24 Other Function Memory ICs 267

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
S70KL1281DABHI020	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		16777216 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		16MX8	16M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		134217728 bit	2.7 V						8 mm
S70KL1281DABHI023	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		16777216 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		16MX8	16M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		134217728 bit	2.7 V						8 mm
S27KL0641DABHI020	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		8388608 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		67108864 bit	2.7 V						8 mm
S27KL0641DABHB020	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	SYNCHRONOUS		8388608 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	105 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		67108864 bit	2.7 V						8 mm
S27KL0641DABHV023	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		8388608 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	105 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		67108864 bit	2.7 V						8 mm
S27KS0641DPBHI023	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		8388608 words		1.8		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	1.95 V	1 mm	6 mm		67108864 bit	1.7 V						8 mm
S70KS1281DPBHI020	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		16777216 words		1.8		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		16MX8	16M	-40 Cel		BOTTOM	R-PBGA-B24	3	1.95 V	1 mm	6 mm		134217728 bit	1.7 V						8 mm
S27KS0641DPBHV023	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		8388608 words		1.8		8	GRID ARRAY, VERY THIN PROFILE			1 mm	105 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	1.95 V	1 mm	6 mm		67108864 bit	1.7 V						8 mm
MR10Q010CMB	Everspin Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	LBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		131072 words		3.3		8	GRID ARRAY, LOW PROFILE			1 mm	85 Cel		128KX8	128K	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1.35 mm	6 mm		1048576 bit	3 V						8 mm
S27KS0641DPBHI020	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		8388608 words		1.8		8	GRID ARRAY, VERY THIN PROFILE			1 mm	85 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	1.95 V	1 mm	6 mm		67108864 bit	1.7 V						8 mm
D2758	Intel	OTP ROM	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24					Not Qualified	8192 bit			e0					450 ns
S27KL0641DABHB023	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	SYNCHRONOUS		8388608 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	105 Cel		8MX8	8M	-40 Cel		BOTTOM	R-PBGA-B24	3	3.6 V	1 mm	6 mm		67108864 bit	2.7 V						8 mm
S71KL512SC0BHV003	Infineon Technologies	MEMORY CIRCUIT	INDUSTRIAL	24	VBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SYNCHRONOUS		67108864 words		3		8	GRID ARRAY, VERY THIN PROFILE			1 mm	105 Cel		64MX8	64M	-40 Cel		BOTTOM	R-PBGA-B24	3		1 mm	6 mm		536870912 bit		HYPER RAM IS ORGANISED AS 8MX8					8 mm
MT42C4064Z-15	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	24	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		THROUGH-HOLE		60 mA	65536 words		5	5	4	IN-LINE	ZIP24,.1	Other Memory ICs	1.27 mm	70 Cel		64KX4	64K	0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T24					Not Qualified	262144 bit			e0			.004 Amp		150 ns
C1702A	Intel		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			256 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	256X8	256	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24					Not Qualified	2048 bit			e0					1000 ns
TMS2150-5JDL	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		145 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		55 ns
SN74ALS871N3	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE								IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel				0 Cel		DUAL	R-PDIP-T24
TMS2501NC	Texas Instruments	MEMORY CIRCUIT	OTHER	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		MOS		THROUGH-HOLE								IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	85 Cel				-25 Cel		DUAL	R-PDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED
TMS2150-35DW	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		MOS		GULL WING		145 mA	512 words		5	5	9	SMALL OUTLINE	SOP24,.4	SRAMs	1.27 mm	70 Cel		512X9	512	0 Cel		DUAL	R-PDSO-G24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		35 ns
NMC27C16Q-55	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		CMOS		THROUGH-HOLE			2048 words	COMMON	5	5	8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	2KX8	2K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24					Not Qualified	16384 bit			e0					550 ns
TMS2508-25JL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								250 ns
TMS2758JDL-0	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								450 ns
SMJ27L08-45JM	Texas Instruments	OTP ROM	MILITARY	24	DIP		RECTANGULAR	CERAMIC	NO		MOS	38535Q/M;38534H;883B	THROUGH-HOLE			1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								450 ns
TMS2150-55DW	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		MOS		GULL WING		135 mA	512 words		5	5	9	SMALL OUTLINE	SOP24,.4	SRAMs	1.27 mm	70 Cel		512X9	512	0 Cel		DUAL	R-PDSO-G24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.135 Amp		55 ns
SN74AS870JT4	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE								IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				0 Cel		DUAL	R-XDIP-T24
TMS2716-30JDL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			2048 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	2KX8	2K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	16384 bit								300 ns
TMS2716JL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			2048 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	2KX8	2K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED			450 ns
TMS2501JC	Texas Instruments	MEMORY CIRCUIT	OTHER	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE								IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	85 Cel				-25 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED
SN74ALS871NP3	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE								IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel				0 Cel		DUAL	R-PDIP-T24
TMS2708-45JDL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								450 ns
SN74AS870NTP1	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE								IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				0 Cel		DUAL	R-PDIP-T24					Not Qualified
TMS2758-JL0	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								450 ns
TMS4025NC	Texas Instruments		OTHER	24	DIP	1024	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		THROUGH-HOLE			1024 words	SEPARATE			2	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	OPEN-DRAIN	1KX2	1K	-25 Cel		DUAL	R-PDIP-T24					Not Qualified	2048 bit
SN74AS870DW3	Texas Instruments		COMMERCIAL	24	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		TTL		GULL WING								SMALL OUTLINE	SOP24,.4	Other Memory ICs	1.27 mm	70 Cel				0 Cel		DUAL	R-PDSO-G24
TMS4020NC	Texas Instruments		OTHER	24	DIP	1024	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		THROUGH-HOLE			1024 words	SEPARATE			2	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	OPEN-DRAIN	1KX2	1K	-25 Cel		DUAL	R-PDIP-T24					Not Qualified	2048 bit
TMS27L08-45JDL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								450 ns
SNJ54ALS871JD	Texas Instruments		MILITARY	24	DIP		RECTANGULAR	CERAMIC	NO		TTL	38535Q/M;38534H;883B	THROUGH-HOLE								IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel				-55 Cel		DUAL	R-XDIP-T24					Not Qualified
5962-01-346-4015	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		135 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.135 Amp		45 ns
SN74AS870DWP3	Texas Instruments		COMMERCIAL	24	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		TTL		GULL WING								SMALL OUTLINE	SOP24,.4	Other Memory ICs	1.27 mm	70 Cel				0 Cel		DUAL	R-PDSO-G24
TMS2150-4JL	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		145 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		45 ns
SN74AS870JTP4	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE								IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				0 Cel		DUAL	R-XDIP-T24
TMS2150-7JL	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		145 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		70 ns
TMS2150-9JL	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		145 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		90 ns
TMS4023NC	Texas Instruments		OTHER	24	DIP	32	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		THROUGH-HOLE			1024 words	COMMON			1	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX1	1K	-25 Cel		DUAL	R-PDIP-T24					Not Qualified	1024 bit
TMS2716-30JL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			2048 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	2KX8	2K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED			300 ns
TMS2150-4JDL	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE		145 mA	512 words		5	5	9	IN-LINE	DIP24,.3	SRAMs	2.54 mm	70 Cel		512X9	512	0 Cel		DUAL	R-XDIP-T24					Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.145 Amp		45 ns
SM4461-15JDS	Texas Instruments	VIDEO DRAM	OTHER	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			65536 words		5	5	4	IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	110 Cel		64KX4	64K	-55 Cel		DUAL	R-XDIP-T24					Not Qualified	262144 bit								150 ns
TMS2708-35JL	Texas Instruments		COMMERCIAL	24	DIP		RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24					Not Qualified	8192 bit								350 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.