CONFIGURATION MEMORY OTP ROM 46

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Technology	Screening Level	Terminal Form	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Clock Frequency (fCLK)	Qualification	Memory Density	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Programming Voltage (V)
XC1718-PC20C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND		18144 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	18144X1	18144	0 Cel	TIN LEAD	QUAD	S-PQCC-J20	3	5 MHz	Not Qualified		e0	30	225		15
XC1764-CD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	65536 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX1	64K	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0005 Amp
XC1765L-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	65536 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0015 Amp
XC17128D-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	131072 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX1	128K	-40 Cel		DUAL	R-XDIP-T8		12.5 MHz	Not Qualified	131072 bit				.00005 Amp
XC17128L-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	131072 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX1	128K	-40 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	131072 bit				.00005 Amp
XC1718L-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	18144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	18144X1	18144	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0015 Amp
XC1718L-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	18144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	18144X1	18144	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0015 Amp
XC17256L-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	262144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX1	256K	-40 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	262144 bit				.00005 Amp
XC1765ELPC2OC	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	5 mA	65536 words	COMMON	3.3	3.3	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel		QUAD	S-PQCC-J20		2.5 MHz	Not Qualified	65536 bit				.00005 Amp
XC17128L-SO8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	5 mA	131072 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX1	128K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	10 MHz	Not Qualified	131072 bit	e0	30	225	.00005 Amp
XC17256D-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	262144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX1	256K	-40 Cel		DUAL	R-XDIP-T8		12 MHz	Not Qualified	262144 bit				.00005 Amp
XC1765EPC2OC	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel		QUAD	S-PQCC-J20		10 MHz	Not Qualified	65536 bit				.00005 Amp
XC17128L-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	131072 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	128KX1	128K	-55 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	131072 bit				.00005 Amp
XC17256L-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	262144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	256KX1	256K	-55 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	262144 bit				.00005 Amp
XC17128D-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	10 mA	131072 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	128KX1	128K	-55 Cel		DUAL	R-XDIP-T8		12.5 MHz	Not Qualified	131072 bit				.00005 Amp
XC17256L-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	5 mA	262144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	256KX1	256K	-55 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	262144 bit				.00005 Amp
XC17256D-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	10 mA	262144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	256KX1	256K	-55 Cel		DUAL	R-XDIP-T8		12 MHz	Not Qualified	262144 bit				.00005 Amp
XC17128L-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	5 mA	131072 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	128KX1	128K	-55 Cel		DUAL	R-XDIP-T8		10 MHz	Not Qualified	131072 bit				.00005 Amp
XC1765D-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	65536 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0015 Amp
XC1765ELPC2OI	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	5 mA	65536 words	COMMON	3.3	3.3	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		QUAD	S-PQCC-J20		2.5 MHz	Not Qualified	65536 bit				.00005 Amp
XC1736A-PC20I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	10 mA	36288 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	3	2.5 MHz	Not Qualified		e0	30	225	.0005 Amp	15
XC1736-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	36288X1	36288	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0005 Amp	21
XC1736-CD8C	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0005 Amp	21
XC1718D-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	18144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	18144X1	18144	-40 Cel		DUAL	R-XDIP-T8		5 MHz	Not Qualified					.0015 Amp
XC1736D-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	36288X1	36288	-55 Cel		DUAL	R-XDIP-T8		5 MHz	Not Qualified					.0015 Amp
XC17256D-SO8C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	10 mA	262144 words	COMMON	5	5	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX1	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	12 MHz	Not Qualified	262144 bit	e0	30	225	.00005 Amp
XC1764-CD8C	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	65536 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0005 Amp
XC1765EPC2OI	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		QUAD	S-PQCC-J20		10 MHz	Not Qualified	65536 bit				.00005 Amp
XC17128D-SO8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	10 mA	131072 words	COMMON	5	5	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX1	128K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	12.5 MHz	Not Qualified	131072 bit	e0	30	225	.00005 Amp
XC1718D-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	10 mA	18144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	18144X1	18144	-55 Cel		DUAL	R-XDIP-T8		5 MHz	Not Qualified					.0015 Amp
XC17256L-SO8C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	5 mA	262144 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX1	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	10 MHz	Not Qualified	262144 bit	e0	30	225	.00005 Amp
XC1718-PD8C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS		THROUGH-HOLE		18144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	70 Cel	3-STATE	18144X1	18144	0 Cel	TIN LEAD	DUAL	R-PDIP-T8	1	5 MHz	Not Qualified		e0	30	225		15
XC1764-PD8C	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS		THROUGH-HOLE	10 mA	65536 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T8	1	2.5 MHz	Not Qualified	65536 bit	e0	30	225	.0005 Amp
XC1764-PC20I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	3	2.5 MHz	Not Qualified	65536 bit	e0	30	225	.0005 Amp
XC1718D-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	18144 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	18144X1	18144	-55 Cel		DUAL	R-XDIP-T8		5 MHz	Not Qualified					.0015 Amp
XC1736D-DD8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel		DUAL	R-XDIP-T8		5 MHz	Not Qualified					.0015 Amp
XC1718L-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	5 mA	18144 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	18144X1	18144	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0015 Amp
XC1765L-DD8R	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE	5 mA	65536 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX1	64K	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0015 Amp
XC1764-PC20C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	CMOS		J BEND	10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J20	3	2.5 MHz	Not Qualified	65536 bit	e0	30	225	.0005 Amp
XC1765L-DD8M	Xilinx	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	5 mA	65536 words	COMMON	3.3	3.3	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX1	64K	-55 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified	65536 bit				.0015 Amp
XC17128L-SO8C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	5 mA	131072 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX1	128K	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	10 MHz	Not Qualified	131072 bit	e0	30	225	.00005 Amp
XC17256L-SO8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	5 mA	262144 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX1	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	10 MHz	Not Qualified	262144 bit	e0	30	225	.00005 Amp
XC17128D-SO8C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	10 mA	131072 words	COMMON	5	5	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX1	128K	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	12.5 MHz	Not Qualified	131072 bit	e0	30	225	.00005 Amp
XC17256D-SO8I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS		GULL WING	10 mA	262144 words	COMMON	5	5	1	SMALL OUTLINE	SOP8,.25	OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX1	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	3	12 MHz	Not Qualified	262144 bit	e0	30	225	.00005 Amp
XC1736A-CD8C	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE	10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel		DUAL	R-XDIP-T8		2.5 MHz	Not Qualified					.0005 Amp	15
EPC1213DM883B	Altera	CONFIGURATION MEMORY	MILITARY	8	DIP	RECTANGULAR	CERAMIC	NO	CMOS	38535Q/M;38534H;883B	THROUGH-HOLE		212942 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs	2.54 mm	125 Cel	3-STATE	212942X1	212942	-55 Cel	TIN LEAD	DUAL	R-XDIP-T8		6 MHz	Not Qualified		e0		220

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.