RECTANGULAR Other Function Memory ICs 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

DS1207-G2C

Analog Devices

MEMORY CIRCUIT

COMMERCIAL

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SYNCHRONOUS

SPECIAL SHAPE

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSSS-X

Not Qualified

e0

DS1653

Analog Devices

MEMORY CIRCUIT

COMMERCIAL

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

5

5

IN-LINE

DIP16,.3

Other Memory ICs

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T16

Not Qualified

e0

DS1652SB

Analog Devices

MEMORY CIRCUIT

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

ASYNCHRONOUS

64 words

5

1

SMALL OUTLINE

1.27 mm

85 Cel

64X1

64

-25 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

5.5 V

2.13 mm

5.285 mm

Not Qualified

64 bit

2.7 V

e0

5.31 mm

DS1207-G1C

Analog Devices

MEMORY CIRCUIT

COMMERCIAL

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SYNCHRONOUS

SPECIAL SHAPE

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSSS-X

Not Qualified

e0

DS1250S

Analog Devices

COMMERCIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

10 mA

5

5

SMALL OUTLINE

SOP16,.4

Other Memory ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

Not Qualified

e0

DS1207-G3C

Analog Devices

MEMORY CIRCUIT

COMMERCIAL

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SYNCHRONOUS

SPECIAL SHAPE

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSSS-X

Not Qualified

e0

DS1652B

Analog Devices

MEMORY CIRCUIT

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

5

5

IN-LINE

DIP8,.3

Other Memory ICs

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T8

Not Qualified

e0

DS2401X-S+T

Analog Devices

MEMORY CIRCUIT

INDUSTRIAL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

64 words

5

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA4,2X2,28/12

.3 mm

85 Cel

64X1

64

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B4

1

6 V

.5 mm

.678 mm

64 bit

2.8 V

e2

30

260

1.338 mm

DS2422P/T&R

Analog Devices

MEMORY CIRCUIT

INDUSTRIAL

6

LSOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

MOS

C BEND

ASYNCHRONOUS

1024 words

5

1

SMALL OUTLINE, LOW PROFILE

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

ALSO CONTAINS 64 BIT LASERED ROM

e0

3.94 mm

LC331632ML-70

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

100 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.0001 Amp

70 ns

LC331632M-12

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

65 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.002 Amp

120 ns

LC331632ML-10

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

75 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.0001 Amp

100 ns

N36RW02DTPT3G

Onsemi

MEMORY CIRCUIT

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

GULL WING

64 words

32

SMALL OUTLINE

SOP8,.25

1.27 mm

105 Cel

64X32

64

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

10 V

1.75 mm

3.9 mm

2048 bit

1.8 V

4.9 mm

LC331632M-70

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

100 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.002 Amp

70 ns

N36RW02DWPT3G

Onsemi

MEMORY CIRCUIT

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

GULL WING

64 words

32

SMALL OUTLINE

SOP8,.25

1.27 mm

105 Cel

64X32

64

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

10 V

1.75 mm

3.9 mm

2048 bit

1.8 V

4.9 mm

LC331632M-10

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

75 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.002 Amp

100 ns

LC331632M-80

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

90 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.002 Amp

80 ns

LC331632ML-80

Onsemi

COMMERCIAL

40

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

90 mA

32768 words

COMMON

5

5

16

SMALL OUTLINE

SOP40,.56

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32KX16

32K

0 Cel

DUAL

R-PDSO-G40

Not Qualified

524288 bit

.0001 Amp

80 ns

NAND256R4M2CZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NAND01GR3M3BZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36W832TE85ZA1S

STMicroelectronics

MEMORY CIRCUIT

COMMERCIAL

66

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

2MX16

2M

0 Cel

BOTTOM

R-PBGA-B66

3.6 V

1.4 mm

8 mm

Not Qualified

33554432 bit

2.7 V

SRAM IS ORGANISED AS 512K X 16

12 mm

NAND01GW3M2CZB5F

STMicroelectronics

MEMORY CIRCUIT

COMMERCIAL EXTENDED

137

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

134217728 words

3

FLASH+SDRAM

3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

128MX8

128M

-30 Cel

BOTTOM

R-PBGA-B137

3.6 V

1.2 mm

10.5 mm

Not Qualified

1073741824 bit

2.5 V

LPSDRAM IS ORGANISED AS 16M X 32

40

260

13 mm

NAND256R3M0AZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

NAND01GR4M3CZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36W108AB120ZM5

STMicroelectronics

MEMORY CIRCUIT

OTHER

48

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

100 mA

1048576 words

FLASH+SRAM

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA48,6X8,40

Other Memory ICs

1 mm

85 Cel

1MX8

1M

-20 Cel

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B48

3.6 V

1.35 mm

9.8 mm

Not Qualified

8388608 bit

2.7 V

ALSO CONTAINS 128K X 8 SRAM

e1

.00002 Amp

11.8 mm

120 ns

M76DW52003BA70Z

STMicroelectronics

MEMORY CIRCUIT

INDUSTRIAL

73

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

20 mA

2097152 words

3

FLASH+SRAM

3,3/3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA73,10X12,32

Other Memory ICs

.8 mm

85 Cel

2MX16

2M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B73

3.6 V

1.4 mm

8 mm

Not Qualified

33554432 bit

2.7 V

STATIC RAM IS ORGANIZED AS 256K X 16; FLASH MEMORY IS ALSO ORGANIZED AS 4M X 8

e0

.0001 Amp

11.6 mm

70 ns

NAND512R4M4CZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M39432-20VNC1

STMicroelectronics

MEMORY CIRCUIT

COMMERCIAL

40

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

20 mA

3.3

EEPROM+FLASH

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP40,.8,20

Other Memory ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G40

Not Qualified

e0

.000002 Amp

200 ns

NAND256R3M4AZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NAND256W4M0BZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

NAND256W4M2BZB5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NAND512W4M4BZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36DR432B120ZA6C

STMicroelectronics

MEMORY CIRCUIT

INDUSTRIAL

66

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

40 mA

2097152 words

FLASH+SRAM

1.8/2

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA66,8X12,32

Other Memory ICs

.8 mm

85 Cel

2MX16

2M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B66

2.2 V

1.4 mm

8 mm

Not Qualified

33554432 bit

1.65 V

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

e0

12 mm

120 ns

NAND512R4M5CZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36W108B100ZM6T

STMicroelectronics

MEMORY CIRCUIT

INDUSTRIAL

48

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

1048576 words

8

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

1MX8

1M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.35 mm

9.8 mm

Not Qualified

8388608 bit

2.7 V

ALSO CONTAINS 128K X 8 SRAM

11.8 mm

M36W108AT100ZN5T

STMicroelectronics

MEMORY CIRCUIT

OTHER

48

VLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BUTT

ASYNCHRONOUS

40 mA

1048576 words

FLASH+SRAM

3/3.3

8

GRID ARRAY, VERY THIN PROFILE

LGA48,6X8,40

Other Memory ICs

1 mm

85 Cel

1MX8

1M

-20 Cel

TIN LEAD

BOTTOM

R-PBGA-B48

3.6 V

1 mm

9.8 mm

Not Qualified

8388608 bit

2.7 V

ALSO CONTAINS 128K X 8 SRAM

e0

11.8 mm

100 ns

NAND01GW3M3BZB5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36L0T7050B0ZAQF

STMicroelectronics

MEMORY CIRCUIT

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

30 mA

8388608 words

FLASH+PSRAM

1.8,3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 2M X 16

e1

.000005 Amp

10 mm

90 ns

NAND256W3M5BZB5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NAND256R4M2AZB5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NAND512R4M3CZBF

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX8

64M

-30 Cel

BOTTOM

R-PBGA-B149

1.95 V

1.2 mm

10 mm

Not Qualified

536870912 bit

1.7 V

40

260

13.5 mm

NAND256W3M0CZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

NAND512R3M5BZB5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NAND256R3M0CZB5F

STMicroelectronics

MEMORY CIRCUIT

COMMERCIAL EXTENDED

107

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

33554432 words

1.8

FLASH+SDRAM

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

32MX8

32M

-30 Cel

BOTTOM

R-PBGA-B107

1.95 V

1.2 mm

10.5 mm

Not Qualified

268435456 bit

1.7 V

LPSDRAM IS ORGANISED AS 16M X 16

40

260

13 mm

NAND01GW4M4AZB5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NAND256R4M0AZB5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

M36L0R7060T1ZAQE

STMicroelectronics

MEMORY CIRCUIT

COMMERCIAL EXTENDED

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 4M X 16

40

260

10 mm

M76DW62000A70ZT

STMicroelectronics

MEMORY CIRCUIT

INDUSTRIAL

73

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

20 mA

4194304 words

3

FLASH+SRAM

3,3/3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA73,10X12,32

Other Memory ICs

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B73

3.6 V

1.4 mm

8 mm

Not Qualified

67108864 bit

2.7 V

STATIC RAM IS ORGANIZED AS 512K X 16; FLASH MEMORY IS ALSO ORGANIZED AS 8M X 8

.0001 Amp

11.6 mm

70 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.