VFBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

SDINBDG4-16G-I2

Western Digital

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

3000 Write/Erase Cycles

11 mm

137438953472 bit

2.7 V

MLC NAND TYPE

13.5 mm

S34MS01G200BHI000

Cypress Semiconductor

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

9 mm

1073741824 bit

1.7 V

260

SLC NAND TYPE

11 mm

1.8

S34ML02G100BHI000

Cypress Semiconductor

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

268435456 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

3

3.6 V

1 mm

9 mm

Not Qualified

2147483648 bit

2.7 V

2K

260

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

3

NO

SDINBDG4-8G-I1T

Western Digital

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

3

3.6 V

.8 mm

3000 Write/Erase Cycles

200 MHz

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

EMMC32G-TX29-8AC01

Kingston Technology Company

FLASH CARD

153

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-25 Cel

NO

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

200 MHz

11.5 mm

274877906944 bit

2.7 V

TLC NAND TYPE

13 mm

3.3

NO

MT29F1G08ABAFAH4-ITE:F

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

11 mm

3.3

MT29F8G08ADADAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

8589934592 words

3.3

NO

3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

8GX8

8G

-40 Cel

8K

YES

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

68719476736 bit

2.7 V

2K

e1

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

3.3

NO

S29GL064N90BFI030

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

67108864 bit

2.7 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

90 ns

3

YES

MT29F1G08ABADAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

1073741824 bit

2.7 V

2K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

3.3

NO

MT29F4G01AAADDHC-ITX:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

4294967296 words

3.3

3/3.3

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

10

.8 mm

85 Cel

4GX1

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B63

3.6 V

1 mm

100000 Write/Erase Cycles

50 MHz

10.5 mm

Not Qualified

SPI

4294967296 bit

2.7 V

e1

30

260

SLC NAND TYPE

.00005 Amp

13 mm

3.3

MT29F4G08ABADAH4:D

Micron Technology

FLASH

COMMERCIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

536870912 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

512MX8

512M

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

4294967296 bit

2.7 V

2K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

NO

S29AL016J70BFI010

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

S34ML02G200BHI000

Cypress Semiconductor

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

268435456 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

3

3.6 V

1 mm

9 mm

Not Qualified

2147483648 bit

2.7 V

2K

260

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

3

NO

KLMBG2JETD-B0410

Samsung

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

1.95 V

.8 mm

200 MHz

11.5 mm

274877906944 bit

1.7 V

ALSO OPERATES @ 3V SUP NOM

MLC NAND TYPE

13 mm

1.8

S29GL512T10GHI020

Infineon Technologies

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B56

3

3.6 V

1 mm

7 mm

536870912 bit

2.7 V

9 mm

100 ns

2.7

S29AL008J70BFI020

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

12 mA

524288 words

3

YES

3,3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

TIN COPPER SILVER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

30

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

S29GL064S70BHI030

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

80 mA

4194304 words

3

YES

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

20

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

8,127

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

100000 Write/Erase Cycles

6.15 mm

TOP

67108864 bit

2.7 V

8/16

NOR TYPE

.0001 Amp

8.15 mm

70 ns

3

YES

SDINBDG4-32G-XI2

Western Digital

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

3000 Write/Erase Cycles

11 mm

274877906944 bit

2.7 V

MLC NAND TYPE

13.5 mm

EMMC04G-W627-X03U

Kingston Technology Company

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

4GX8

4G

-40 Cel

NO

BOTTOM

R-PBGA-B153

3.6 V

1 mm

200 MHz

11.5 mm

34359738368 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

NO

SDIN5D1-2G-L

Sandisk

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2147483648 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

2GX8

2G

-25 Cel

BOTTOM

R-PBGA-B153

3

3.6 V

1 mm

11.5 mm

17179869184 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

S29GL01GT10GHI020

Infineon Technologies

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

R-PBGA-B56

3

3.6 V

1 mm

7 mm

1073741824 bit

2.7 V

9 mm

100 ns

2.7

S29WS256P0SBFW000

Infineon Technologies

FLASH

OTHER

84

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

80 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA84,10X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

8,254

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B84

3

1.95 V

1 mm

8 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION POSSIBLE

8

e1

40

260

NOR TYPE

.000005 Amp

11.6 mm

YES

80 ns

1.8

YES

SDINBDG4-16G-ZA

Western Digital

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

15

.5 mm

105 Cel

16GX8

16G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

11.5 mm

137438953472 bit

2.7 V

MLC NAND TYPE

13 mm

ASFC8G31M-51BIN

Alliance Memory

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

8GX8

8G

-40 Cel

NO

BOTTOM

R-PBGA-B153

3.6 V

1 mm

200 MHz

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

3

NO

MT29F2G08ABBEAH4-IT:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

268435456 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

Not Qualified

2147483648 bit

1.7 V

2K

e1

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

1.8

NO

EMMC04G-W627-E02U

Kingston Technology Company

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

85.7 mA

4294967296 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

4GX8

4G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

200 MHz

11.5 mm

34359738368 bit

2.7 V

MLC NAND TYPE

.00013 Amp

13 mm

3.3

MTFC32GAZAQHD-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B153

1.95 V

.9 mm

200 MHz

11.5 mm

274877906944 bit

1.7 V

NAND TYPE

13 mm

1.8

MX30LF1G18AC-XKI

Macronix

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

131072 words

3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128KX8

128K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

1048576 bit

2.7 V

e1

SLC NAND TYPE

11 mm

3

S29GL512S10GHI020

Infineon Technologies

FLASH

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,8X8,32

1

2

.8 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B56

3

3.6 V

1 mm

100000 Write/Erase Cycles

7 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

NAND TYPE

.0001 Amp

9 mm

YES

100 ns

3

YES

EM32FQYHY-BA000-2

Delkin Devices

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-40 Cel

NO

BOTTOM

HARDWARE

R-PBGA-B156

1 mm

11.5 mm

274877906944 bit

TLC NAND TYPE

13 mm

3.3

NO

MT29F4G08ABBDAHC-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

536870912 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

10.5 mm

Not Qualified

4294967296 bit

1.7 V

2K

e1

30

260

SLC NAND TYPE

.00005 Amp

13 mm

25 ns

1.8

NO

S29PL127J70BAI000

Cypress Semiconductor

FLASH

INDUSTRIAL

80

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

8388608 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-40 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

3.6 V

1 mm

8 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

TOP AND BOTTOM BOOT BLOCK

8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

11 mm

YES

70 ns

3

YES

MTFC64GAZAQHD-IT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

95 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

549755813888 bit

2.7 V

NAND TYPE

13 mm

EM04APYD3-BA000-2

Delkin Devices

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4GX8

4G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

13 mm

3.3

MTFC2GMXEA-WT

Micron Technology

Embedded MMC

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

70 mA

2147483648 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

OPEN-DRAIN

2GX8

2G

-25 Cel

BOTTOM

HARDWARE

R-PBGA-B153

1.95 V

.8 mm

52 MHz

11.5 mm

17179869184 bit

1.65 V

NAND TYPE

13 mm

1.8

MX25R3235FBDIL0

Macronix

FLASH

INDUSTRIAL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

6 mA

4194304 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,5X7,14/8

2

20

.35 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B12

3.6 V

.52 mm

100000 Write/Erase Cycles

80 MHz

SPI

33554432 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000024 Amp

1.8

MT29F1G08ABBEAH4-ITX:E

Micron Technology

FLASH

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

134217728 words

1.8

YES

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

.8 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

NO

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

1.7 V

2K

SLC NAND TYPE

.00005 Amp

11 mm

1.8

YES

MTFC8GLDEA-1MWT

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

8GX8

8G

-25 Cel

NO

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

52 MHz

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

NO

SDINBDG4-32G-ZA

Western Digital

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

15

.5 mm

105 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER NICKEL GERMANIUM

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

274877906944 bit

2.7 V

MLC NAND TYPE

13 mm

SDINBDG4-32G-XA

Western Digital

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

15

.5 mm

85 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

274877906944 bit

2.7 V

MLC NAND TYPE

13 mm

ASFC4G31M-51BINTR

Alliance Memory

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

4GX8

4G

-40 Cel

NO

BOTTOM

R-PBGA-B153

3.6 V

1 mm

200 MHz

11.5 mm

34359738368 bit

2.7 V

MLC NAND TYPE

13 mm

3

NO

S29AL016J70BFI012

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

S29AL016J70BFI013

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

S29AL016J70BFI023

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

EMMC16G-M525-X01U

Kingston Technology Company

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

BOTTOM

R-PBGA-B153

1 mm

11.5 mm

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

13 mm

3.3

MT29F4G08ABBDAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

536870912 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

Not Qualified

4294967296 bit

1.7 V

2K

30

260

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

1.8

NO

SDINBDG4-32G-I2

Western Digital

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

3000 Write/Erase Cycles

11 mm

274877906944 bit

2.7 V

MLC NAND TYPE

13.5 mm

SFEM008GB1EA1TO-I-GE-111-STD

Swissbit Ag

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

8589934592 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8GX8

8G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

68719476736 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

13 mm

3.3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.