Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.5 V |
e4 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
Gigadevice Semiconductor |
FLASH |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
45 mA |
67108864 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.000025 Amp |
8 mm |
3.3 |
|||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
14 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.85 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
10 |
260 |
NOR TYPE |
.00006 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.85 mm |
104 MHz |
6 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3.3 |
|||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
80 MHz |
2 mm |
16777216 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
1 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3.6 V |
.5 mm |
100000 Write/Erase Cycles |
133 MHz |
4 mm |
SPI |
67108864 bit |
3 V |
IT ALSO OPERATES AT 2.7V @ 104MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
4 mm |
3.3 |
|||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.85 mm |
133 MHz |
6 mm |
67108864 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.85 mm |
104 MHz |
6 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3.3 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
Flash Memories |
20 |
.5 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
IT ALSO OPERATES AT 2.3 V AT 80 MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
3 mm |
2.7 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
16777216 bit |
2.3 V |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.8 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
3 |
3.6 V |
.6 mm |
108 MHz |
4 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
4 mm |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
1.7 V |
e3 |
NOR TYPE |
.0003 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
20 |
.5 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.5 mm |
100000 Write/Erase Cycles |
120 MHz |
2 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
64MX1 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
67108864 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
50 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
6 mm |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
134217728 bit |
2.3 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N |
1 |
3.6 V |
.6 mm |
104 MHz |
2 mm |
2097152 bit |
1.65 V |
IT ALSO OPERATES AT 2.3V MIN |
e4 |
NOR TYPE |
3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
134217728 bit |
2.3 V |
ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00007 Amp |
8 mm |
3 |
|||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.00002 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
133 MHz |
5 mm |
33554432 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
Not Qualified |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e4 |
NOR TYPE |
.00004 Amp |
6 mm |
3 |
||||||||||||||||||||
|
Macronix |
FLASH |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
1.65 V |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
1.27 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
133 MHz |
6 mm |
536870912 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
134217728 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
10 |
1.27 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
1.95 V |
.65 mm |
100000 Write/Erase Cycles |
83 MHz |
6 mm |
SPI |
1073741824 bit |
1.7 V |
SLC NAND TYPE |
.00005 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
134217728 bit |
1.65 V |
CAN BE ORGANISED AS 128 MBIT X 1 |
e3 |
NOR TYPE |
.00002 Amp |
6 mm |
1.8 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
40 mA |
134217728 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
128MX4 |
128M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
536870912 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 512M X 1 BIT |
e3 |
NOR TYPE |
.00004 Amp |
8 mm |
3 |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
1.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
1.8 |
||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
27 mA |
8388608 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
2 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
67108864 bit |
1.7 V |
NOR TYPE |
.00005 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
67108864 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
1.65 V |
e3 |
10 |
260 |
NOR TYPE |
.00014 Amp |
8 mm |
1.8 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
86 MHz |
6 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
8 mm |
3.3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
536870912 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
108 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0005 Amp |
8 mm |
3 |
||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
100 |
.5 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
30 |
260 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
131072 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
2 mm |
SPI |
1048576 bit |
1.65 V |
NOR TYPE |
.0000145 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
2 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
3 mm |
3 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.8 mm |
105 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
133 MHz |
3 mm |
33554432 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
67108864 bit |
1.65 V |
e3 |
NOR TYPE |
.000015 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
70 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.3 V |
e4 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
1 mm |
85 MHz |
6 mm |
33554432 bit |
2.3 V |
e4 |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
67108864 bit |
2.7 V |
e3 |
30 |
260 |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
30 |
260 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16.5 mA |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
33554432 bit |
2.7 V |
ALSO OPERATES AT 108MHZ @1.65V MINIMUM SUPPLY |
e4 |
260 |
NOR TYPE |
.00005 Amp |
5 mm |
1.8 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.