Infineon Technologies FIFO 24

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount Cycle Time No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Output Enable Maximum Standby Current Length Maximum Access Time

CY7C4275V-15ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

15 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

32768 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

32KX18

32K

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

66.7 MHz

10 mm

Not Qualified

589824 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

10 ns

CY7C4255V-15ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

15 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

8192 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

8KX18

8K

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

66.7 MHz

10 mm

Not Qualified

147456 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

10 ns

CY7C4285V-15ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

15 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

65536 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

64KX18

64K

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

66.7 MHz

10 mm

Not Qualified

1179648 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

10 ns

CY7C4285V-15ASXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

15 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

35 mA

65536 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

85 Cel

64KX18

64K

-40 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

66.7 MHz

10 mm

Not Qualified

1179648 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

10 ns

CYF2036V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

SYNCHRONOUS

500 mA

1048576 words

3.3

3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

1MX36

1M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

100 MHz

Not Qualified

37748736 bit

e1

10 ns

CYF1018V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

524288 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

512KX36

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

18874368 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF2036V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

SYNCHRONOUS

500 mA

1048576 words

1.8

1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

1MX36

1M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

100 MHz

Not Qualified

37748736 bit

e1

10 ns

CYF1072V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

2097152 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

2MX36

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

75497472 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF1072V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

2097152 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

2MX36

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

75497472 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF2144V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

10 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

400 mA

4194304 words

1.5

3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

4MX36

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

150994944 bit

1.425 V

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

e1

YES

22 mm

10 ns

CYF1018V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

524288 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

512KX36

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

18874368 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF2144V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

10 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

400 mA

4194304 words

1.5

1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

4MX36

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

150994944 bit

1.425 V

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

e1

YES

22 mm

10 ns

CYF2072V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

SYNCHRONOUS

500 mA

2097152 words

1.8

1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

2MX36

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

100 MHz

Not Qualified

75497472 bit

e1

30

260

10 ns

CYF1036V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

1048576 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

1MX36

1M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

37748736 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF1036V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

41.67 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

1048576 words

1.5

1.5,1.8,3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

1MX36

1M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

100 MHz

14 mm

Not Qualified

37748736 bit

1.425 V

ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32

e1

YES

22 mm

10 ns

CYF2018V33L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

SYNCHRONOUS

500 mA

524288 words

3.3

3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

512KX36

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

100 MHz

Not Qualified

18874368 bit

e1

10 ns

CYF2018V18L-100BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

SYNCHRONOUS

500 mA

524288 words

1.8

1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

512KX36

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

100 MHz

Not Qualified

18874368 bit

e1

10 ns

CYF0144V18L-133BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

7.5 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

4194304 words

1.5

1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

4MX36

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

133 MHz

14 mm

Not Qualified

150994944 bit

1.425 V

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

e1

YES

22 mm

10 ns

CY7C4292V-10ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

GULL WING

SYNCHRONOUS

25 mA

131072 words

3.3

3.3

9

FLATPACK

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

128KX9

128K

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

100 MHz

10 mm

Not Qualified

1179648 bit

3 V

e3

20

260

.006 Amp

10 mm

8 ns

CYF0036V18L-133BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

7.5 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

600 mA

1048576 words

1.5

1.5,1.8

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

1MX36

1M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

133 MHz

14 mm

Not Qualified

37748736 bit

1.425 V

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

e1

YES

22 mm

10 ns

CYF0144V33L-133BGXI

Infineon Technologies

OTHER FIFO

INDUSTRIAL

209

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

7.5 ns

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

500 mA

4194304 words

1.5

3.3

36

GRID ARRAY

BGA209,11X19,40

FIFOs

1 mm

85 Cel

4MX36

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B209

3

1.575 V

1.96 mm

133 MHz

14 mm

Not Qualified

150994944 bit

1.425 V

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

e1

YES

22 mm

10 ns

CY7C4285V-10ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

10 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

65536 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

64KX18

64K

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

100 MHz

10 mm

Not Qualified

1179648 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

8 ns

CY7C4285V-15ASC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

15 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

65536 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

3-STATE

64KX18

64K

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

66 MHz

10 mm

Not Qualified

1179648 bit

3 V

RETRANSMIT

e0

YES

.004 Amp

10 mm

10 ns

CY7C4255V-10ASXC

Infineon Technologies

OTHER FIFO

COMMERCIAL

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

10 ns

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

30 mA

8192 words

3.3

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

FIFOs

.5 mm

70 Cel

8KX18

8K

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

3

3.6 V

1.6 mm

100 MHz

10 mm

Not Qualified

147456 bit

3 V

RETRANSMIT

e3

20

260

YES

.004 Amp

10 mm

8 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.