RECTANGULAR MASK ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
SN54S270J	Texas Instruments	MASK ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	THROUGH-HOLE			155 mA	512 words	5	5	4	IN-LINE	DIP20,.3		MASK ROMs	2.54 mm	125 Cel		512X4	512	-55 Cel		DUAL	R-XDIP-T20					Not Qualified	2048 bit				NOT SPECIFIED	NOT SPECIFIED			95 ns
SN74S371J	Texas Instruments	MASK ROM	COMMERCIAL	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	THROUGH-HOLE			155 mA	256 words	5	5	8	IN-LINE	DIP20,.3		MASK ROMs	2.54 mm	70 Cel		256X8	256	0 Cel		DUAL	R-XDIP-T20					Not Qualified	2048 bit				NOT SPECIFIED	NOT SPECIFIED			70 ns
TSP60C19N	Texas Instruments	MASK ROM	OTHER	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			.3 mA	16384 words	5	5	16	IN-LINE	DIP16,.3		MASK ROMs	2.54 mm	80 Cel		16KX16	16K	-40 Cel		DUAL	R-PDIP-T16					Not Qualified	262144 bit						.0001 Amp
SN5488AW	Texas Instruments	MASK ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC	YES		TTL	FLAT			80 mA	32 words	5	5	8	FLATPACK	FL16,.3		MASK ROMs	1.27 mm	125 Cel		32X8	32	-55 Cel		DUAL	R-XDFP-F16					Not Qualified					NOT SPECIFIED	NOT SPECIFIED			45 ns
5962-01-028-6134	Texas Instruments	MASK ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC	NO		TTL	THROUGH-HOLE			80 mA	32 words	5	5	8	IN-LINE	DIP16,.3		MASK ROMs	2.54 mm	125 Cel		32X8	32	-55 Cel		DUAL	R-XDIP-T16					Not Qualified					NOT SPECIFIED	NOT SPECIFIED			45 ns
LC3101(DIP42S)	Onsemi	MASK ROM	OTHER	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			2 mA		5	5		IN-LINE, SHRINK PITCH	SDIP42,.6		MASK ROMs	1.78 mm	70 Cel				-30 Cel		DUAL	R-PDIP-T42					Not Qualified	131072 bit								25600 ns
LC3101(DIP42)	Onsemi	MASK ROM	OTHER	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			2 mA		5	5		IN-LINE	DIP42,.6		MASK ROMs	2.54 mm	70 Cel				-30 Cel		DUAL	R-PDIP-T42					Not Qualified	131072 bit								25600 ns
M2364B1	STMicroelectronics	MASK ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			80 mA	8192 words	5	5	8	IN-LINE	DIP24,.6		MASK ROMs	2.54 mm	70 Cel		8KX8	8K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified	65536 bit			e0					250 ns
M23C2001B1	STMicroelectronics	MASK ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words	5		8	IN-LINE				2.54 mm	70 Cel	3-STATE	256KX8	256K	0 Cel		DUAL	R-PDIP-T32		5.5 V		15.24 mm	Not Qualified	2097152 bit	4.5 V	AUTOMATIC POWER-DOWN						120 ns
M23C1001B1	STMicroelectronics	MASK ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	131072 words	5	5	8	IN-LINE	DIP32,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	DUAL	R-PDIP-T32		5.5 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V	AUTOMATIC POWER-DOWN	e0			.00002 Amp	41.91 mm	100 ns
M23C512B1	STMicroelectronics	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	65536 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.5 V	AUTOMATIC POWER-DOWN	e0			.00002 Amp	37.085 mm	100 ns
M23C4001B1	STMicroelectronics	MASK ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words	5		8	IN-LINE				2.54 mm	70 Cel	3-STATE	512KX8	512K	0 Cel		DUAL	R-PDIP-T32		5.5 V		15.24 mm	Not Qualified	4194304 bit	4.5 V	AUTOMATIC POWER-DOWN						120 ns
M23C1000B1	STMicroelectronics	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	131072 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V	AUTOMATIC POWER-DOWN	e0			.00002 Amp	37.085 mm	100 ns
M2316HB1	STMicroelectronics	MASK ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			70 mA	2048 words			8	IN-LINE	DIP24,.6		MASK ROMs	2.54 mm	70 Cel		2KX8	2K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified	16384 bit			e0					300 ns
M23C4000B1	STMicroelectronics	MASK ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words	5		8	IN-LINE		16		2.54 mm	70 Cel	3-STATE	512KX8	512K	0 Cel		DUAL	R-PDIP-T40		5.5 V		15.24 mm	Not Qualified	4194304 bit	4.5 V	AUTOMATIC POWER-DOWN					52.18 mm	120 ns
M2365B1	STMicroelectronics	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			70 mA	8192 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel		8KX8	8K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	65536 bit			e0					250 ns
S19FL128PMF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			22 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	3				Not Qualified	134217728 bit			e3	40	260	.0002 Amp
S19FL128PNF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	NO LEAD			22 mA			3/3.3		SMALL OUTLINE	SOLCC8,.3		MASK ROMs	1.27 mm	85 Cel				-40 Cel	MATTE TIN	DUAL	R-PDSO-N8	3				Not Qualified	134217728 bit			e3	40	260	.0002 Amp
AM27X512-70JC	Infineon Technologies	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V			Not Qualified	524288 bit	4.5 V		e0			.0001 Amp		70 ns
S19FL064AMF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.00005 Amp
S19FL064PMF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.0002 Amp
S19FL128PNF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	NO LEAD			22 mA			3/3.3		SMALL OUTLINE	SOLCC8,.3		MASK ROMs	1.27 mm	85 Cel				-40 Cel	MATTE TIN	DUAL	R-PDSO-N8	3				Not Qualified	134217728 bit			e3	40	260	.0002 Amp
S19FL128PMF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			22 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	3				Not Qualified	134217728 bit			e3	40	260	.0002 Amp
S19FL064AMA0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.00005 Amp
S19FL064AMA0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.00005 Amp
AM27X512-70PC	Infineon Technologies	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V			Not Qualified	524288 bit	4.5 V		e0			.0001 Amp		70 ns
AM27X512-70PI	Infineon Technologies	MASK ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V			Not Qualified	524288 bit	4.5 V		e0			.0001 Amp		70 ns
S19FL064PMF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.0002 Amp
S19FL032PMF1XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP8,.3		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G8					Not Qualified	33554432 bit						.0002 Amp
S19FL032AMF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.00005 Amp
S19FL032AMA0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.00005 Amp
S19FL032PMF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.0002 Amp
S19FL032AMA0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.00005 Amp
S19FL064AMF0XXX01	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	67108864 bit						.00005 Amp
AM27X512-70JI	Infineon Technologies	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V			Not Qualified	524288 bit	4.5 V		e0			.0001 Amp		70 ns
S19FL032PMF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.0002 Amp
S19FL032AMF0XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			19 mA			3/3.3		SMALL OUTLINE	SOP16,.4		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G16					Not Qualified	33554432 bit						.00005 Amp
S19FL032PMF1XXX03	Infineon Technologies	MASK ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			38 mA			3/3.3		SMALL OUTLINE	SOP8,.3		MASK ROMs	1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G8					Not Qualified	33554432 bit						.0002 Amp
TC53257P	Toshiba	MASK ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			40 mA	32768 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	85 Cel		32KX8	32K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	262144 bit			e0					200 ns
TC538200F(TP2)	Toshiba	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	5		8	SMALL OUTLINE		16		1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	8388608 bit	4.5 V		e0				28.2 mm	200 ns
TC538200AF	Toshiba	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	5		8	SMALL OUTLINE				1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	8388608 bit	4.5 V		e0				28.2 mm	150 ns
TC538000F-20	Toshiba	MASK ROM	COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	1048576 words	5	5	8	SMALL OUTLINE	SOP32,.56		MASK ROMs	1.27 mm	70 Cel		1MX8	1M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					Not Qualified	8388608 bit			e0			.0001 Amp		200 ns
TC534000P	Toshiba	MASK ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words	5		8	IN-LINE				2.54 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T32		5.5 V	4.8 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0				42 mm	250 ns
TC5316210BFT	Toshiba	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		2097152 words	5		8	SMALL OUTLINE, THIN PROFILE		16		.8 mm	70 Cel		2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	1.2 mm	10.16 mm	Not Qualified	16777216 bit	4.5 V		e0				18.41 mm	150 ns
TC5332201AP	Toshiba	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		4194304 words	5		8	IN-LINE				2.54 mm	70 Cel		4MX8	4M	-10 Cel	TIN LEAD	DUAL	R-PDIP-T42		5.5 V	4.8 mm	15.24 mm	Not Qualified	33554432 bit	4.5 V	TTL COMPATIBLE I/O	e0				53.2 mm	120 ns
TC5316210BF	Toshiba	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		2097152 words	5		8	SMALL OUTLINE		16		1.27 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	16777216 bit	4.5 V		e0				28.2 mm	150 ns
T6772FP	Toshiba	MASK ROM	COMMERCIAL	43	QFF	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	FLAT								FLATPACK	QFL43,.55X.8,40		MASK ROMs	1 mm	55 Cel				-10 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQFP-F43					Not Qualified	65536 bit			e0
TC531024F-12(TP1)	Toshiba	MASK ROM	COMMERCIAL	40	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		65536 words	5		16	SMALL OUTLINE				1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40		5.25 V	2.8 mm	10.7 mm	Not Qualified	1048576 bit	4.75 V		e0					120 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.