

170 ns

M27W201-80F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

262144 words

COMMON

3

3/3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

MATTE TIN

DUAL

R-CDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

2097152 bit

2.7 V

ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V

e3

.000015 Amp

41.885 mm

80 ns

M27V101-200F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

131072 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

e0

.00002 Amp

41.885 mm

200 ns

M27W101-200F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

3

8

IN-LINE, WINDOW

2.54 mm

85 Cel

128KX8

128K

-40 Cel

MATTE TIN

DUAL

R-GDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

2.7 V

e3

41.885 mm

100 ns

M27V201L

STMicroelectronics

UVPROM

COMMERCIAL

32

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

262144 words

8

CHIP CARRIER

70 Cel

256KX8

256K

0 Cel

QUAD

S-CQCC-N32

5.5 V

Not Qualified

2097152 bit

3 V

200 ns

M27W801-120F6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

1048576 words

3

8

IN-LINE

2.54 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

R-CDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

8388608 bit

2.7 V

41.885 mm

120 ns

M27V101-200L6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

3.3

3.3/5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

TIN LEAD

QUAD

R-CQCC-N32

3.63 V

2.28 mm

11.43 mm

Not Qualified

1048576 bit

2.97 V

e0

.00002 Amp

13.97 mm

200 ns

M27W101-120F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

3

8

IN-LINE, WINDOW

2.54 mm

85 Cel

128KX8

128K

-40 Cel

MATTE TIN

DUAL

R-GDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

2.7 V

e3

41.885 mm

100 ns

WS57C51C-55CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

133 mA

16384 words

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

16KX8

16K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

131072 bit

4.5 V

e0

.035 Amp

13.97 mm

55 ns

WS57C71C-35L

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCJ

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

164 mA

32768 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LDCC32,.5X.6

EPROMs

1.27 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

TIN LEAD

QUAD

R-CQCC-J32

5.5 V

4.06 mm

11.24 mm

Not Qualified

262144 bit

4.5 V

e0

.02 Amp

13.945 mm

35 ns

M27W101-100F6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

3

8

IN-LINE, WINDOW

2.54 mm

85 Cel

128KX8

128K

-40 Cel

TIN

DUAL

R-GDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

2.7 V

e3

41.885 mm

100 ns

M27V101-120F1TR

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

3.3

8

IN-LINE, WINDOW

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

41.885 mm

120 ns

M27V101-120F6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

3.3

8

IN-LINE, WINDOW

2.54 mm

85 Cel

128KX8

128K

-40 Cel

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

41.885 mm

120 ns

WS27C010L-20DMB

STMicroelectronics

UVPROM

MILITARY

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883 Class B

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

60 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

42.295 mm

200 ns

WS57C256F-70CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

117 mA

32768 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e0

.0005 Amp

13.97 mm

70 ns

12.5

M27V101-120L1TR

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

3.3

3.3

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

QUAD

R-CQCC-N32

3.63 V

2.28 mm

11.43 mm

Not Qualified

1048576 bit

2.97 V

e0

.00002 Amp

13.97 mm

120 ns

5962-8606308YC

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

38535Q/M;38534H;883B

NO LEAD

PARALLEL

ASYNCHRONOUS

90 mA

32768 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-55 Cel

Gold (Au)

QUAD

R-CQCC-N32

5.5 V

2.92 mm

11.4 mm

Not Qualified

262144 bit

4.5 V

e4

.045 Amp

13.95 mm

70 ns

12.5

M27V401-150F6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

3.3

8

IN-LINE

2.54 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

4194304 bit

3 V

41.885 mm

150 ns

M27V401-150L6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

3.3/5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

2.28 mm

11.43 mm

Not Qualified

4194304 bit

3 V

e0

.00002 Amp

13.97 mm

150 ns

5962-8606305YX

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

32768 words

5

8

CHIP CARRIER, WINDOW

1.27 mm

125 Cel

32KX8

32K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.556 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e0

13.97 mm

150 ns

WS27C010L-15DMB

STMicroelectronics

UVPROM

MILITARY

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883 Class B

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

60 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

42.295 mm

150 ns

M27V801-180F1TR

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

1048576 words

3.3

8

IN-LINE, WINDOW

2.54 mm

70 Cel

1MX8

1M

0 Cel

DUAL

R-GDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

8388608 bit

3 V

41.885 mm

180 ns

M27V201-120F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

262144 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

MATTE TIN

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

2097152 bit

3 V

e3

.00002 Amp

41.885 mm

120 ns

M27V401-180F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

524288 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

4194304 bit

3 V

e0

.00002 Amp

41.885 mm

180 ns

M27V101-120F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

131072 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

e0

.00002 Amp

41.885 mm

120 ns

WS27C010L-20CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

60 mA

131072 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

13.97 mm

200 ns

M27V401-150L6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

524288 words

5

8

CHIP CARRIER, WINDOW

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

QUAD

R-CQCC-N32

5.5 V

2.28 mm

11.43 mm

Not Qualified

4194304 bit

3 V

13.97 mm

150 ns

WS57C51C-45CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

16384 words

5

8

CHIP CARRIER, WINDOW

1.27 mm

125 Cel

16KX8

16K

-55 Cel

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

131072 bit

4.5 V

13.97 mm

45 ns

M27V201-250L6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

262144 words

8

CHIP CARRIER, WINDOW

1.27 mm

85 Cel

256KX8

256K

-40 Cel

QUAD

R-CQCC-N32

5.5 V

2.28 mm

11.43 mm

Not Qualified

2097152 bit

3 V

13.97 mm

250 ns

5962-8606306YX

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

32768 words

5

8

CHIP CARRIER, WINDOW

1.27 mm

125 Cel

32KX8

32K

-55 Cel

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

13.97 mm

120 ns

M27W401-80F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

524288 words

COMMON

3

3/3.3

8

IN-LINE

DIP32,.6

EPROMs

2.54 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

MATTE TIN

DUAL

R-CDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

4194304 bit

2.7 V

ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V

e3

.000015 Amp

41.885 mm

80 ns

M27V201-180F1

STMicroelectronics

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

262144 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

MATTE TIN

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

2097152 bit

3 V

e3

.00002 Amp

41.885 mm

180 ns

M27W101-80F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

131072 words

COMMON

3

3/3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

DUAL

R-GDIP-T32

3.6 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

2.7 V

e3

.000015 Amp

41.885 mm

80 ns

WS57C128FB-45L

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCJ

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

139 mA

16384 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LDCC32,.5X.6

EPROMs

1.27 mm

70 Cel

3-STATE

16KX8

16K

0 Cel

TIN LEAD

QUAD

R-CQCC-J32

5.5 V

4.06 mm

11.24 mm

Not Qualified

131072 bit

4.5 V

e0

.0005 Amp

13.945 mm

45 ns

12.5

M27V101-90L6TR

STMicroelectronics

INDUSTRIAL

32

QCCN

RECTANGULAR

CERAMIC

YES

CMOS

NO LEAD

30 mA

131072 words

COMMON

3.3

3.3

8

CHIP CARRIER

LCC32,.45X.55

EPROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

R-XQCC-N32

Not Qualified

1048576 bit

e0

.00002 Amp

90 ns

WS57C256F-35C

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

50 mA

32768 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e0

.0002 Amp

13.97 mm

35 ns

12.75

M27V101-100F6

STMicroelectronics

UVPROM

INDUSTRIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

15 mA

131072 words

COMMON

3.3

3.3

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

TIN LEAD

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

3 V

e0

.00002 Amp

41.885 mm

100 ns

M27V101-250L1

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

3.3/5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

2.28 mm

11.43 mm

Not Qualified

1048576 bit

3 V

e0

.00002 Amp

13.97 mm

250 ns

WS57C71C-45CI

STMicroelectronics

UVPROM

INDUSTRIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

60 mA

32768 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e0

.025 Amp

13.97 mm

45 ns

M27V201-200L1TR

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

262144 words

8

CHIP CARRIER, WINDOW

1.27 mm

70 Cel

256KX8

256K

0 Cel

QUAD

R-CQCC-N32

5.5 V

2.28 mm

11.43 mm

Not Qualified

2097152 bit

3 V

13.97 mm

200 ns

5962-8606308YX

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

32768 words

5

8

CHIP CARRIER, WINDOW

1.27 mm

125 Cel

32KX8

32K

-55 Cel

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

13.97 mm

70 ns

M27V401-200F6TR

STMicroelectronics

UVPROM

INDUSTRIAL

32

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

3.3

8

IN-LINE

2.54 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-GDIP-T32

3.6 V

5.97 mm

15.24 mm

Not Qualified

4194304 bit

3 V

41.885 mm

200 ns

WS57C51C-45L

STMicroelectronics

UVPROM

COMMERCIAL

32

WQCCJ

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

139 mA

16384 words

5

5

8

CHIP CARRIER, WINDOW

LDCC32,.5X.6

EPROMs

1.27 mm

70 Cel

3-STATE

16KX8

16K

0 Cel

TIN LEAD

QUAD

R-CQCC-J32

5.5 V

4.06 mm

11.24 mm

Not Qualified

131072 bit

4.5 V

e0

13.945 mm

45 ns

WS27C010L-12CMB

STMicroelectronics

UVPROM

MILITARY

32

WQCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class B

NO LEAD

PARALLEL

ASYNCHRONOUS

60 mA

131072 words

COMMON

5

5

8

CHIP CARRIER, WINDOW

LCC32,.45X.55

EPROMs

1.27 mm

125 Cel

3-STATE

128KX8

128K

-55 Cel

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

3.3 mm

11.43 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

13.97 mm

120 ns

M27C1001-10XL1XTR

STMicroelectronics

COMMERCIAL

32

QCCN

RECTANGULAR

CERAMIC

YES

CMOS

NO LEAD

30 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

EPROMs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-XQCC-N32

1048576 bit

e0

.0001 Amp

100 ns

EPROM

EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.

EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.

EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.