Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Macronix |
FLASH |
3 |
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|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
86 MHz |
5.23 mm |
SPI |
67108864 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
5.28 mm |
3.3 |
|||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
86 MHz |
5.23 mm |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
5.28 mm |
3 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BUTT |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
4 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
BOTTOM |
R-PBCC-B8 |
3.6 V |
.6 mm |
80 MHz |
2 mm |
16777216 bit |
1.65 V |
ALSO CONFIGURABLE AS 16MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
1.27 mm |
85 Cel |
128MX4 |
128M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
104 MHz |
6 mm |
536870912 bit |
2.7 V |
CAN BE ORGNISED AS 512 MBIT X 1 |
e3 |
8 mm |
2.7 |
|||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
524288 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
86 MHz |
3.9 mm |
SPI |
4194304 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000025 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
6 mA |
4194304 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
80 MHz |
5 mm |
SPI |
33554432 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000024 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1073741824 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
8589934592 bit |
2.7 V |
e3 |
SLC NAND TYPE |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.15,32 |
1 |
Flash Memories |
20 |
.8 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
86 MHz |
4 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
4 mm |
3 |
|||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
33554432 bit |
2.65 V |
ALSO ORGANISED AS 32MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
5.28 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
2 |
SMALL OUTLINE |
SOP8,.3 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX2 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
86 MHz |
5.23 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
5.28 mm |
2.7 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
50 mA |
524288 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
8388608 bit |
4.5 V |
TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
536870912 bit |
1.65 V |
e1 |
NOR TYPE |
.00005 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
3/3.3 |
2 |
SMALL OUTLINE |
SOP8,.31 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
TOTEM POLE |
16MX2 |
16M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
86 MHz |
5.23 mm |
Not Qualified |
3-WIRE |
33554432 bit |
2.7 V |
e3 |
NOR TYPE |
.00004 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
128MX4 |
128M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
104 MHz |
7.52 mm |
536870912 bit |
2.7 V |
CAN BE ORGNISED AS 512 MBIT X 1 |
e3 |
40 |
260 |
10.3 mm |
2.7 |
|||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
SPI |
33554432 bit |
2.65 V |
ALSO ORGANISED AS 32MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
4.9 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.52 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 128M X 1 |
e3 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
120 MHz |
6 mm |
SPI |
268435456 bit |
2.7 V |
e1 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
2MX4 |
2M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
108 MHz |
2 mm |
8388608 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 8M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
3 |
||||||||||||||||||||||||||||||||
Macronix |
FLASH |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
262144 words |
3 |
3/3.3 |
2 |
SMALL OUTLINE |
SOP8,.25 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256KX2 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
Not Qualified |
SPI |
524288 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
80 MHz |
3.9 mm |
16777216 bit |
1.65 V |
IT IS ALSO CONFIGURED AS 16M X 1 |
e3 |
4.9 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
4 |
GRID ARRAY, THIN PROFILE |
2 |
1 mm |
85 Cel |
128MX4 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
166 MHz |
6 mm |
536870912 bit |
2.7 V |
ALSO CONFIGURED WITH 1-BIT WIDTH |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 128M X 1 |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
200 MHz |
6 mm |
536870912 bit |
1.65 V |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
130 mA |
268435456 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA24,5X5,40 |
4 |
20 |
1 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.3 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
2147483648 bit |
2.7 V |
IT CAN ALSO CONFIGURED AS 1G X 2 AND 2G X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0006 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
131072 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
1 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
HARDWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
SPI |
1048576 bit |
2.7 V |
ALSO OPERATES AT 2.3-2.7V@50MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000001 Amp |
4.9 mm |
3.3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
104 MHz |
5.23 mm |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE |
SOP8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
2 V |
2.16 mm |
100000 Write/Erase Cycles |
104 MHz |
5.23 mm |
Not Qualified |
SPI |
67108864 bit |
1.65 V |
CAN BE ORGANISED AS 64 MBIT X 1 |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
5.28 mm |
1.8 |
||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
524288 words |
3.3 |
2 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
512KX2 |
512K |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
80 MHz |
3.9 mm |
1048576 bit |
2.7 V |
ALSO OPERATES 2.3-2.7V SUP @ 50MHZ |
e3 |
4.9 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
67108864 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
DUAL |
R-PDSO-G8 |
2 V |
2.16 mm |
104 MHz |
5.23 mm |
134217728 bit |
1.65 V |
IT CAN ALSO BE CONFIGURABLE AS 128MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
1.65 V |
CAN BE ORGANISED AS 128 MBIT X 1 |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
1.8 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
86 MHz |
7.52 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE |
SOP8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
8MX4 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
2 V |
2.16 mm |
100000 Write/Erase Cycles |
104 MHz |
5.23 mm |
Not Qualified |
SPI |
33554432 bit |
1.65 V |
CAN BE ORGANISED AS 32 MBIT X 1 |
e3 |
NOR TYPE |
.00002 Amp |
5.28 mm |
1.8 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
33554432 bit |
2.65 V |
ALSO ORGANISED AS 32MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE |
4 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.52 mm |
134217728 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 64M X 2 AND 128M X 1 |
e3 |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 128M X 1 |
e3 |
NOR TYPE |
.00002 Amp |
6 mm |
3 |
|||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
2.16 mm |
80 MHz |
5.23 mm |
16777216 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
256MX4 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
166 MHz |
7.52 mm |
1073741824 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
120 MHz |
7.52 mm |
134217728 bit |
2.7 V |
CAN BE ORGANISED AS 128 M X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
80 MHz |
2 mm |
16777216 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
1048576 bit |
2.7 V |
e1 |
SLC NAND TYPE |
11 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
256MX4 |
256M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
104 MHz |
7.52 mm |
1073741824 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT |
e3 |
10.3 mm |
2.7 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
.000015 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
2.16 mm |
120 MHz |
5.23 mm |
134217728 bit |
2.7 V |
CAN BE ORGANISED AS 128 M X 1 |
e3 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
120 MHz |
7.52 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
86 MHz |
7.52 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.3 mm |
3.3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.