HVSON Flash Memory 1,776

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

IS25LP128F-JKLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

16MX8

16M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

166 MHz

5 mm

134217728 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

IS25WP256D-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

33554432 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.85 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

268435456 bit

1.65 V

e3

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00003 Amp

8 mm

1.8

MX25L1606EZNI-12G

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

86 MHz

5 mm

Not Qualified

SPI

16777216 bit

2.7 V

e3

NOR TYPE

.00002 Amp

6 mm

3

MX25R1635FZNIH0

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4194304 words

1.8

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

1.27 mm

85 Cel

4MX4

4M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

80 MHz

5 mm

16777216 bit

1.65 V

IT IS ALSO CONFIGURED AS 16M X 1

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

MX25V1635FZNI

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4194304 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

1.27 mm

85 Cel

4MX4

4M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

80 MHz

5 mm

16777216 bit

2.3 V

ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

N25Q256A13EF840F

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

268435456 bit

2.7 V

SPI-COMPATIBLE SERIAL BUS INTERFACE

30

260

NOR TYPE

.0001 Amp

8 mm

3

SST25PF040CT-40V/NP

Microchip Technology

FLASH

INDUSTRIAL

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

4194304 words

3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

20

.5 mm

105 Cel

3-STATE

4MX1

4M

-40 Cel

MATTE TIN

DUAL

1

SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

40 MHz

2 mm

SPI

4194304 bit

2.3 V

e3

NOR TYPE

.00001 Amp

3 mm

3.3

SST25VF040B-50-4I-QAF-T

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

4194304 words

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

3-STATE

4MX1

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

SOFTWARE

R-XDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

50 MHz

5 mm

Not Qualified

SPI

4194304 bit

2.7 V

e4

NOR TYPE

.00003 Amp

6 mm

W25M02GVZEIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1073741824 words

3

2

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

1GX2

1G

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

104 MHz

6 mm

2147483648 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

8 mm

3

AT45DB161E-MHF-Y

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

26 mA

16777216 words

3

2.5/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

16MX1

16M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

70 MHz

5 mm

Not Qualified

SPI

16777216 bit

2.3 V

e4

NOR TYPE

.00001 Amp

6 mm

2.7

MX25U3235FZNI-10G

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

8388608 words

1.8

1.8

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

2

Flash Memories

10

1.27 mm

85 Cel

8MX4

8M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

2 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

33554432 bit

1.65 V

CAN BE ORGANISED AS 32 MBIT X 1

e3

NOR TYPE

.00002 Amp

6 mm

1.8

MX25U51245GZ4I54

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4

1.27 mm

85 Cel

64MX8

64M

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N8

2 V

.8 mm

166 MHz

6 mm

536870912 bit

1.65 V

IT CAN ALSO CONFIGURED AS 256M X 2 AND 512M X 1

e3

8 mm

1.8

MX25V4035FZUI

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1048576 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

1.27 mm

85 Cel

1MX4

1M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

108 MHz

5 mm

4194304 bit

2.3 V

ALSO IT CAN BE CONFIGURED AS 4M X 1 BIT

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

SST25VF080B-50-4I-QAF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

8388608 words

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

3-STATE

8MX1

8M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

50 MHz

5 mm

Not Qualified

SPI

8388608 bit

2.7 V

e4

NOR TYPE

.00003 Amp

6 mm

SST26VF064B-104V/MN

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

67108864 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

100

1.27 mm

105 Cel

3-STATE

64MX1

64M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

6 mm

SPI

67108864 bit

2.7 V

e3

NOR TYPE

.000045 Amp

8 mm

3

AT25SF161B-MHB-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

2097152 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

20

1.27 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

108 MHz

5 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.00003 Amp

6 mm

3

AT45DB321E-MWHF-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

32MX1

32M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

3

3.6 V

1 mm

85 MHz

6 mm

33554432 bit

2.3 V

e4

260

8 mm

3

IS25WP064A-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

8388608 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-N8

1.95 V

.85 mm

133 MHz

6 mm

67108864 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

MX25L12833FZ2I-10G

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

4

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

2.7 V

IT CAN ALSO BE CONFIGURED AS 64M X 2 AND 128M X 1

e3

NOR TYPE

.00005 Amp

8 mm

3

MX25L25645GZ2I-10G

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3

3.6 V

.8 mm

100000 Write/Erase Cycles

120 MHz

6 mm

SPI

268435456 bit

2.7 V

e3

NOR TYPE

.00002 Amp

8 mm

3

MX25L3233FZBI-08QTR

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,32

4

20

.8 mm

85 Cel

4MX8

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

133 MHz

3 mm

SPI

33554432 bit

2.65 V

16MX2BIT MEMORYCONFIGURATION IS ALSO AVAILABLE

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

4 mm

3.3

MX25U6435FZNI-10G

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

1.8

1.8

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

2

Flash Memories

10

1.27 mm

85 Cel

16MX4

16M

-40 Cel

TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

2 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

67108864 bit

1.65 V

CAN BE ORGANISED AS 64 MBIT X 1

e3

NOR TYPE

.00002 Amp

6 mm

1.8

S25FS128SAGNFI101

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

2 V

.8 mm

100000 Write/Erase Cycles

133 MHz

5 mm

SPI

134217728 bit

1.7 V

e3

NOR TYPE

.0003 Amp

6 mm

1.8

SST25VF080B-50-4C-QAF

Microchip Technology

FLASH

COMMERCIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

8388608 words

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

70 Cel

3-STATE

8MX1

8M

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

50 MHz

5 mm

Not Qualified

SPI

8388608 bit

2.7 V

e4

NOR TYPE

.00003 Amp

6 mm

SST26VF064BT-104V/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

67108864 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

100

1.27 mm

105 Cel

3-STATE

64MX1

64M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

SPI

67108864 bit

2.7 V

e3

NOR TYPE

.000045 Amp

6 mm

3

W25Q128FVPIF

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

104 MHz

5 mm

134217728 bit

2.7 V

NOR TYPE

6 mm

3

W25Q64FWZPIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

64MX1

64M

-40 Cel

DUAL

R-PDSO-N8

1.95 V

.8 mm

104 MHz

5 mm

67108864 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

1.8

W25R256JVEIQTR

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

45 mA

33554432 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

DUAL

SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

3 V

ALSO OPERATES AT 104MHZ AT 2.7-3.0V

NOR TYPE

.000025 Amp

8 mm

3

AT45DB081E-MHN-Y

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16 mA

1048576 words

3

1.8/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

3-STATE

1MX8

1M

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

133 MHz

5 mm

Not Qualified

SPI

8388608 bit

2.3 V

IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE

e4

NOR TYPE

.00004 Amp

6 mm

3

AT45DB321E-MWHF-Y

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

32MX1

32M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

3

3.6 V

1 mm

85 MHz

6 mm

33554432 bit

2.3 V

e4

260

8 mm

3

GD25Q80EEIGR

Gigadevice Semiconductor

FLASH

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

1048576 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

20

.5 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.5 mm

100000 Write/Erase Cycles

133 MHz

2 mm

SPI

8388608 bit

3 V

2.7V TO 3V @ 104MHZ

NOR TYPE

.00004 Amp

3 mm

3.3

SST26VF016BT-104I/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

16777216 bit

2.7 V

e3

NOR TYPE

.000025 Amp

6 mm

3

W25Q80DLZPIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1048576 words

2.5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

80 MHz

5 mm

8388608 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

2.7

W25Q80EWUXIETR

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

1048576 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.6 mm

100000 Write/Erase Cycles

104 MHz

2 mm

SPI

8388608 bit

1.65 V

NOR TYPE

.0000075 Amp

3 mm

1.8

W25R256JVEIQ

Winbond Electronics

FLASH

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.00012 Amp

8 mm

3

AT25FF161A-MAHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

133 MHz

2 mm

SPI

16777216 bit

1.65 V

e4

NOR TYPE

.00005 Amp

3 mm

1.8

AT25SF321B-MHB-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

108 MHz

5 mm

SPI

33554432 bit

2.7 V

e4

260

NOR TYPE

.000025 Amp

6 mm

3

AT25XE161D-MAHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

108 MHz

2 mm

SPI

16777216 bit

1.65 V

NOR TYPE

.00005 Amp

3 mm

1.8

AT45DB321D-MU

Atmel

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

32MX1

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

1 mm

100000 Write/Erase Cycles

66 MHz

5 mm

Not Qualified

SPI

33554432 bit

2.7 V

ORGANIZED AS 8192 PAGES OF 528 BYTES EACH

e3

NOR TYPE

.00001 Amp

6 mm

2.7

GD25Q16CNIGR

Gigadevice Semiconductor

FLASH

8

HVSON

RECTANGULAR

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

2097152 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,32

20

.8 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

120 MHz

3 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000005 Amp

4 mm

3.3

IS25LQ040B-JKLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4194304 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

105 Cel

4MX1

4M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

104 MHz

5 mm

4194304 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

MT25QU128ABA1EW9-0SITTR

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

35 mA

16777216 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE

R-PDSO-N8

2 V

.8 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

134217728 bit

1.7 V

30

260

NOR TYPE

.00003 Amp

8 mm

1.8

IS25LQ040B-JKLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4194304 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

105 Cel

4MX1

4M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

104 MHz

5 mm

4194304 bit

2.3 V

6 mm

3

N25Q128A13EF740F

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

5 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

6 mm

3

SST26WF016BA-104I/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

SPI

16777216 bit

1.65 V

e3

NOR TYPE

.000005 Amp

6 mm

1.8

SST26WF016BAT-104I/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

SPI

16777216 bit

1.65 V

e3

NOR TYPE

.000005 Amp

6 mm

1.8

W25Q128FVPIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

134217728 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

6 mm

3

AT25EU0021A-MAHN-T

Renesas Electronics

FLASH

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

262144 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

85 MHz

2 mm

SPI

2097152 bit

1.65 V

NOR TYPE

.0000145 Amp

3 mm

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.