209 FIFO 17

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Length	Maximum Access Time
CYF0018V18L-133BGXI	Cypress Semiconductor	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	600 mA	524288 words	1.5	1.5,1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	512KX36	512K	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	133 MHz	14 mm	Not Qualified	18874368 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1	30	260	YES	22 mm	10 ns
CYF2036V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				BALL		SYNCHRONOUS	500 mA	1048576 words	3.3	3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	1MX36	1M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3			100 MHz		Not Qualified	37748736 bit			e1					10 ns
CYF1018V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	524288 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	512KX36	512K	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	18874368 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF2036V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				BALL		SYNCHRONOUS	500 mA	1048576 words	1.8	1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	1MX36	1M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3			100 MHz		Not Qualified	37748736 bit			e1					10 ns
CYF1072V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	2097152 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	2MX36	2M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	75497472 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF1072V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	2097152 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	2MX36	2M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	75497472 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF2144V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	10 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	400 mA	4194304 words	1.5	3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	4MX36	4M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	150994944 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1			YES	22 mm	10 ns
CYF1018V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	524288 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	512KX36	512K	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	18874368 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF2144V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	10 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	400 mA	4194304 words	1.5	1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	4MX36	4M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	150994944 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1			YES	22 mm	10 ns
CYF2072V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				BALL		SYNCHRONOUS	500 mA	2097152 words	1.8	1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	2MX36	2M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3			100 MHz		Not Qualified	75497472 bit			e1	30	260			10 ns
CYF1036V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	1048576 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	1MX36	1M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	37748736 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF1036V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	41.67 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	1048576 words	1.5	1.5,1.8,3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	1MX36	1M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	100 MHz	14 mm	Not Qualified	37748736 bit	1.425 V	ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32	e1			YES	22 mm	10 ns
CYF2018V33L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				BALL		SYNCHRONOUS	500 mA	524288 words	3.3	3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	512KX36	512K	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3			100 MHz		Not Qualified	18874368 bit			e1					10 ns
CYF2018V18L-100BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				BALL		SYNCHRONOUS	500 mA	524288 words	1.8	1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	512KX36	512K	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3			100 MHz		Not Qualified	18874368 bit			e1					10 ns
CYF0144V18L-133BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	4194304 words	1.5	1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	4MX36	4M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	133 MHz	14 mm	Not Qualified	150994944 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1			YES	22 mm	10 ns
CYF0036V18L-133BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	600 mA	1048576 words	1.5	1.5,1.8	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	1MX36	1M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	133 MHz	14 mm	Not Qualified	37748736 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1			YES	22 mm	10 ns
CYF0144V33L-133BGXI	Infineon Technologies	OTHER FIFO	INDUSTRIAL	209	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	500 mA	4194304 words	1.5	3.3	36	GRID ARRAY	BGA209,11X19,40	FIFOs	1 mm	85 Cel	4MX36	4M	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B209	3	1.575 V	1.96 mm	133 MHz	14 mm	Not Qualified	150994944 bit	1.425 V	ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9	e1			YES	22 mm	10 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.