TBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S25FS512SAGBHN210

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

128MX4

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

133 MHz

6 mm

BOTTOM

536870912 bit

1.7 V

IT ALSO HAS X1 MEMORY WIDTH

NOR TYPE

8 mm

1.8

S70FL01GSDSBHIC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

200 mA

134217728 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

.0002 Amp

8 mm

3

S25FL256SDSBHAD03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL512SDSBHI310

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

4

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

3

S25FS128SDSBHM203

Infineon Technologies

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

1 mm

125 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PBGA-B24

3

2 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

1.7 V

NOR TYPE

.0003 Amp

8 mm

1.8

S25FL128SDPBHVD11

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL256SDSBHM203

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHMA10

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHB300

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHIB10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FS512SDSBHA210

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

YES

1

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

2 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

536870912 bit

1.7 V

e1

NOR TYPE

.0001 Amp

8 mm

1.8

S25FL256SDPBHB210

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

66 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

e1

8 mm

3

S25FL128SDSBHVA00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHID00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHVC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0003 Amp

8 mm

3

S70FL01GSDPBHBC13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

66 MHz

6 mm

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SDPBHID01

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL512SDSBHMA10

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

ITS ALSO CONFIGURABLE AS 512MX1

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

3

S25FL128SDSBHI313

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S70FL01GSDPBHV010

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

200 mA

134217728 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

20

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

1000000 Write/Erase Cycles

66 MHz

6 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

.0006 Amp

8 mm

3

S25FL128SAGBHAB13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL256SAGBAEC10

Infineon Technologies

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

32MX8

32M

-55 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FL256SDSBHAD00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHI310

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHAA10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SDSBHBD03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHIC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL512SDSBHVA10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

MATTE TIN

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

e3

30

260

NOR TYPE

.0003 Amp

8 mm

3

S25FL256SDSBHAD13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SDPBHEC10

Infineon Technologies

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

16777216 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

16MX8

16M

-55 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100 Write/Erase Cycles

66 MHz

6 mm

SPI

134217728 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FL128SDSBHVC00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHMB13

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHI211

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SDSBHID13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHVC00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0003 Amp

8 mm

3

S25FS512SAGBHB213

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

536870912 bit

1.7 V

NOR TYPE

.0001 Amp

8 mm

1.8

S25FL256SDSBHVC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHB303

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL032P0XBHB030

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

32MX1

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

104 MHz

6 mm

33554432 bit

2.7 V

NOR TYPE

8 mm

3

S25FL512SDSBHVA13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

3

S25FL256SDSBHMB10

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHMC03

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHA300

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHVC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL256SDSBHVD13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL256SDSBHV213

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

32MX8

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

80 MHz

6 mm

268435456 bit

2.7 V

e1

8 mm

3

S25FL128SDPBHIC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

66 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL064LABBHA023

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

.03 mA

8388608 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

8MX8

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

108 MHz

6 mm

SPI

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e1

NOR TYPE

.000055 Amp

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.